专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07202156B2 Process for manufacturing a wiring substrate 有权
标题翻译：制造布线基板的工艺
公开(公告)号：US07202156B2
公开(公告)日：2007-04-10
申请号：US10989515
申请日：2004-11-17
申请人： Hajime Saiki , Atsuhiko Sugimoto , Mikiya Sakurai
发明人： Hajime Saiki , Atsuhiko Sugimoto , Mikiya Sakurai
IPC分类号： H01L21/4763
CPC分类号： H05K3/4661 , H05K3/108 , H05K3/181 , H05K3/4602 , H05K2201/0209
摘要： A process for manufacturing a wiring substrate, comprising: a step of forming an insulating resin layer containing an inorganic filler over a wiring layer formed on at least one surface of an insulating substrate; a step of forming a thin copper film layer by roughening a surface of the insulating resin layer and plating the same electrolessly with copper; a step of forming an insulating film over the thin copper film layer; a step of forming plated resists profiling a pattern by exposing and developing the insulating film with the pattern; and a step of forming wiring pattern layers by an electrolytic copper plating on a surface of the insulating resin layer having the plated resists formed thereon, wherein at least one of the plated resists has a width of less than 20 μm, and the plated resists include adjoining plated resists in which a clearance between said adjoining plated resists has a width of less than 20 μm.
摘要翻译：一种布线基板的制造方法，包括：在绝缘基板的至少一个面上形成的布线层上形成含有无机填料的绝缘树脂层的工序; 通过使绝缘树脂层的表面粗糙化并用铜电化而使其形成薄铜膜层的步骤; 在所述薄铜膜层上形成绝缘膜的步骤; 通过用图案曝光和显影绝缘膜来形成电镀抗蚀剂的步骤; 以及在其上形成有电镀抗蚀剂的绝缘树脂层的表面上通过电解铜电镀形成布线图案层的步骤，其中至少一个电镀抗蚀剂具有小于20μm的宽度，并且电镀抗蚀剂包括邻接的电镀抗蚀剂，其中所述相邻的电镀抗蚀剂之间的间隙具有小于20μm的宽度。

2. 发明申请

US20050106854A1 Process for manufacturing a wiring substrate 有权
标题翻译：制造布线基板的工艺
公开(公告)号：US20050106854A1
公开(公告)日：2005-05-19
申请号：US10989515
申请日：2004-11-17
申请人： Hajime Saiki , Atsuhiko Sugimoto , Mikiya Sakurai
发明人： Hajime Saiki , Atsuhiko Sugimoto , Mikiya Sakurai
IPC分类号： H05K3/18 , H05K3/10 , H05K3/46 , H05K1/11 , H01L21/4763 , H01R12/04
CPC分类号： H05K3/4661 , H05K3/108 , H05K3/181 , H05K3/4602 , H05K2201/0209
摘要： A process for manufacturing a wiring substrate, comprising: a step of forming an insulating resin layer containing an inorganic filler over a wiring layer formed on at least one surface of an insulating substrate; a step of forming a thin copper film layer by roughening a surface of the insulating resin layer and plating the same electrolessly with copper; a step of forming an insulating film over the thin copper film layer; a step of forming plated resists profiling a pattern by exposing and developing the insulating film with the pattern; and a step of forming wiring pattern layers by an electrolytic copper plating on a surface of the insulating resin layer having the plated resists formed thereon, wherein at least one of the plated resists has a width of less than 20 μm, and -the plated resists include adjoining plated resists in which a clearance between said adjoining plated resists has a width of less than 20 μm.
摘要翻译：一种布线基板的制造方法，包括：在绝缘基板的至少一个面上形成的布线层上形成含有无机填料的绝缘树脂层的工序; 通过使绝缘树脂层的表面粗糙化并用铜电化而使其形成薄铜膜层的步骤; 在所述薄铜膜层上形成绝缘膜的步骤; 通过利用图案曝光和显影绝缘膜来形成电镀抗蚀剂成型图案的步骤; 以及在其上形成有电镀抗蚀剂的绝缘树脂层的表面上通过电解铜电镀形成布线图案层的步骤，其中至少一个电镀抗蚀剂具有小于20μm的宽度，并且电镀抗蚀剂包括邻接的电镀抗蚀剂，其中所述邻接的电镀抗蚀剂之间的间隙具有小于20μm的宽度。

3. 发明授权

US08319111B2 Wiring board having wiring laminate portion with via conductors embedded in resin insulating layers 有权
标题翻译：具有布线层叠部分的布线板，其中通孔导体嵌入在树脂绝缘层中
公开(公告)号：US08319111B2
公开(公告)日：2012-11-27
申请号：US11865919
申请日：2007-10-02
申请人： Hajime Saiki , Mikiya Sakurai , Atsuhiko Sugimoto
发明人： Hajime Saiki , Mikiya Sakurai , Atsuhiko Sugimoto
IPC分类号： H05K1/03
CPC分类号： H05K1/115 , H01L23/49827 , H01L23/49833 , H01L2924/0002 , H05K1/0271 , H05K1/0366 , H05K1/0373 , H05K3/4602 , H05K2201/0209 , H05K2201/068 , H05K2201/09481 , H05K2201/0959 , H05K2201/096 , H05K2201/09627 , H05K2201/09709 , H05K2203/0733 , H01L2924/00
摘要： A wiring board having a favorable electrical reliability and in which a crack is unlikely to occur at a connection interface of via conductors even though the number of via conductors in series, which constitutes the stacked via, becomes larger than that of a conventional wiring board.
摘要翻译：即使构成堆叠通孔的串联的通孔导体的数量变得比常规的布线板大，因此具有良好的电气可靠性并且在通孔导体的连接界面处不可能发生裂纹的布线板。

4. 发明申请

US20080083560A1 WIRING BOARD 有权
标题翻译：接线板
公开(公告)号：US20080083560A1
公开(公告)日：2008-04-10
申请号：US11865919
申请日：2007-10-02
申请人： Hajime Saiki , Mikiya Sakurai , Atsuhiko Sugimoto
发明人： Hajime Saiki , Mikiya Sakurai , Atsuhiko Sugimoto
IPC分类号： H05K1/03
CPC分类号： H05K1/115 , H01L23/49827 , H01L23/49833 , H01L2924/0002 , H05K1/0271 , H05K1/0366 , H05K1/0373 , H05K3/4602 , H05K2201/0209 , H05K2201/068 , H05K2201/09481 , H05K2201/0959 , H05K2201/096 , H05K2201/09627 , H05K2201/09709 , H05K2203/0733 , H01L2924/00
摘要： A wiring board having a favorable electrical reliability and in which a crack is unlikely to occur at a connection interface of via conductors even though the number of via conductors in series, which constitutes the stacked via, becomes larger than that of a conventional wiring board.
摘要翻译：即使构成堆叠通孔的串联的通孔导体的数量变得比常规的布线板大，因此具有良好的电气可靠性并且在通孔导体的连接界面处不可能发生裂纹的布线板。

5. 发明申请

US20050103520A1 Wiring substrate and manufacturing process of the same 有权
标题翻译：接线基板和制造工艺相同
公开(公告)号：US20050103520A1
公开(公告)日：2005-05-19
申请号：US10989517
申请日：2004-11-17
申请人： Hajime Saiki , Mikiya Sakurai
发明人： Hajime Saiki , Mikiya Sakurai
IPC分类号： H05K3/00 , H05K3/46 , H05K1/00
CPC分类号： H05K3/0035 , H05K3/4602 , H05K3/4661 , H05K2201/0209 , Y10T29/49156
摘要： A wiring substrate comprising: a lower insulating resin layer; wiring pattern layers provided on surfaces of the lower insulating resin layer; upper insulating resin layers provided on surfaces of the lower insulating resin layer and the wiring pattern layers; via holes extending through at least one of the upper insulating resin layers; and via conductors provided in the via holes and connected electrically with at least one of the wiring pattern layers, wherein at least one of the upper insulating resin layers contains an epoxy resin containing 30 to 50% by weigh of an inorganic filler of SiO2 having an average grain diameter of 1.0 to 10.0 μm, and at least one of the via holes has a lower end opening diameter of 40 μm or more and less than 60 μm on a side of the wiring pattern layers.
摘要翻译：一种布线基板，包括：下绝缘树脂层; 布线图案层设置在下绝缘树脂层的表面上; 设置在下绝缘树脂层和布线图案层的表面上的上绝缘树脂层; 通孔延伸穿过上绝缘树脂层中的至少一个; 以及通孔，其设置在所述通孔中，并且与至少一个所述布线图案层电连接，其中所述上绝缘树脂层中的至少一个包含含有30至50重量％的SiO

6. 发明授权

US07692103B2 Wiring substrate and manufacturing process of the same 有权
标题翻译：接线基板和制造工艺相同
公开(公告)号：US07692103B2
公开(公告)日：2010-04-06
申请号：US10989517
申请日：2004-11-17
申请人： Hajime Saiki , Mikiya Sakurai
发明人： Hajime Saiki , Mikiya Sakurai
IPC分类号： H01R12/04 , H05K1/11 , H05K3/02
CPC分类号： H05K3/0035 , H05K3/4602 , H05K3/4661 , H05K2201/0209 , Y10T29/49156
摘要： A wiring substrate includes a lower insulating resin layer; wiring pattern layers provided on surfaces of the lower insulating resin layer; upper insulating resin layers; and via holes and via conductors connected electrically with at least one of the wiring pattern layers. An upper insulating resin layer includes an epoxy resin containing 30 to 50% by weight of an inorganic filler of SiO2 having an average grain diameter of 1.0 to 10.0 μm, and a via having a lower end opening diameter of between 40 μm and 60 μm.
摘要翻译：布线基板包括下绝缘树脂层; 布线图案层设置在下绝缘树脂层的表面上; 上绝缘树脂层; 以及与至少一个布线图案层电连接的通孔和通孔导体。上部绝缘树脂层包括含有30〜50重量％的平均粒径为1.0〜10.0μm的SiO 2的无机填料的环氧树脂，以及下端开口直径为40μm〜60μm的通孔。

7. 发明申请

US20050184526A1 Generator for vehicle 失效
标题翻译：汽车发电机
公开(公告)号：US20050184526A1
公开(公告)日：2005-08-25
申请号：US11059321
申请日：2005-02-17
申请人： Mikiya Sakurai
发明人： Mikiya Sakurai
IPC分类号： H02K19/24 , F02N11/04 , G05F1/10 , H02K23/52 , H02P9/04
CPC分类号： H02K19/365
摘要： A generator for a vehicle includes a stator having an armature coil, a rotor having a field coil and a voltage regulator having a surge absorbing capacitor element and a heat sink. The heat sink dissipates heat that is transmitted to the capacitor element, so that temperature of the capacitor element can be kept low enough to prevent deterioration of the capacitor element.
摘要翻译：一种用于车辆的发电机包括具有电枢线圈的定子，具有励磁线圈的转子和具有浪涌吸收电容器元件和散热器的电压调节器。散热器散发传递到电容器元件的热量，使得电容器元件的温度可以保持足够低以防止电容器元件的劣化。

8. 发明授权

US07215049B2 Generator for vehicle 失效
标题翻译：汽车发电机
公开(公告)号：US07215049B2
公开(公告)日：2007-05-08
申请号：US11059321
申请日：2005-02-17
申请人： Mikiya Sakurai
发明人： Mikiya Sakurai
IPC分类号： H02K1/32 , H02K5/18 , H02K11/00 , H02K23/52 , H05K7/20
CPC分类号： H02K19/365
摘要： A generator for a vehicle includes a stator having an armature coil, a rotor having a field coil and a voltage regulator having a surge absorbing capacitor element and a heat sink. The heat sink dissipates heat that is transmitted to the capacitor element, so that temperature of the capacitor element can be kept low enough to prevent deterioration of the capacitor element.
摘要翻译：一种用于车辆的发电机包括具有电枢线圈的定子，具有励磁线圈的转子和具有浪涌吸收电容器元件和散热器的电压调节器。散热器散发传递到电容器元件的热量，使得电容器元件的温度可以保持足够低以防止电容器元件的劣化。

9. 发明授权

US06770999B2 Stator of vehicle ac generator 有权
标题翻译：车辆交流发电机定子
公开(公告)号：US06770999B2
公开(公告)日：2004-08-03
申请号：US10366353
申请日：2003-02-14
申请人： Mikiya Sakurai
发明人： Mikiya Sakurai
IPC分类号： H02K1700
CPC分类号： H02K3/12
摘要： In a stator of a vehicle ac generator, a stator core has plurality of slots, each of which has a rectangular cross-section and a stator winding formed of a plurality of U-shaped conductor segments made of a round wire. Each of U-shaped conductor segment has a U-shaped turn portion disposed outside the slots at an end of the stator core, a pair of in-slot portions extending from the turn portion and disposed in a pair of the slots and a pair of connection portions respectively welded to connection portions of other two U-shaped conductor segments. Only the in-slot portions are press-formed to have an approximately rectangular cross section fitted to the slots.
摘要翻译：在车辆交流发电机的定子中，定子铁芯具有多个狭槽，每个槽具有矩形横截面，以及由多个由圆形线制成的U形导体段形成的定子绕组。每个U形导体段具有设置在定子芯的端部的槽的外侧的U形转弯部分，从转弯部分延伸并设置在一对槽中的一对槽内部分和一对连接部分分别焊接到其他两个U形导体段的连接部分。只有内槽部分被压制成具有安装到狭槽的大致矩形横截面。

10. 发明授权

US07977513B2 Method and apparatus for producing mono-lower-alkylmonoalkanolamine 有权
标题翻译：单低级烷基单链烷醇胺的制备方法和装置
公开(公告)号：US07977513B2
公开(公告)日：2011-07-12
申请号：US12438025
申请日：2007-08-06
申请人： Shinya Tachibana , Ryuji Yoshiyama , Tsuyoshi Oishi , Mikiya Sakurai , Kazuo Ishida , Tatsuya Tsujiuchi , Hidehisa Mita , Ryosuke Araki , Kenji Saito
发明人： Shinya Tachibana , Ryuji Yoshiyama , Tsuyoshi Oishi , Mikiya Sakurai , Kazuo Ishida , Tatsuya Tsujiuchi , Hidehisa Mita , Ryosuke Araki , Kenji Saito
IPC分类号： C07C213/00 , C07C213/04
CPC分类号： C07C213/04 , C07C213/10 , C07C215/08
摘要： An amine producing apparatus includes a reactor that reacts a mono-lower-alkylamine and an alkylene oxide, an unreacted-raw-material-recovery distillation column that separates unreacted raw materials by distillation from a product including unreacted raw materials obtained in the reactor, a non-aqueous distillation column that removes water and a light component by a distillation method from a reactive product from which unreacted raw material have been separated, and a purification and distillation column that separates by distillation a desired reactive product (mono-lower-alkylmonoalkanolamine) and residue (mono-lower-alkyldialkanolamine which is a dimer) from a reactive product from which the water and the light component have been removed.
摘要翻译：胺生产装置包括使单低级烷基胺和环氧烷反应的反应器，通过蒸馏将未反应原料与包含反应器中得到的未反应原料的产物分离的未反应原料回收蒸馏塔，通过蒸馏法从未反应的原料分离出的反应性产物中除去水和轻质成分的非水蒸馏塔和通过蒸馏分离所需的反应性产物（单低级烷基单链烷醇胺）的纯化和蒸馏塔，和去除水和轻组分的反应产物的残基（单 - 低级 - 烷基二烷醇胺，其是二聚体）。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式