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    • 5. 发明授权
    • Process for forming device comprising metallized magnetic substrates
    • 用于形成包括金属化磁性基底的装置的方法
    • US6153078A
    • 2000-11-28
    • US369105
    • 1999-08-05
    • Debra Anne FlemingGideon S. GraderDavid Wilfred Johnson, Jr.Vincent George Lambrecht, Jr.John Thomson, Jr.
    • Debra Anne FlemingGideon S. GraderDavid Wilfred Johnson, Jr.Vincent George Lambrecht, Jr.John Thomson, Jr.
    • C25D5/02C25D7/00H01F17/00H01F41/04H01F41/16H05K1/16H05K3/42H05K3/46
    • C25D7/001C25D5/022H01F41/043H01F41/046H01F41/16H01F17/0033
    • The invention provides an improved process for fabricating devices containing metallized magnetic ceramic material, such as inductors, transformers, and magnetic substrates. In particular, the unique vias utilized in the process of the invention allow fabrication of devices from multiple unfired ferrite layers with only a single via-coating step, thereby avoiding the need numerous punching steps. Moreover, there is no need for expanding the dimensions of the vias and thus no need for internal metallization. The invention therefore provides for green tape-type fabrication of devices such as inductors, transformers, and magnetic substrates in a manner faster, less complex, and more reliable than current methods. The invention also relates to use of an improved conductive material in such a process, the conductive material containing silver/palladium particles, ferrite particles, a cellulose-based or other organic binder, and a solvent. After firing of the substrate onto which the ink has been coated, and plating of copper thereon by a copper pyrophosphate bath, the plated copper exhibits a pull strength greater than about 4 kpsi, advantageously greater than about 5 kpsi. Use of a copper pyrophosphate bath also allow uniform plating within long, narrow vias.
    • 本发明提供了一种用于制造包含金属化磁性陶瓷材料的器件的改进方法,例如电感器,变压器和磁性衬底。 特别地,在本发明的方法中使用的唯一的通孔允许仅通过单个通孔涂覆步骤从多个未烧制的铁氧体层制造器件,从而避免了需要大量的冲压步骤。 此外,不需要扩大通孔的尺寸,因此不需要内部金属化。 因此,本发明以比当前方法更快,更不复杂和更可靠的方式提供诸如电感器,变压器和磁性基板的器件的绿色带状制造。 本发明还涉及在这种方法中使用改进的导电材料,所述导电材料含有银/钯颗粒,铁氧体颗粒,纤维素基或其它有机粘合剂和溶剂。 在其上涂覆有油墨的基材烧制之后,并通过焦磷酸铜浴将铜镀覆在其上,镀铜显示出大于约4kpsi的拉伸强度,有利地大于约5kpsi。 使用焦磷酸铜浴还可以在长而窄的通孔内均匀镀覆。