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    • 3. 发明申请
    • X-RAY IRRADIATION DEVICE AND X-RAY RADIATION SOURCE
    • X射线辐射装置和X射线辐射源
    • US20150030131A1
    • 2015-01-29
    • US14378723
    • 2013-02-07
    • HAMAMATSU PHOTONICS K.K.
    • Norimasa KosugiNaoki OkumuraTatsuya NakamuraToru FujitaTomoyuki OkadaAkiomi Ujima
    • H05G1/70H05G1/10H05G1/54H05G1/08H05G1/02
    • H05G1/70H05G1/02H05G1/085H05G1/10H05G1/54
    • An X-ray radiation device comprises a plurality of X-ray radiation units, each having an X-ray tube for generating an X-ray, a drive circuit for driving the X-ray tube, and a trunk line connected to the drive circuit, and a controller having a control circuit for controlling the X-ray radiation units. The trunk lines of the plurality of X-ray radiation units are connected in series to the control circuit so that the drive circuits of the plurality of X-ray radiation units are connected in parallel to the control circuit. Since the trunk lines of the plurality of X-ray radiation units are connected in series to the control circuit, the X-ray radiation units can be connected to each other and are not required to be connected one by one to the controller. This makes it possible to increase and decrease the number of units without complicating their wiring.
    • X射线辐射装置包括多个X射线辐射单元,每个X射线辐射单元具有用于产生X射线的X射线管,用于驱动X射线管的驱动电路和连接到驱动电路的干线 以及具有用于控制X射线辐射单元的控制电路的控制器。 多个X射线单元的干线与控制电路串联连接,使得多个X射线单元的驱动电路与控制电路并联连接。 由于多个X射线辐射单元的干线与控制电路串联连接,所以可以将X射线辐射单元相互连接,不需要一个接一个连接到控制器。 这使得可以增加和减少单元数量而不会使其布线复杂化。
    • 5. 发明授权
    • X-ray irradiation device and X-ray radiation source
    • X射线照射装置和X射线辐射源
    • US09445487B2
    • 2016-09-13
    • US14378723
    • 2013-02-07
    • HAMAMATSU PHOTONICS K.K.
    • Norimasa KosugiNaoki OkumuraTatsuya NakamuraToru FujitaTomoyuki OkadaAkiomi Ujima
    • H05G1/02H05G1/70H05G1/08H05G1/10H05G1/54
    • H05G1/70H05G1/02H05G1/085H05G1/10H05G1/54
    • An X-ray radiation device comprises a plurality of X-ray radiation units, each having an X-ray tube for generating an X-ray, a drive circuit for driving the X-ray tube, and a trunk line connected to the drive circuit, and a controller having a control circuit for controlling the X-ray radiation units. The trunk lines of the plurality of X-ray radiation units are connected in series to the control circuit so that the drive circuits of the plurality of X-ray radiation units are connected in parallel to the control circuit. Since the trunk lines of the plurality of X-ray radiation units are connected in series to the control circuit, the X-ray radiation units can be connected to each other and are not required to be connected one by one to the controller. This makes it possible to increase and decrease the number of units without complicating their wiring.
    • X射线辐射装置包括多个X射线辐射单元,每个X射线辐射单元具有用于产生X射线的X射线管,用于驱动X射线管的驱动电路和连接到驱动电路的干线 以及具有用于控制X射线辐射单元的控制电路的控制器。 多个X射线单元的干线与控制电路串联连接,使得多个X射线单元的驱动电路与控制电路并联连接。 由于多个X射线辐射单元的干线与控制电路串联连接,所以可以将X射线辐射单元相互连接,不需要一个接一个连接到控制器。 这使得可以增加和减少单元数量而不会使其布线复杂化。
    • 6. 发明授权
    • Solid-state imaging device
    • 固态成像装置
    • US09054000B2
    • 2015-06-09
    • US13666149
    • 2012-11-01
    • HAMAMATSU PHOTONICS K.K.
    • Motohiro SuyamaAkiomi UjimaKentaro MaetaHisanori SuzukiMasaharu MuramatsuFumio Iwase
    • H04N5/225H01L27/146
    • H01L27/14618H01L2224/16H01L2224/48091H04N5/2253H01L2924/00014
    • A solid-state imaging device 2A includes a CCD-type solid-state imaging element 10 having an imaging plane 12 formed of M×N pixels that are two-dimensionally arrayed in M rows and N columns and N signal readout circuits 20 arranged on one end side in the column direction for each of the columns with respect to the plane 12 and for outputting electrical signals according to the magnitudes of charges taken out of the respective columns, respectively, a C-MOS-type semiconductor element 50 for digital-converting and sequentially outputting as serial signals electrical signals output from the circuits 20 for each of the columns, a heat transfer member 80 having a main surface 81a and a back surface 81b, and a cooling block 84 provided on the surface 81b, and the semiconductor element 50 and the surface 81a of the heat transfer member 80 are bonded to each other.
    • 固态成像装置2A包括CCD型固体摄像元件10,该CCD型固体摄像元件10具有由M×N像素构成的摄像面12,二维排列成M行N列,N信号读出电路20配置在一方 用于每个列相对于平面12的列方向的端侧,并分别根据从各列取出的电荷的大小输出电信号,用于数字转换的C-MOS型半导体元件 并顺序地输出作为串行信号从每个列的电路20输出的电信号,具有主表面81a和后表面81b的传热构件80和设置在表面81b上的冷却块84,以及半导体元件 50和传热构件80的表面81a彼此接合。