专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20140319786A1 APPARATUS AND METHOD FOR ALIGNING AND CENTERING WAFERS 有权
标题翻译：用于对准和中心波形的装置和方法
公开(公告)号：US20140319786A1
公开(公告)日：2014-10-30
申请号：US14330497
申请日：2014-07-14
申请人： HALE JOHNSON , GREGORY GEORGE , MICHAEL BRENNEN
发明人： HALE JOHNSON , GREGORY GEORGE , MICHAEL BRENNEN
IPC分类号： H01L21/68 , H01L21/683
CPC分类号： H01L21/68 , H01L21/67092 , Y10T279/18 , Y10T279/21 , Y10T279/26
摘要： A device for locating and engaging a notch on the perimeter of a circular wafer includes a notch locating component and a first plate. The notch locating component is configured to move linearly along a first axis and includes a front elongated component extending along a second axis perpendicular to the first axis and having a front surface, a back surface opposite to the front surface and a first protrusion extending from the front surface of the elongated component. The first protrusion has a shape complementing the shape of a notch formed on the perimeter of a circular wafer. As the notch locating component is driven toward the perimeter of the circular wafer along the first axis, a distance between the back surface of the elongated component and a front surface of the first plate is measured and the value of the measured distance is used to determine engagement of the first protrusion with the notch.
摘要翻译：用于定位和接合圆形晶片周界上的凹口的装置包括凹口定位部件和第一板。凹口定位部件被构造成沿着第一轴线性地移动并且包括沿垂直于第一轴线的第二轴线延伸的前部细长部件，并且具有前表面，与前表面相对的后表面和从该前表面延伸的第一突出部细长部件的前表面。第一突起具有补充形成在圆形晶片的周边上的凹口的形状的形状。当切口定位部件沿着第一轴线朝向圆形晶片的周边被驱动时，测量细长部件的后表面与第一板的前表面之间的距离，并且使用测量的距离的值来确定第一突起与凹口的接合。

2. 发明申请

US20100263794A1 APPARATUS FOR MECHANICALLY DEBONDING TEMPORARY BONDED SEMICONDUCTOR WAFERS 有权
标题翻译：用于机械结合临时粘结半导体波导的装置
公开(公告)号：US20100263794A1
公开(公告)日：2010-10-21
申请号：US12761014
申请日：2010-04-15
申请人： GREGORY GEORGE , HALE JOHNSON , PATRICK GORUN , JAMES HERMANOWSKI , MATTHEW STILES
发明人： GREGORY GEORGE , HALE JOHNSON , PATRICK GORUN , JAMES HERMANOWSKI , MATTHEW STILES
IPC分类号： B32B38/10
CPC分类号： H01L21/6835 , B32B38/1858 , B32B43/006 , B32B2309/105 , B32B2457/14 , H01L21/67092 , H01L21/67132 , H01L21/673 , H01L2221/68318 , H01L2221/68327 , Y10S156/93 , Y10S156/932 , Y10S156/941 , Y10S156/942 , Y10S156/943 , Y10T29/49817 , Y10T29/53274 , Y10T156/1132 , Y10T156/1153 , Y10T156/1158 , Y10T156/1168 , Y10T156/1189 , Y10T156/1911 , Y10T156/1917 , Y10T156/1944 , Y10T156/1972 , Y10T156/1978 , Y10T279/18 , Y10T279/21 , Y10T279/26 , Y10T279/29
摘要： A debonder apparatus for debonding two via an adhesive layer combined with a release layer temporary bonded wafers includes a chuck assembly, a flex plate assembly and a contact roller. The chuck assembly includes a chuck and a first wafer holder configured to hold wafers in contact with the top surface of the chuck. The flex plate assembly includes a flex plate and a second wafer holder configured to hold wafers in contact with a first surface of the flex plate. The flex plate comprises a first edge connected to a hinge and a second edge diametrically opposite to the first edge, and the flex plate's first edge is arranged adjacent to a first edge of the chuck and the flex plate is configured to swing around the hinge and to be placed above the top surface of the chuck. The contact roller is arranged adjacent to a second edge of the chuck, which is diametrically opposite to its first edge. A debond drive motor is configured to move the contact roller vertical to the plane of the chuck top surface. In operation, a wafer pair, comprising a carrier wafer stacked upon and being bonded to a device wafer via an adhesive layer and a release layer, is placed upon the chuck so that the ubonded surface of the device wafer is in contact with the chuck top surface. Next, the flex plate swings around the hinge and is placed above the bottom chuck so that its first surface is in contact with the unbonded surface of the carrier wafer. Next, the contact roller is driven upward until it contacts and pushes the second edge of the flex plate up while the carrier wafer is held by the flex plate and the device wafer is held by the chuck via the second and first wafer holders, respectively. The contact roller push flexes the second edge of the flex plate and causes delamination of the wafer pair along the release layer.
摘要翻译：用于通过与释放层临时粘合的晶片组合的粘合层分离两个脱粘器装置包括卡盘组件，柔性板组件和接触辊。卡盘组件包括卡盘和构造成保持与卡盘的顶表面接触的晶片的第一晶片保持器。柔性板组件包括柔性板和第二晶片保持器，第二晶片保持器被构造成保持与柔性板的第一表面接触的晶片。柔性板包括连接到铰链的第一边缘和与第一边缘径向相对的第二边缘，并且柔性板的第一边缘邻近卡盘的第一边缘布置，并且柔性板构造成围绕铰链摆动，并且被放置在卡盘的顶表面之上。接触辊被布置成与卡盘的与其第一边缘径向相对的第二边缘相邻。脱粘驱动电动机构造成使接触辊垂直于卡盘顶表面的平面移动。在操作中，包括经由粘合剂层和释放层堆叠在器件晶片上并且通过粘合剂层和释放层结合到器件晶片上的载体晶片的晶片对放置在卡盘上，使得器件晶片的ubonded表面与卡盘顶部接触表面。接下来，柔性板围绕铰链摆动并且被放置在底部卡盘的上方，使得其第一表面与载体晶片的未结合的表面接触。接下来，接触辊被向上驱动，直到其接触并将柔性板的第二边缘向上推动，同时载体晶片被柔性板保持，并且装置晶片分别通过第二和第一晶片保持器由卡盘保持。接触辊推动弯曲柔性板的第二边缘并导致晶片对沿着释放层的分层。

3. 发明申请

US20150206783A1 SYSTEM AMD METHOD FOR SUBSTRATE HOLDING 审中-公开
标题翻译：系统AMD基板控制方法
公开(公告)号：US20150206783A1
公开(公告)日：2015-07-23
申请号：US14597298
申请日：2015-01-15
申请人： HALE JOHNSON , GREGORY GEORGE
发明人： HALE JOHNSON , GREGORY GEORGE
IPC分类号： H01L21/683
CPC分类号： H01L21/6719 , H01L21/67092 , H01L21/68 , H01L21/68728 , Y10T279/1291 , Y10T279/19 , Y10T279/1986 , Y10T279/21 , Y10T279/26
摘要： A system for mechanically holding a substrate during processing includes a closeable processing chamber and an upper block assembly located inside the processing chamber and configured to hold a wafer via three mechanical holding assemblies. The three mechanical holding assemblies protrude above a cover of the wafer processing chamber and are configured to hold the wafer at an edge of the wafer and to be adjusted from outside of the processing chamber. Two of the mechanical holding assemblies are lockable in position relative to the wafer edge and one of the mechanical holding assemblies is configured to maintain a hold preload on the wafer edge via a preload mechanism.
摘要翻译：一种用于在处理过程中机械地保持衬底的系统包括可关闭的处理室和位于处理室内部的上部块组件，并被配置为通过三个机械保持组件保持晶片。三个机械保持组件突出在晶片处理室的盖上方，并且被配置为将晶片保持在晶片的边缘并且从处理室的外部调节。两个机械保持组件相对于晶片边缘可锁定就位，并且一个机械保持组件被配置为通过预加载机构保持晶片边缘上的保持预载。

4. 发明申请

US20150083342A1 METHOD FOR THERMAL-SLIDE DEBONDING OF TEMPORARY BONDED SEMICONDUCTOR WAFERS 有权
标题翻译：用于临时粘结半导体波导的热滑粘结的方法
公开(公告)号：US20150083342A1
公开(公告)日：2015-03-26
申请号：US14556298
申请日：2014-12-01
申请人： GREGORY GEORGE , HALE JOHNSON , PATRICK GORUN , EMMETT HUGHLETT , JAMES HERMANOWSKI , MATTHEW STILES
发明人： GREGORY GEORGE , HALE JOHNSON , PATRICK GORUN , EMMETT HUGHLETT , JAMES HERMANOWSKI , MATTHEW STILES
IPC分类号： H01L21/683 , B32B43/00 , H01L21/673
CPC分类号： H01L21/6835 , B32B38/1858 , B32B43/006 , B32B2309/105 , B32B2457/14 , H01L21/67092 , H01L21/67132 , H01L21/673 , H01L2221/68318 , H01L2221/68327 , Y10S156/93 , Y10S156/932 , Y10S156/941 , Y10S156/942 , Y10S156/943 , Y10T29/49817 , Y10T29/53274 , Y10T156/1132 , Y10T156/1153 , Y10T156/1158 , Y10T156/1168 , Y10T156/1189 , Y10T156/1911 , Y10T156/1917 , Y10T156/1944 , Y10T156/1972 , Y10T156/1978 , Y10T279/18 , Y10T279/21 , Y10T279/26 , Y10T279/29
摘要： A method for debonding two temporary bonded wafers, includes providing a debonder comprising a top chuck assembly, a bottom chuck assembly, a static gantry supporting the top chuck assembly, an X-axis carriage drive supporting the bottom chuck assembly and an X-axis drive control configured to drive horizontally the X-axis carriage drive and the bottom chuck assembly from a loading zone to a process zone under the top chuck assembly and from the process zone back to the loading zone. Next, loading a wafer pair comprising a carrier wafer bonded to a device wafer via an adhesive layer upon the bottom chuck assembly at the loading zone oriented so that the unbonded surface of the device wafer is in contact with the bottom assembly. Next, driving the X-axis carriage drive and the bottom chuck assembly to the process zone under the top chuck assembly. Next, placing the unbonded surface of the carrier wafer in contact with the top chuck assembly and holding the carrier wafer by the top chuck assembly. Next, initiating horizontal motion of the X-axis carriage drive while heat is applied to the carrier wafer and while the carrier wafer is held by the top chuck assembly.
摘要翻译：一种用于剥离两个临时粘合晶片的方法，包括提供一个脱粘器，其包括顶部卡盘组件，底部卡盘组件，支撑顶部卡盘组件的静态机架，支撑底部卡盘组件的X轴托架驱动器和X轴驱动控制器被配置为将X轴托架驱动器和底部卡盘组件从加载区域水平驱动到顶部卡盘组件下方的处理区域以及从处理区域到加载区域。接下来，将负载区域上的通过粘合剂层将包含结合到器件晶片的载体晶片的晶片对装载在负载区域上的底部卡盘组件上，使得器件晶片的未结合表面与底部组件接触。接下来，将X轴托架驱动器和底卡盘组件驱动到顶卡盘组件下的处理区域。接下来，将载体晶片的未结合表面与顶部卡盘组件接触并且通过顶部卡盘组件保持载体晶片。接下来，当向载体晶片施加热量并且当载体晶片被顶部卡盘组件保持时，启动X轴托架驱动器的水平运动。

5. 发明申请

US20140318683A1 APPARATUS AND METHOD FOR SEMICONDUCTOR WAFER LEVELING, FORCE BALANCING AND CONTACT SENSING 有权
标题翻译：半导体波浪平衡，力平衡和接触感应的装置和方法
公开(公告)号：US20140318683A1
公开(公告)日：2014-10-30
申请号：US14330536
申请日：2014-07-14
申请人： HALE JOHNSON , GREGORY GEORGE , MICHAEL BRENNEN
发明人： HALE JOHNSON , GREGORY GEORGE , MICHAEL BRENNEN
IPC分类号： H01L21/68
CPC分类号： H01L21/68 , H01L21/67092 , H01L21/6831 , H01L21/6833 , Y10T279/23
摘要： A wafer bonder apparatus, includes a lower chuck, an upper chuck, a process chamber and three adjustment mechanisms. The three adjustment mechanisms are arranged around a top lid spaced apart from each other and are located outside of the process chamber. Each adjustment mechanism includes a component for sensing contact to the upper chuck, a component for adjusting the pre-load force of the upper chuck, and a component for leveling the upper chuck.
摘要翻译：晶片接合装置包括下卡盘，上卡盘，处理室和三个调节机构。三个调节机构围绕彼此间隔开的顶盖布置并且位于处理室的外部。每个调节机构包括用于感测与上卡盘的接触的部件，用于调节上卡盘的预加载力的部件和用于调平上卡盘的部件。

6. 发明申请

US20110010908A1 APPARATUS FOR THERMAL-SLIDE DEBONDING OF TEMPORARY BONDED SEMICONDUCTOR WAFERS 有权
标题翻译：用于临时粘结半导体波导的热滑粘结的装置
公开(公告)号：US20110010908A1
公开(公告)日：2011-01-20
申请号：US12760973
申请日：2010-04-15
申请人： GREGORY GEORGE , HALE JOHNSON , PATRICK GORUN , EMMETT HUGHLETT , JAMES HERMANOWSKI , MATTHEW STILES
发明人： GREGORY GEORGE , HALE JOHNSON , PATRICK GORUN , EMMETT HUGHLETT , JAMES HERMANOWSKI , MATTHEW STILES
IPC分类号： B23P19/00
CPC分类号： H01L21/6835 , B32B38/1858 , B32B43/006 , B32B2309/105 , B32B2457/14 , H01L21/67092 , H01L21/67132 , H01L21/673 , H01L2221/68318 , H01L2221/68327 , Y10S156/93 , Y10S156/932 , Y10S156/941 , Y10S156/942 , Y10S156/943 , Y10T29/49817 , Y10T29/53274 , Y10T156/1132 , Y10T156/1153 , Y10T156/1158 , Y10T156/1168 , Y10T156/1189 , Y10T156/1911 , Y10T156/1917 , Y10T156/1944 , Y10T156/1972 , Y10T156/1978 , Y10T279/18 , Y10T279/21 , Y10T279/26 , Y10T279/29
摘要： A debonder apparatus for debonding two via an adhesive layer temporary bonded wafers includes a top chuck assembly, a bottom chuck assembly, a static gantry supporting the top chuck assembly, an X-axis carriage drive supporting the bottom chuck assembly, and an X-axis drive control. The top chuck assembly includes a heater and a wafer holder. The X-axis drive control drives horizontally the bottom chuck assembly from a loading zone to a process zone under the top chuck assembly and from the process zone back to the loading zone. A wafer pair comprising a carrier wafer bonded to a device wafer via an adhesive layer is placed upon the bottom chuck assembly at the loading zone oriented so that the unbonded surface of the device wafer is in contact with the bottom assembly and is carried by the X-axis carriage drive to the process zone under the top chuck assembly and the unbonded surface of the carrier wafer is placed in contact with the top chuck assembly. The X-axis drive control initiates horizontal motion of the X-axis carriage drive along the X-axis while heat is applied to the carrier wafer via the heater and while the carrier wafer is held by the top chuck assembly via the wafer holder and thereby causes the device wafer to separate and slide away from the carrier wafer.
摘要翻译：用于通过粘合剂层临时粘合的晶片脱粘两个的脱粘器装置包括顶部卡盘组件，底部卡盘组件，支撑顶部卡盘组件的静态机架，支撑底部卡盘组件的X轴托架驱动器和X轴驱动控制。顶部卡盘组件包括加热器和晶片保持器。 X轴驱动控制器将底部卡盘组件从装载区域水平驱动到顶部卡盘组件下方的过程区域，并从工艺区域向后加载到装载区域。包括通过粘合剂层结合到器件晶片的载体晶片的晶片对被放置在位于底部卡盘组件处的负载区域处，使得器件晶片的未结合表面与底部组件接触并且由X 驱动到顶部卡盘组件下面的处理区域，并且载体晶片的未结合表面被放置成与顶部卡盘组件接触。 X轴驱动控制器启动X轴托架驱动器沿X轴的水平运动，同时通过加热器将热量施加到载体晶片上，同时通过晶片保持器将托架晶片保持在顶卡盘组件上，从而使得器件晶片分离并从载体晶片滑离。

7. 发明申请

US20100266373A1 DEVICE FOR CENTERING WAFERS 有权
标题翻译：用于中心波浪的装置
公开(公告)号：US20100266373A1
公开(公告)日：2010-10-21
申请号：US12761044
申请日：2010-04-15
申请人： GREGORY GEORGE , HALE JOHNSON , DENNIS PATRICIO
发明人： GREGORY GEORGE , HALE JOHNSON , DENNIS PATRICIO
IPC分类号： H01L21/68
CPC分类号： H01L21/6835 , B32B38/1858 , B32B43/006 , B32B2309/105 , B32B2457/14 , H01L21/67092 , H01L21/67132 , H01L21/673 , H01L2221/68318 , H01L2221/68327 , Y10S156/93 , Y10S156/932 , Y10S156/941 , Y10S156/942 , Y10S156/943 , Y10T29/49817 , Y10T29/53274 , Y10T156/1132 , Y10T156/1153 , Y10T156/1158 , Y10T156/1168 , Y10T156/1189 , Y10T156/1911 , Y10T156/1917 , Y10T156/1944 , Y10T156/1972 , Y10T156/1978 , Y10T279/18 , Y10T279/21 , Y10T279/26 , Y10T279/29
摘要： A device for centering circular wafers includes a support chuck for supporting a circular wafer to be centered upon its top surface, left, right and middle centering linkage rods and a cam plate synchronizing the rectilinear motion of the left, right and middle centering linkage rods. The left centering linkage rod includes a first rotating arm at a first end and rectilinear motion of the left centering linkage rod translates into rotational motion of the first rotating arm. The right centering linkage rod comprises a second rotating arm at a first end, and rectilinear motion of the right centering linkage rod translates into rotational motion of the second rotating arm. The first and second rotating arms are rotatable around an axis perpendicular to the top surface of the support chuck and comprise a curved edge surface configured to roll against the curved edge of the circular wafer. The middle centering linkage rod includes a third alignment arm at a first end. The third alignment arm is placed in contact with the curved edge of the circular wafer and linear motion of the middle centering linkage rod in the Y-direction pushes the third alignment arm and the circular wafer toward or away from the center of the support chuck. The cam plate includes first and second linear cam profiles. The first cam profile provides rectilinear motion for the middle centering linkage rod and the second linear cam profile provides rectilinear motion for the left and right centering linkage rods.
摘要翻译：用于定心圆形晶片的装置包括支撑卡盘，用于将圆形晶片支撑在其顶部中心定位的中心，左右中心对中连杆和中心对中连杆的直线运动同步的凸轮板。左对中连杆包括在第一端处的第一旋转臂，并且左对中连杆的直线运动转换成第一旋转臂的旋转运动。右对中连杆包括在第一端的第二旋转臂，右对中连杆的直线运动转换为第二旋转臂的旋转运动。第一和第二旋转臂可绕垂直于支撑卡盘的顶表面的轴线旋转，并且包括弯曲的边缘表面，该弯曲边缘表面被配置成相对于圆形晶片的弯曲边缘滚动。中间定心连杆在第一端包括第三对准臂。第三对准臂被放置成与圆形晶片的弯曲边缘接触，并且Y中心定中心连杆的线性运动将第三对准臂和圆形晶片推向或远离支撑卡盘的中心。凸轮板包括第一和第二直线凸轮轮廓。第一凸轮轮廓为中间定心联动杆提供直线运动，第二直线凸轮轮廓为左右对中连杆提供直线运动。

8. 发明申请

US20070296035A1 APPARATUS AND METHOD FOR SEMICONDUCTOR BONDING 有权
标题翻译：用于半导体结合的装置和方法
公开(公告)号：US20070296035A1
公开(公告)日：2007-12-27
申请号：US11766531
申请日：2007-06-21
申请人： GREGORY GEORGE , ETIENNE HANCOCK , ROBERT CAMPBELL
发明人： GREGORY GEORGE , ETIENNE HANCOCK , ROBERT CAMPBELL
IPC分类号： H01L27/12
CPC分类号： H01L21/67092 , H01L21/187
摘要： An apparatus for bonding semiconductor structures includes equipment for positioning a first surface of a first semiconductor structure directly opposite and in contact with a first surface of a second semiconductor structure and equipment for forming a bond interface area between the first surfaces of the first and second semiconductor structures by pressing the first and second semiconductor structures together with a force column configured to apply uniform pressure to the entire bond interface area between the first surfaces.
摘要翻译：一种用于接合半导体结构的装置包括用于定位与第二半导体结构的第一表面直接相对并接触的第一半导体结构的第一表面的设备和用于在第一和第二半导体的第一表面之间形成接合界面区域的设备通过将第一和第二半导体结构与被配置为对第一表面之间的整个结合界面区域施加均匀压力的力列一起按压第一和第二半导体结构的结构。

9. 发明申请

US20150251396A1 METHOD AND APPARATUS FOR TEMPORARY BONDING OF ULTRA THIN WAFERS 审中-公开
标题翻译：超薄薄膜临时粘结的方法和装置
公开(公告)号：US20150251396A1
公开(公告)日：2015-09-10
申请号：US14714587
申请日：2015-05-18
申请人： GREGORY GEORGE , Stefan Lutter
发明人： GREGORY GEORGE , Stefan Lutter
IPC分类号： B32B37/00 , B32B37/18 , H01L21/683 , B32B37/12
CPC分类号： B32B37/0046 , B32B37/1284 , B32B37/18 , B32B2307/202 , B32B2457/14 , H01L21/0201 , H01L21/2007 , H01L21/67092 , H01L21/6835 , H01L21/6836 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y10T156/17
摘要： An apparatus for temporary bonding first and second wafers includes, a first coating chamber configured to apply a first adhesive layer upon a first surface of a first wafer; a second coating chamber configured to apply a second adhesive layer upon a first surface of a second wafer; a curing chamber configured to cure the first adhesive layer of the first wafer; a bonder module comprising an upper chuck assembly and a lower chuck assembly arranged below and opposite the upper chuck assembly. The upper chuck assembly is configured to hold the first wafer so that its first surface with the cured first adhesive layer faces down. The lower chuck assembly is configured to hold the second wafer so that the second adhesive layer faces up and is opposite to the cured first adhesive layer. The lower chuck assembly is configured to move upwards and thereby to bring the second adhesive layer in contact with the cured first adhesive layer. The curing chamber is further configured to cure the second adhesive layer after it is brought in contact with the cured first adhesive layer, thereby forming a temporary bond between the first and second wafers.
摘要翻译：一种用于临时粘合第一和第二晶片的装置包括：第一涂层室，被配置为将第一粘合剂层施加到第一晶片的第一表面上; 第二涂覆室，被配置为将第二粘合剂层施加到第二晶片的第一表面上; 固化室，其构造成固化所述第一晶片的所述第一粘合剂层; 粘合剂模块包括布置在上卡盘组件下方和相对的上卡盘组件和下卡盘组件。上卡盘组件构造成保持第一晶片，使得其第一表面与固化的第一粘合剂层面朝下。下卡盘组件构造成保持第二晶片，使得第二粘合剂层面向上并且与固化的第一粘合剂层相对。下卡盘组件构造成向上移动，从而使第二粘合剂层与固化的第一粘合剂层接触。固化室进一步构造成在与固化的第一粘合剂层接触之后固化第二粘合剂层，从而在第一和第二晶片之间形成临时粘合。

10. 发明申请

US20130244400A1 METHOD AND APPARATUS FOR TEMPORARY BONDING OF ULTRA THIN WAFERS 审中-公开
标题翻译：超薄薄膜临时粘结的方法和装置
公开(公告)号：US20130244400A1
公开(公告)日：2013-09-19
申请号：US13790684
申请日：2013-03-08
申请人： GREGORY GEORGE , Stefan Lutter
发明人： GREGORY GEORGE , Stefan Lutter
IPC分类号： H01L21/02
CPC分类号： B32B37/0046 , B32B37/1284 , B32B37/18 , B32B2307/202 , B32B2457/14 , H01L21/0201 , H01L21/2007 , H01L21/67092 , H01L21/6835 , H01L21/6836 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y10T156/17
摘要： A method for temporary bonding first and second wafers includes, applying a first adhesive layer upon a first surface of a first wafer and then curing the first adhesive layer. Next, applying a second adhesive layer upon a first surface of a second wafer. Next, inserting the first wafer into a bonder module and holding the first wafer by an upper chuck assembly so that its first surface with the cured first adhesive layer faces down. Next, inserting the second wafer into the bonder module and placing the second wafer upon a lower chuck assembly so that the second adhesive layer faces up and is opposite to the first adhesive layer. Next, moving the lower chuck assembly upwards and bringing the second adhesive layer in contact with the cured first adhesive layer, and then curing the second adhesive layer.
摘要翻译：临时粘合第一和第二晶片的方法包括：在第一晶片的第一表面上施加第一粘合剂层，然后固化第一粘合剂层。接下来，将第二粘合剂层施加到第二晶片的第一表面上。接下来，将第一晶片插入粘合剂模块中，并通过上卡盘组件保持第一晶片，使得其第一表面与固化的第一粘合剂层面朝下。接下来，将第二晶片插入到接合器模块中，并将第二晶片放置在下卡盘组件上，使得第二粘合剂层面向上并与第一粘合剂层相对。接下来，向下移动下卡盘组件并使第二粘合剂层与固化的第一粘合剂层接触，然后固化第二粘合剂层。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式