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    • 1. 发明授权
    • Method and apparatus for controlling liquid metal flow
    • 控制液体金属流动的方法和装置
    • US4824329A
    • 1989-04-25
    • US875680
    • 1986-06-18
    • Hajime YamamotoTadashi GotouMasanori YamakawaNoboru NakaoTakashi Ikeda
    • Hajime YamamotoTadashi GotouMasanori YamakawaNoboru NakaoTakashi Ikeda
    • G21C15/247H02K44/04H02K44/08H02K44/00
    • G21C15/247H02K44/04H02K44/085Y02E30/35
    • A method comprising the steps of: allowing the directions of a magnetic field, an electric current and the liquid metal flow to perpendicularly intersect to one another; and varying at least one of the magnetic field and the electric current in intensity in response to the temperature of the liquid metal. A force acting on the liquid metal flow is increased and decreased by the interaction between the magnetic field and the electric current. An apparatus for performing the method comprising material varying in electric property with the temperature of the liquid metal. The material is installed in at least one of a path of the magnetic field, a path of the electric current and means for generating the magnetic field. Variation of the electric property of the material allows one of the magnetic field and the electric current to be automatically increased or decreased in intensity in response to the temperature of the liquid metal, so that the force acting on the liquid metal flow is controlled.
    • 一种方法,包括以下步骤:允许磁场,电流和液态金属流的方向彼此垂直相交; 并且响应于液态金属的温度而改变强度中的至少一个磁场和电流。 通过磁场和电流之间的相互作用,作用在液态金属流上的力增加和减小。 一种用于执行包括随着液态金属的温度变化的电性能的材料的方法的装置。 材料安装在磁场的路径,电流的路径和用于产生磁场的装置中的至少一个中。 材料的电性能的变化允许响应于液态金属的温度而使磁场和电流中的一个强度自动增加或降低,从而控制作用在液态金属流上的力。
    • 5. 发明授权
    • Refrigeration apparatus
    • 制冷装置
    • US09429347B2
    • 2016-08-30
    • US14117667
    • 2011-08-04
    • Takeshi SugimotoTetsuya YamashitaTakashi Ikeda
    • Takeshi SugimotoTetsuya YamashitaTakashi Ikeda
    • F25B49/02F25B7/00F25B6/04F25B9/00
    • F25B49/022F25B6/04F25B7/00F25B9/008F25B2400/121F25B2600/0253F25B2600/0272F25B2700/1933Y02B30/741
    • A refrigeration apparatus includes a high-temperature side circulation circuit, a low-temperature side circulation circuit, a cascade capacitor, and control means. The high-temperature side circulation circuit forms a refrigerant circuit in which a high-temperature side compressor, a high-temperature side condenser, a high-temperature side expansion device, and a high-temperature side evaporator are connected by a pipe. The refrigerant circuit allows a high-temperature side refrigerant to circulate therethrough. The high-temperature side refrigerant has a carbon-carbon double bond in its molecular structure. The high-temperature side compressor has a variable discharge capacity and is configured to discharge the high-temperature side refrigerant. The low-temperature side circulation circuit forms a refrigerant circuit in which a low-temperature side compressor, a low-temperature side condenser, a low-temperature side expansion device, and a low-temperature side evaporator are connected by a pipe. The refrigerant circuit allows a low-temperature side refrigerant to circulate therethrough. The low-temperature side refrigerant contains carbon dioxide.
    • 制冷装置包括高温侧循环回路,低温侧循环回路,级联电容器和控制单元。 高温侧循环回路形成高温侧压缩机,高温侧冷凝器,高温侧膨胀装置和高温侧蒸发器通过管连接的制冷剂回路。 制冷剂回路允许高温侧制冷剂在其中循环。 高温侧制冷剂在其分子结构中具有碳 - 碳双键。 高温侧压缩机具有可变放电容量,并且被配置为排出高温侧制冷剂。 低温侧循环回路形成低温侧压缩机,低温侧冷凝器,低温侧膨胀装置和低温侧蒸发器通过管连接的制冷剂回路。 制冷剂回路允许低温侧制冷剂在其中循环。 低温侧制冷剂含有二氧化碳。