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1. 发明申请

US20070261964A1 Reactors, systems, and methods for electroplating microfeature workpieces 审中-公开
标题翻译：用于电镀微型工件的电抗器，系统和方法
公开(公告)号：US20070261964A1
公开(公告)日：2007-11-15
申请号：US11432164
申请日：2006-05-10
申请人： Gregory Wilson , Paul McHugh , Kyle Hanson , Rajesh Baskaran
发明人： Gregory Wilson , Paul McHugh , Kyle Hanson , Rajesh Baskaran
IPC分类号： C25D5/20 , C25B9/00
CPC分类号： C25D5/08 , C25D17/002
摘要： Reactors, systems and methods for electroplating and/or electro-etching microfeature workpieces. Reactors in accordance with the invention have a first chamber configured to direct a first processing solution to a processing zone, a second chamber configured to contain a second processing solution different than the first processing solution, and an ion exchange membrane between the first chamber and the second chamber. The reactors also include (a) a support member in the first chamber that contacts the ion exchange membrane across the surface of the membrane, and (b) a counter electrode in the second chamber. The ion exchange membrane enables a low conductivity catholyte to be used in the first chamber and an inert counter electrode in the second chamber. More specifically, the ion exchange membrane prevents nascent oxygen that evolves from the inert counter electrode from reaching the catholyte to reduce oxidation of constituents of the catholyte, consumption of organic additives in the anolyte, and/or accumulation of bubbles and particulates at the workpiece.
摘要翻译：用于电镀和/或电蚀蚀微型工件的反应器，系统和方法。根据本发明的反应器具有被配置为将第一处理溶液引导到处理区的第一室，被配置为容纳不同于第一处理溶液的第二处理溶液的第二室以及第一室与第一室之间的离子交换膜第二室。反应器还包括（a）在第一室中的与膜的表面接触离子交换膜的支撑构件，和（b）第二室中的对电极。离子交换膜使得能够在第一室中使用低导电性阴极电解液，并且在第二室中使用惰性对电极。更具体地，离子交换膜防止从惰性对电极逸出的新生氧气到达阴极电解液，以减少阴极电解液的组分的氧化，阳极电解液中的有机添加剂的消耗和/或工件上的气泡和微粒的积聚。

2. 发明申请

US20080011450A1 Apparatus and Method for Thermally Controlled Processing of Microelectronic Workpieces 审中-公开
标题翻译：微电子工件热处理设备及方法
公开(公告)号：US20080011450A1
公开(公告)日：2008-01-17
申请号：US11776952
申请日：2007-07-12
申请人： Kyle Hanson , Robert Batz , Rajesh Baskaran , Nolan Zimmerman , Zhongmin Hu , Gregory Wilson , Paul McHugh
发明人： Kyle Hanson , Robert Batz , Rajesh Baskaran , Nolan Zimmerman , Zhongmin Hu , Gregory Wilson , Paul McHugh
IPC分类号： B05B1/00 , F17D3/00
CPC分类号： H01L21/6723 , C23C18/1676 , H01L21/67109 , Y10T137/0318
摘要： Apparatus and method for thermally controlled processing of microelectronic workpieces with liquids. An apparatus in accordance with and embodiment of the invention includes a process vessel configured to carry a processing liquid, such as an electroless processing liquid. The vessel has a thermally transmissive wall for transferring heat to and/or from the processing liquid within. A heat transfer device, such as a reservoir that receives processing liquid spilling over from the process vessel, transfers heat to or from the processing liquid within the process vessel. The heat transfer device can also transfer heat to or from an internal or external heat source, such as a conduit carrying a heat transfer fluid, or an electrical resistance heater. The interaction between the microelectronic workpiece and the processing liquid can be further controlled by controlling the rate at which the microelectronic workpiece rotates and/or the manner in which the microelectronic workpiece is introduced to and/or withdrawn from the processing liquid.
摘要翻译：用液体对微电子工件进行热处理的装置和方法。根据本发明的实施例的装置包括配置成承载诸如无电处理液体的处理液体的处理容器。容器具有用于将热量传递到和/或内部的处理液体的热传递壁。传热装置，例如容纳从处理容器溢出的处理液体的储存器，将热量传递到处理容器内或从处理容器内的处理液体。传热装置还可以将热量传递到内部或外部热源，例如承载传热流体的导管或电阻加热器。通过控制微电子工件旋转的速度和/或微电子工件被引入和/或从处理液中取出的方式，可以进一步控制微电子工件和处理液之间的相互作用。

3. 发明申请

US20060226019A1 Die-level wafer contact for direct-on-barrier plating 审中-公开
标题翻译：用于直接屏蔽电镀的晶片级晶片接触
公开(公告)号：US20060226019A1
公开(公告)日：2006-10-12
申请号：US11399762
申请日：2006-04-07
申请人： Raymon Thompson , Paul McHugh , Daniel Woodruff , Gregory Wilson , Steve Eudy , Rajesh Baskaran
发明人： Raymon Thompson , Paul McHugh , Daniel Woodruff , Gregory Wilson , Steve Eudy , Rajesh Baskaran
IPC分类号： C25D7/12
CPC分类号： C25D17/001 , C25D7/123 , C25D17/005 , C25D17/06 , H01L21/2885 , H01L21/76873 , H01L21/76877
摘要： The present invention provides a semiconductor workpiece support and contact assembly for providing localized electrical connections with the device side of the workpiece. The additional contact points help overcome the terminal effect caused by very high sheet resistance of thin barrier layers and enable plating a conformal seed layer or feature filling directly on thin barrier layers. By utilizing the streets that separate individual dice on a workpiece to make electrical connections with the workpiece and provide localized distribution of plating chemistry, the present invention provides a more uniform and conformal metallization layer.
摘要翻译：本发明提供一种用于提供与工件的装置侧的局部电连接的半导体工件支撑和接触组件。额外的接触点有助于克服由薄阻挡层的非常高的薄层电阻引起的终端效应，并且能够将保形种子层或特征直接填充在薄的阻挡层上。通过利用在工件上分离单个骰子以与工件电连接并且提供电镀化学物质的局部分布的街道，本发明提供了更均匀和保形的金属化层。

4. 发明申请

US20080217167A9 APPARATUS AND METHODS FOR ELECTROCHEMICAL PROCESSING OF MICROELECTRONIC WORKPIECES 审中-公开
标题翻译：微电子工作电化学处理的装置和方法
公开(公告)号：US20080217167A9
公开(公告)日：2008-09-11
申请号：US11096630
申请日：2005-03-29
申请人： Kyle Hanson , Thomas Ritzdorf , Gregory Wilson , Paul McHugh
发明人： Kyle Hanson , Thomas Ritzdorf , Gregory Wilson , Paul McHugh
IPC分类号： C25C7/00
CPC分类号： H01L21/6719 , C25D7/123 , C25D17/001 , H01L21/67103 , H01L21/6723
摘要： An apparatus and method for electrochemical processing of microelectronic workpieces in a reaction vessel. In one embodiment, the reaction vessel includes: an outer container having an outer wall; a distributor coupled to the outer container, the distributor having a first outlet configured to introduce a primary flow into the outer container and at least one second outlet configured to introduce a secondary flow into the outer container separate from the primary flow; a primary flow guide in the outer container coupled to the distributor to receive the primary flow from the first outlet and direct it to a workpiece processing site; a dielectric field shaping unit in the outer container coupled to the distributor to receive the secondary flow from the second outlet, the field shaping unit being configured to contain the secondary flow separate from the primary flow through at least a portion of the outer container, and the field shaping unit having at least one electrode compartment through which the secondary flow can pass while the secondary flow is separate from the primary flow; an electrode in the electrode compartment; and an interface member carried by the field shaping unit downstream from the electrode, the interface member being in fluid communication with the secondary flow in the electrode compartment, and the interface member being configured to prevent selected matter of the secondary flow from passing to the primary flow.
摘要翻译：用于反应容器中微电子工件的电化学处理的装置和方法。在一个实施例中，反应容器包括：具有外壁的外容器; 分配器，其耦合到所述外部容器，所述分配器具有构造成将主流引入所述外部容器中的第一出口和构造成将二次流引导到与所述主流分离的所述外部容器中的至少一个第二出口; 外部容器中的主要流动引导件联接到分配器以接收来自第一出口的主流并将其引导到工件加工位置; 所述外容器中的电介质场成形单元联接到所述分配器以接收来自所述第二出口的二次流，所述场整形单元构造成容纳所述次流与所述主流分离通过所述外容器的至少一部分，以及所述场成形单元具有至少一个电极室，所述二次流可以通过所述至少一个电极室，而所述二次流与所述主流分离; 电极室中的电极; 以及由所述场成形单元承载在所述电极的下游的界面构件，所述界面构件与所述电极室中的所述次流体流体连通，并且所述界面构件被构造成防止所述二次流的选定物质通过所述主流流。

5. 发明申请

US20080217166A9 APPARATUS AND METHODS FOR ELECTROCHEMICAL PROCESSSING OF MICROELECTRONIC WORKPIECES 审中-公开
公开(公告)号：US20080217166A9
公开(公告)日：2008-09-11
申请号：US11096495
申请日：2005-03-29
申请人： Kyle Hanson , Thomas Ritzdorf , Gregory Wilson , Paul McHugh
发明人： Kyle Hanson , Thomas Ritzdorf , Gregory Wilson , Paul McHugh
IPC分类号： C25C7/00
CPC分类号： H01L21/6719 , C25D7/123 , C25D17/001 , H01L21/67103 , H01L21/6723
摘要： An apparatus and method for electrochemical processing of microelectronic workpieces in a reaction vessel. In one embodiment, the reaction vessel includes: an outer container having an outer wall; a distributor coupled to the outer container, the distributor having a first outlet configured to introduce a primary flow into the outer container and at least one second outlet configured to introduce a secondary flow into the outer container separate from the primary flow; a primary flow guide in the outer container coupled to the distributor to receive the primary flow from the first outlet and direct it to a workpiece processing site; a dielectric field shaping unit in the outer container coupled to the distributor to receive the secondary flow from the second outlet, the field shaping unit being configured to contain the secondary flow separate from the primary flow through at least a portion of the outer container, and the field shaping unit having at least one electrode compartment through which the secondary flow can pass while the secondary flow is separate from the primary flow; an electrode in the electrode compartment; and an interface member carried by the field shaping unit downstream from the electrode, the interface member being in fluid communication with the secondary flow in the electrode compartment, and the interface member being configured to prevent selected matter of the secondary flow from passing to the primary flow.

6. 发明申请

US20050205419A1 Apparatus and methods for electrochemical processsing of microelectronic workpieces 审中-公开
公开(公告)号：US20050205419A1
公开(公告)日：2005-09-22
申请号：US11096495
申请日：2005-03-29
申请人： Kyle Hanson , Thomas Ritzdorf , Gregory Wilson , Paul McHugh
发明人： Kyle Hanson , Thomas Ritzdorf , Gregory Wilson , Paul McHugh
IPC分类号： C25D7/12 , C10B1/00 , C25C7/00 , C25D3/00 , C25D5/00 , C25D17/00 , C25D21/00 , H01L21/00
CPC分类号： H01L21/6719 , C25D7/123 , C25D17/001 , H01L21/67103 , H01L21/6723
摘要： An apparatus and method for electrochemical processing of microelectronic workpieces in a reaction vessel. In one embodiment, the reaction vessel includes: an outer container having an outer wall; a distributor coupled to the outer container, the distributor having a first outlet configured to introduce a primary flow into the outer container and at least one second outlet configured to introduce a secondary flow into the outer container separate from the primary flow; a primary flow guide in the outer container coupled to the distributor to receive the primary flow from the first outlet and direct it to a workpiece processing site; a dielectric field shaping unit in the outer container coupled to the distributor to receive the secondary flow from the second outlet, the field shaping unit being configured to contain the secondary flow separate from the primary flow through at least a portion of the outer container, and the field shaping unit having at least one electrode compartment through which the secondary flow can pass while the secondary flow is separate from the primary flow; an electrode in the electrode compartment; and an interface member carried by the field shaping unit downstream from the electrode, the interface member being in fluid communication with the secondary flow in the electrode compartment, and the interface member being configured to prevent selected matter of the secondary flow from passing to the primary flow.

7. 发明申请

US20050109633A1 System for electrochemically processing a workpiece 审中-公开
公开(公告)号：US20050109633A1
公开(公告)日：2005-05-26
申请号：US10975202
申请日：2004-10-28
申请人： Gregory Wilson , Paul McHugh , Kyle Hanson
发明人： Gregory Wilson , Paul McHugh , Kyle Hanson
IPC分类号： C25D7/12 , B05C3/00 , B05C3/20 , B23H3/00 , C02F20060101 , C25B9/00 , C25C7/00 , C25D3/02 , C25D5/00 , C25D5/04 , C25D5/08 , C25D7/00 , C25D11/32 , C25D17/00 , C25D17/02 , C25D17/12 , C25D21/00
CPC分类号： C25D17/02 , C25D5/08 , C25D17/001 , Y10S204/07
摘要： A reactor for electrochemically processing at least one surface of a microelectronic workpiece is set forth. The reactor comprises a reactor head including a workpiece support that has one or more electrical contacts positioned to make electrical contact with the microelectronic workpiece. The reactor also includes a processing container having a plurality of nozzles angularly disposed in a sidewall of a principal fluid flow chamber at a level within the principal fluid flow chamber below a surface of a bath of processing fluid normally contained therein during electrochemical processing. A plurality of anodes are disposed at different elevations in the principal fluid flow chamber so as to place them at difference distances from a microelectronic workpiece under process without an intermediate diffuser between the plurality of anodes and the microelectronic workpiece under process. One or more of the plurality of anodes may be in close proximity to the workpiece under process. Still further, one or more of the plurality of anodes may be a virtual anode. The present invention also related to multi-level anode configurations within a principal fluid flow chamber and methods of using the same.

8. 发明申请

US20050061676A1 System for electrochemically processing a workpiece 审中-公开
公开(公告)号：US20050061676A1
公开(公告)日：2005-03-24
申请号：US10975857
申请日：2004-10-28
申请人： Gregory Wilson , Paul McHugh , Kyle Hanson
发明人： Gregory Wilson , Paul McHugh , Kyle Hanson
IPC分类号： C25B9/00 , C25C7/00 , C25D5/00 , C25D5/08 , C25D7/12 , C25F7/00
CPC分类号： C25D5/08 , C25D11/005 , C25D17/001 , C25D17/008 , C25D17/12 , C25F7/00
摘要： A reactor for electrochemically processing at least one surface of a microelectronic workpiece is set forth. The reactor comprises a reactor head including a workpiece support that has one or more electrical contacts positioned to make electrical contact with the microelectronic workpiece. The reactor also includes a processing container having a plurality of nozzles angularly disposed in a sidewall of a principal fluid flow chamber at a level within the principal fluid flow chamber below a surface of a bath of processing fluid normally contained therein during electrochemical processing. A plurality of anodes are disposed at different elevations in the principal fluid flow chamber so as to place them at difference distances from a microelectronic workpiece under process without an intermediate diffuser between the plurality of anodes and the microelectronic workpiece under process. One or more of the plurality of anodes may be in close proximity to the workpiece under process. Still further, one or more of the plurality of anodes may be a virtual anode. The present invention also related to multi-level anode configurations within a principal fluid flow chamber and methods of using the same.

9. 发明申请

US20050194248A1 Apparatus and methods for electrochemical processing of microelectronic workpieces 审中-公开
公开(公告)号：US20050194248A1
公开(公告)日：2005-09-08
申请号：US11096630
申请日：2005-03-29
申请人： Kyle Hanson , Thomas Ritzdorf , Gregory Wilson , Paul McHugh
发明人： Kyle Hanson , Thomas Ritzdorf , Gregory Wilson , Paul McHugh
IPC分类号： C25D7/12 , C10B1/00 , C25C7/00 , C25D3/00 , C25D5/00 , C25D17/00 , C25D21/00 , H01L21/00
CPC分类号： H01L21/6719 , C25D7/123 , C25D17/001 , H01L21/67103 , H01L21/6723
摘要： An apparatus and method for electrochemical processing of microelectronic workpieces in a reaction vessel. In one embodiment, the reaction vessel includes: an outer container having an outer wall; a distributor coupled to the outer container, the distributor having a first outlet configured to introduce a primary flow into the outer container and at least one second outlet configured to introduce a secondary flow into the outer container separate from the primary flow; a primary flow guide in the outer container coupled to the distributor to receive the primary flow from the first outlet and direct it to a workpiece processing site; a dielectric field shaping unit in the outer container coupled to the distributor to receive the secondary flow from the second outlet, the field shaping unit being configured to contain the secondary flow separate from the primary flow through at least a portion of the outer container, and the field shaping unit having at least one electrode compartment through which the secondary flow can pass while the secondary flow is separate from the primary flow; an electrode in the electrode compartment; and an interface member carried by the field shaping unit downstream from the electrode, the interface member being in fluid communication with the secondary flow in the electrode compartment, and the interface member being configured to prevent selected matter of the secondary flow from passing to the primary flow.

10. 发明申请

US20050189215A1 Apparatus and methods for electrochemical processing of microelectronic workpieces 有权
公开(公告)号：US20050189215A1
公开(公告)日：2005-09-01
申请号：US11096477
申请日：2005-03-29
申请人： Kyle Hanson , Thomas Ritzdorf , Gregory Wilson , Paul McHugh
发明人： Kyle Hanson , Thomas Ritzdorf , Gregory Wilson , Paul McHugh
IPC分类号： C10B1/00 , C25C7/00
CPC分类号： C25D17/001 , C25D5/18 , C25D7/123 , C25D17/10
摘要： An apparatus and method for electrochemical processing of microelectronic workpieces in a reaction vessel. In one embodiment, the reaction vessel includes: an outer container having an outer wall; a distributor coupled to the outer container, the distributor having a first outlet configured to introduce a primary flow into the outer container and at least one second outlet configured to introduce a secondary flow into the outer container separate from the primary flow; a primary flow guide in the outer container coupled to the distributor to receive the primary flow from the first outlet and direct it to a workpiece processing site; a dielectric field shaping unit in the outer container coupled to the distributor to receive the secondary flow from the second outlet, the field shaping unit being configured to contain the secondary flow separate from the primary flow through at least a portion of the outer container, and the field shaping unit having at least one electrode compartment through which the secondary flow can pass while the secondary flow is separate from the primary flow; an electrode in the electrode compartment; and an interface member carried by the field shaping unit downstream from the electrode, the interface member being in fluid communication with the secondary flow in the electrode compartment, and the interface member being configured to prevent selected matter of the secondary flow from passing to the primary flow.

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