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1. 发明申请

US20050132953A1 Edge dry manifold 有权
标题翻译：边缘干燥歧管
公开(公告)号：US20050132953A1
公开(公告)日：2005-06-23
申请号：US10745219
申请日：2003-12-22
申请人： Glenn Davis , Carl Woods , John Parks , Fred Redeker , Mike Ravkin , Michael Orbock
发明人： Glenn Davis , Carl Woods , John Parks , Fred Redeker , Mike Ravkin , Michael Orbock
IPC分类号： H01L21/00 , H01L21/687 , C30B23/00 , C30B25/00 , C30B28/12 , C30B28/14
CPC分类号： H01L21/67023 , H01L21/67028 , H01L21/67034 , H01L21/6704 , H01L21/68707
摘要： A apparatus for drying a substrate includes a vacuum manifold positioned adjacent to an edge wheel. The edge wheel includes an edge wheel groove for receiving a peripheral edge of a substrate, and the edge wheel is capable of rotating the substrate at a desired set velocity. The vacuum manifold includes a proximity end having one or more vacuum ports defined therein. The proximity end is positioned at least partially within the edge wheel groove, and using supplied vacuum removes fluids that accumulate in the edge wheel groove and prevents re-deposit of trapped fluids around the peripheral edge of the substrate.
摘要翻译：用于干燥衬底的设备包括邻近边缘轮定位的真空歧管。边缘轮包括用于接收基板周边的边缘轮槽，并且边缘轮能够以所需的设定速度旋转基板。真空歧管包括具有限定在其中的一个或多个真空端口的邻近端。邻近端部至少部分地定位在边缘轮槽内，并且使用提供的真空去除积聚在边缘轮槽中的流体并且防止捕获的流体围绕衬底的周边边缘重新沉积。

2. 发明申请

US20060207636A1 Multi-menisci processing apparatus 失效
标题翻译：多功能加工设备
公开(公告)号：US20060207636A1
公开(公告)日：2006-09-21
申请号：US11437891
申请日：2006-05-18
申请人： James Garcia , Mike Ravkin , Carl Woods , Fred Redeker , John de Larios
发明人： James Garcia , Mike Ravkin , Carl Woods , Fred Redeker , John de Larios
IPC分类号： B08B3/00 , B08B3/12
CPC分类号： C25D5/22 , B08B3/04 , C25D17/001 , H01L21/67028 , H01L21/67034 , H01L21/67051 , H01L21/68707 , Y10S134/902
摘要： A substrate preparation apparatus is provided. The apparatus includes a housing configured to be installed in a substrate fabrication facility. The housing includes a manifold for use in preparing a wafer surface. The manifold is configured to include a first process window in a first portion of the manifold. A first fluid meniscus is capable of being defined within the first process window. Further included is a second process window in a second portion of the manifold. A second fluid meniscus is capable of being defined within the second process window. An arm is integrated with the housing, and the arm is coupled to the manifold, such that the arm is capable of positioning the manifold in proximity with the substrate during operation. The apparatus therefore provides for the formation of multi-menisci over the surface of a substrate using a single manifold.
摘要翻译：提供了基板制备装置。该装置包括构造成安装在基板制造设备中的壳体。壳体包括用于制备晶片表面的歧管。歧管被配置为在歧管的第一部分中包括第一过程窗口。第一流体弯液面能够在第一过程窗口内被定义。还包括在歧管的第二部分中的第二处理窗口。能够在第二过程窗口内限定第二流体弯月面。臂与壳体一体化，并且臂联接到歧管，使得臂在操作期间能够将歧管定位在基板附近。因此，该装置提供了使用单个歧管在基板的表面上形成多重半月板。

3. 发明申请

US20060285930A1 Method and apparatus for transporting a substrate using non-Newtonian fluid 失效
标题翻译：使用非牛顿流体输送基材的方法和装置
公开(公告)号：US20060285930A1
公开(公告)日：2006-12-21
申请号：US11154129
申请日：2005-06-15
申请人： John de Larios , Mike Ravkin , John Parks , Mikhail Korolik , Fred Redeker
发明人： John de Larios , Mike Ravkin , John Parks , Mikhail Korolik , Fred Redeker
IPC分类号： B65G53/00
CPC分类号： H01L21/67784 , H01L21/67057
摘要： A method for transporting a substrate is provided. In this method, a non-Newtonian fluid is provided and the substrate is suspended in the non-Newtonian fluid. The non-Newtonian fluid is capable of supporting the substrate. Thereafter, a supply force is applied on the non-Newtonian fluid to cause the non-Newtonian fluid to flow, whereby the flow is capable of moving the substrate along a direction of the flow. Apparatuses and systems for transporting the substrate using the non-Newtonian fluid also are described.
摘要翻译：提供了一种输送基板的方法。在该方法中，提供了非牛顿流体，并将基底悬挂在非牛顿流体中。非牛顿流体能够支撑基底。此后，向非牛顿流体施加供应力以使非牛顿流体流动，由此流动能够沿着流动方向移动基底。还描述了使用非牛顿流体输送基底的装置和系统。

4. 发明申请

US20060260932A1 Apparatus and method for depositing and planarizing thin films of semiconductor wafers 失效
标题翻译：用于沉积和平坦化半导体晶片的薄膜的装置和方法
公开(公告)号：US20060260932A1
公开(公告)日：2006-11-23
申请号：US11494997
申请日：2006-07-28
申请人： Mike Ravkin , John Boyd , Yezdi Dordi , Fred Redeker , John deLarios
发明人： Mike Ravkin , John Boyd , Yezdi Dordi , Fred Redeker , John deLarios
IPC分类号： C25D17/00
CPC分类号： C25D17/10 , C25D5/026 , C25D5/22 , C25D7/123 , C25D17/001 , H01L21/2885 , H01L21/67028 , H01L21/67034 , H01L21/67051
摘要： An electroplating apparatus for depositing a metallic layer on a surface of a wafer is provided. In one example, a proximity head capable of being electrically charged as an anode is placed in close proximity to the surface of the wafer. A plating fluid is provided between the wafer and the proximity head to create localized metallic plating.
摘要翻译：提供了一种用于在晶片的表面上沉积金属层的电镀设备。在一个示例中，能够被充电作为阳极的接近头放置在紧邻晶片表面的位置。在晶片和邻近头之间提供电镀液以产生局部金属电镀。

5. 发明申请

US20080105277A1 Methods of proximity head brushing 失效
标题翻译：接近头刷的方法
公开(公告)号：US20080105277A1
公开(公告)日：2008-05-08
申请号：US12008552
申请日：2008-01-11
申请人： John Boyd , Michael Orbock , Fred Redeker
发明人： John Boyd , Michael Orbock , Fred Redeker
IPC分类号： B08B1/00
CPC分类号： H01L21/67046 , Y10S134/902
摘要： A wafer preparation method is provided for producing a wet region and then a corresponding dry region on the wafer. Brushing produces the wet region on the wafer. As the brushing moves in a selected scan operation across the wafer, a generating operation forms a meniscus that follows the brushing and dries the wet region. The generating operation produces the meniscus at least partially surrounding the wet region scrubbed by the scrubbing. The controlled meniscus is formed by applying fluid to the surface of the wafer and simultaneously removing the fluid. The scan operations may be selected so the brushing scrubs the wet region and then the meniscus forms the dry region where the scrubbing took place. The scan operations include a radial scan, a linear scan, a spiral scan and a raster scan.
摘要翻译：提供晶片制备方法，用于在晶片上产生湿区域，然后产生相应的干燥区域。刷子在晶片上产生湿区域。当刷洗在晶片上的选择的扫描操作中移动时，产生操作形成跟随刷牙并干燥湿区域的弯液面。生成操作产生弯液面，至少部分地围绕通过洗涤擦洗的湿区域。受控的弯液面通过将流体施加到晶片的表面并同时去除流体而形成。可以选择扫描操作，使得刷洗擦洗湿区域，然后弯液面形成擦洗发生的干燥区域。扫描操作包括径向扫描，线性扫描，螺旋扫描和光栅扫描。

6. 发明申请

US20060283486A1 Method and apparatus for cleaning a substrate using non-newtonian fluids 有权
标题翻译：使用非牛顿流体清洗基材的方法和设备
公开(公告)号：US20060283486A1
公开(公告)日：2006-12-21
申请号：US11153957
申请日：2005-06-15
申请人： John de Larios , Mike Ravkin , Jeffrey Farber , Mikhail Korolik , Fred Redeker
发明人： John de Larios , Mike Ravkin , Jeffrey Farber , Mikhail Korolik , Fred Redeker
IPC分类号： B08B3/00
CPC分类号： H01L21/67057 , B08B3/003 , B08B7/0014 , C11D7/5004 , C11D11/0047 , H01L21/02057 , H01L21/67051 , Y10S134/902
摘要： A method for cleaning a substrate is provided. In this method, a flow of non-Newtonian fluid is provided where at least a portion of the flow exhibits plug flow. To remove particles from a surface of the substrate, the surface of the substrate is placed in contact with the portion of the flow that exhibits plug flow such that the portion of the flow exhibiting plug flow moves over the surface of the substrate. Additional methods and apparatuses for cleaning a substrate also are described.
摘要翻译：提供一种清洗基板的方法。在该方法中，提供了非牛顿流体的流动，其中至少一部分流动呈现出流动。为了从基板的表面去除颗粒，将基板的表面与显示塞子流的流动部分接触，使得显示塞子流的流动部分在基板的表面上移动。还描述了用于清洁基板的附加方法和装置。

7. 发明申请

US20050132515A1 Proximity brush unit apparatus and method 失效
标题翻译：接近刷单元装置和方法
公开(公告)号：US20050132515A1
公开(公告)日：2005-06-23
申请号：US10742303
申请日：2003-12-18
申请人： John Boyd , Michael Orbock , Fred Redeker
发明人： John Boyd , Michael Orbock , Fred Redeker
IPC分类号： H01L21/00 , B08B1/04
CPC分类号： H01L21/67046 , Y10S134/902
摘要： An apparatus is provided for producing a wet region and corresponding dry region on a wafer. A proximity brush unit delivers fluids with a rotatable brush to produce the wet region on the wafer. As the proximity brush unit moves in a selected scan method across the wafer, a plurality of ports produces the dry region on the wafer. Further, the rotatable brush disposed within the proximity brush unit can rotate via mechanical gears or electromagnetic levitation. The selected scan method that produces the wet region and the dry region moves the proximity brush unit in a variety of methods including a radial scan, a linear scan, a spiral scan and a raster scan. To further produce a dry region during the selected scan method, the plurality of ports disposed on the surface of the proximity brush unit is on the trailing edges of the proximity head unit and the wafer.
摘要翻译：提供了一种用于在晶片上产生湿区域和相应的干燥区域的装置。接近刷单元用可旋转的刷子输送流体以在晶片上产生湿区域。当接近刷单元以选定的扫描方法移动跨越晶片时，多个端口在晶片上产生干燥区域。此外，设置在接近刷单元内的可旋转刷可以经由机械齿轮或电磁悬浮来旋转。产生湿区域和干燥区域的选择的扫描方法以包括径向扫描，线性扫描，螺旋扫描和光栅扫描的各种方法移动接近刷单元。为了在所选择的扫描方法期间进一步产生干燥区域，设置在接近刷单元表面上的多个端口位于邻近头单元和晶片的后缘。

8. 发明申请

US20070011905A1 Methods and systems for processing a substrate using a dynamic liquid meniscus 失效
标题翻译：使用动态液体弯月面处理衬底的方法和系统
公开(公告)号：US20070011905A1
公开(公告)日：2007-01-18
申请号：US11525278
申请日：2006-09-21
申请人： James Garcia , John de Larios , Michael Ravkin , Fred Redeker , Carl Woods
发明人： James Garcia , John de Larios , Michael Ravkin , Fred Redeker , Carl Woods
IPC分类号： F26B7/00 , F26B5/04
CPC分类号： C25D5/22 , C25D7/12 , H01L21/67028 , H01L21/67034 , H01L21/67051 , H01L21/68707 , Y10S134/902
摘要： A system and method of moving a meniscus from a first surface to a second surface includes forming a meniscus between a head and a first surface. The meniscus can be moved from the first surface to an adjacent second surface, the adjacent second surface being parallel to the first surface. The system and method of moving the meniscus can also be used to move the meniscus along an edge of a substrate.
摘要翻译：将弯液面从第一表面移动到第二表面的系统和方法包括在头部和第一表面之间形成弯液面。弯液面可以从第一表面移动到相邻的第二表面，相邻的第二表面平行于第一表面。移动弯液面的系统和方法也可以用于沿着基板的边缘移动弯月面。

9. 发明申请

US20060150435A1 Methods and systems for processing a substrate using a dynamic liquid meniscus 有权
公开(公告)号：US20060150435A1
公开(公告)日：2006-07-13
申请号：US11318019
申请日：2005-12-22
申请人： James Garcia , John de Larios , Michael Ravkin , Fred Redeker , Carl Woods
发明人： James Garcia , John de Larios , Michael Ravkin , Fred Redeker , Carl Woods
IPC分类号： F26B7/00 , F26B17/30 , F26B5/04
CPC分类号： C25D5/22 , C25D7/12 , H01L21/67028 , H01L21/67034 , H01L21/67051 , H01L21/68707 , Y10S134/902
摘要： A system and method of moving a meniscus from a first surface to a second surface includes forming a meniscus between a head and a first surface. The meniscus can be moved from the first surface to an adjacent second surface, the adjacent second surface being parallel to the first surface. The system and method of moving the meniscus can also be used to move the meniscus along an edge of a substrate.

10. 发明申请

US20050284767A1 Method and apparatus for plating semiconductor wafers 有权
标题翻译：用于电镀半导体晶片的方法和装置
公开(公告)号：US20050284767A1
公开(公告)日：2005-12-29
申请号：US10879263
申请日：2004-06-28
申请人： Yezdi Dordi , Bob Maraschin , John Boyd , Fred Redeker , Carl Woods
发明人： Yezdi Dordi , Bob Maraschin , John Boyd , Fred Redeker , Carl Woods
IPC分类号： C25D7/12 , H01L21/288
CPC分类号： C25D17/14 , C25D5/06 , C25D7/123 , C25D17/001 , C25D17/12 , H01L21/2885
摘要： First and second electrodes are disposed at first and second locations, respectively, proximate to a periphery of a wafer support, wherein the first and second location are substantially opposed to each other relative to the wafer support. Each of the first and second electrodes can be moved to electrically connect with and disconnect from a wafer held by the wafer support. An anode is disposed over and proximate to the wafer such that a meniscus of electroplating solution is maintained between the anode and the wafer. As the anode moves over the wafer from the first location to the second location, an electric current is applied through the meniscus between the anode and the wafer. Also, as the anode is moved over the wafer, the first and second electrodes are controlled to connect with the wafer while ensuring that the anode does not pass over an electrode that is connected.
摘要翻译：第一和第二电极分别设置在靠近晶片支撑件的周边的第一和第二位置处，其中第一和第二位置相对于晶片支撑件彼此基本相对。可以使第一和第二电极中的每一个移动以与由晶片支撑件保持的晶片电连接和断开。阳极设置在晶片上方并且靠近晶片，使得电镀溶液的弯液面保持在阳极和晶片之间。当阳极从晶片从第一位置移动到第二位置时，通过阳极和晶片之间的弯液面施加电流。此外，当阳极移动到晶片上时，第一和第二电极被控制以与晶片连接，同时确保阳极不通过连接的电极。

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