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    • 3. 发明授权
    • Gated field effect devices
    • 门控场效应器件
    • US07442977B2
    • 2008-10-28
    • US11253461
    • 2005-10-19
    • Cem BasceriH. Montgomery ManningGurtej S. SandhuKunal R. Parekh
    • Cem BasceriH. Montgomery ManningGurtej S. SandhuKunal R. Parekh
    • H01L27/108
    • H01L29/4983H01L21/28194H01L29/512H01L29/517
    • This invention includes gated field effect devices, and methods of forming gated field effect devices. In one implementation, a gated field effect device includes a pair of source/drain regions having a channel region therebetween. A gate is received proximate the channel region between the source/drain regions. The gate has a gate width between the source/drain regions. A gate dielectric is received intermediate the channel region and the gate. The gate dielectric has at least two different regions along the width of the gate. The different regions are characterized by different materials which are effective to define the two different regions to have different dielectric constants k. Other aspects and implementations are contemplated.
    • 本发明包括门控场效应器件,以及形成门控场效应器件的方法。 在一种实施方案中,门控场效应器件包括在其间具有沟道区的一对源/漏区。 在源极/漏极区域之间的沟道区域附近接收栅极。 栅极在源极/漏极区之间具有栅极宽度。 栅极电介质被接收在沟道区域和栅极之间。 栅极电介质沿着栅极的宽度具有至少两个不同的区域。 不同的区域由不同的材料表征,其有效地限定两个不同的区域以具有不同的介电常数k。 考虑了其他方面和实现。
    • 7. 发明授权
    • Methods of forming field effect transistors
    • 形成场效应晶体管的方法
    • US07262099B2
    • 2007-08-28
    • US10925100
    • 2004-08-23
    • Gurtej S. SandhuH. Montgomery ManningCem Basceri
    • Gurtej S. SandhuH. Montgomery ManningCem Basceri
    • H01L21/336
    • H01L29/66666H01L29/7827
    • A mass of material is formed over a semiconductor substrate. Semiconductive material is formed laterally proximate the mass of material. A space is provided laterally between the mass of material and the semiconductive material. The space comprises an outermost portion and a portion immediately adjacent thereto. The outermost portion has a maximum lateral width which is greater than that of the adjacent portion. Gate dielectric material and conductive gate material are formed within the space. The gate dielectric material and the conductive gate material in combination fill the adjacent portion of the space but do not fill the outermost portion of the space. At least the conductive gate material is etched from at least a majority of the outermost portion of the space. Source/drain regions are formed operatively proximate the conductive gate material and the semiconductive material is used as a channel region of the field effect transistor.
    • 一块材料形成在半导体衬底上。 半导体材料横向靠近材料块形成。 在材料块和半导体材料之间横向设置空间。 该空间包括最外部分和与其紧邻的部分。 最外侧部分的最大横向宽度大于相邻部分的宽度。 栅极电介质材料和导电栅极材料形成在该空间内。 栅极电介质材料和导电栅极材料组合地填充空间的相邻部分,但不填充空间的最外部分。 至少导电栅极材料从空间的最外部的至少大部分被蚀刻。 源极/漏极区域可操作地形成在导电栅极材料附近,并且半导体材料用作场效应晶体管的沟道区域。