专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06716488B2 Ferrite film formation method 有权
标题翻译：铁素体成膜方法
公开(公告)号：US06716488B2
公开(公告)日：2004-04-06
申请号：US09887938
申请日：2001-06-22
申请人： Debra Anne Fleming , Gideon S. Grader , David Wilfred Johnson, Jr. , John Thomson, Jr. , Robert Bruce Van Dover
发明人： Debra Anne Fleming , Gideon S. Grader , David Wilfred Johnson, Jr. , John Thomson, Jr. , Robert Bruce Van Dover
IPC分类号： H01F100
CPC分类号： H01F41/24 , B82Y30/00 , C03C17/25 , C03C2217/216 , C03C2217/217 , C03C2217/23 , C04B41/009 , C04B41/5036 , C04B41/87 , C04B2111/00422 , C04B41/4543 , C04B41/455 , C04B35/10
摘要： A ferrite layer formation process that may be performed at a lower temperature than conventional ferrite formation processes. The formation process may produce highly anisotropic structures. A ferrite layer is deposited on a substrate while the substrate is exposed to a magnetic field. An intermediate layer may be positioned between the substrate and the ferrite to promote bonding of the ferrite to the substrate. The process may be performed at temperatures less than 300° C. Ferrite film anisotropy may be achieved by embodiments of the invention in the range of about 1000 dyn-cm/cm3 to about 2×106 dyn-cm/cm3.
摘要翻译：可以在比常规铁素体形成工艺更低的温度下进行的铁素体层形成工艺。形成过程可能产生高度各向异性的结构。在衬底暴露于磁场的同时，在衬底上沉积铁素体层。中间层可以位于基底和铁素体之间，以促进铁素体与基底的结合。该方法可以在低于300℃的温度下进行。铁氧体膜各向异性可以通过本发明的实施方案在约1000dyncm -1 / cm 3至约2×10 6 dyn-cm / cm 3的范围内实现。 3>。

2. 发明授权

US6153078A Process for forming device comprising metallized magnetic substrates 有权
标题翻译：用于形成包括金属化磁性基底的装置的方法
公开(公告)号：US6153078A
公开(公告)日：2000-11-28
申请号：US369105
申请日：1999-08-05
申请人： Debra Anne Fleming , Gideon S. Grader , David Wilfred Johnson, Jr. , Vincent George Lambrecht, Jr. , John Thomson, Jr.
发明人： Debra Anne Fleming , Gideon S. Grader , David Wilfred Johnson, Jr. , Vincent George Lambrecht, Jr. , John Thomson, Jr.
IPC分类号： C25D5/02 , C25D7/00 , H01F17/00 , H01F41/04 , H01F41/16 , H05K1/16 , H05K3/42 , H05K3/46
CPC分类号： C25D7/001 , C25D5/022 , H01F41/043 , H01F41/046 , H01F41/16 , H01F17/0033
摘要： The invention provides an improved process for fabricating devices containing metallized magnetic ceramic material, such as inductors, transformers, and magnetic substrates. In particular, the unique vias utilized in the process of the invention allow fabrication of devices from multiple unfired ferrite layers with only a single via-coating step, thereby avoiding the need numerous punching steps. Moreover, there is no need for expanding the dimensions of the vias and thus no need for internal metallization. The invention therefore provides for green tape-type fabrication of devices such as inductors, transformers, and magnetic substrates in a manner faster, less complex, and more reliable than current methods. The invention also relates to use of an improved conductive material in such a process, the conductive material containing silver/palladium particles, ferrite particles, a cellulose-based or other organic binder, and a solvent. After firing of the substrate onto which the ink has been coated, and plating of copper thereon by a copper pyrophosphate bath, the plated copper exhibits a pull strength greater than about 4 kpsi, advantageously greater than about 5 kpsi. Use of a copper pyrophosphate bath also allow uniform plating within long, narrow vias.
摘要翻译：本发明提供了一种用于制造包含金属化磁性陶瓷材料的器件的改进方法，例如电感器，变压器和磁性衬底。特别地，在本发明的方法中使用的唯一的通孔允许仅通过单个通孔涂覆步骤从多个未烧制的铁氧体层制造器件，从而避免了需要大量的冲压步骤。此外，不需要扩大通孔的尺寸，因此不需要内部金属化。因此，本发明以比当前方法更快，更不复杂和更可靠的方式提供诸如电感器，变压器和磁性基板的器件的绿色带状制造。本发明还涉及在这种方法中使用改进的导电材料，所述导电材料含有银/钯颗粒，铁氧体颗粒，纤维素基或其它有机粘合剂和溶剂。在其上涂覆有油墨的基材烧制之后，并通过焦磷酸铜浴将铜镀覆在其上，镀铜显示出大于约4kpsi的拉伸强度，有利地大于约5kpsi。使用焦磷酸铜浴还可以在长而窄的通孔内均匀镀覆。

3. 发明授权

US6007758A Process for forming device comprising metallized magnetic substrates 失效
公开(公告)号：US6007758A
公开(公告)日：1999-12-28
申请号：US21500
申请日：1998-02-10
申请人： Debra Anne Fleming , Gideon S. Grader , David Wilfred Johnson, Jr. , Vincent George Lambrecht, Jr. , John Thomson, Jr.
发明人： Debra Anne Fleming , Gideon S. Grader , David Wilfred Johnson, Jr. , Vincent George Lambrecht, Jr. , John Thomson, Jr.
IPC分类号： C25D5/02 , C25D7/00 , H01F17/00 , H01F41/04 , H01F41/16 , H05K1/16 , H05K3/42 , H05K3/46 , B29C65/02
CPC分类号： C25D7/001 , C25D5/022 , H01F41/043 , H01F41/046 , H01F41/16 , H01F17/0033
摘要： The invention provides an improved process for fabricating devices containing metallized magnetic ceramic material, such as inductors, transformers, and magnetic substrates. In particular, the unique vias utilized in the process of the invention allow fabrication of devices from multiple unfired ferrite layers with only a single via-coating step, thereby avoiding the need numerous punching steps. Moreover, there is no need for expanding the dimensions of the vias and thus no need for internal metallization. The invention therefore provides for green tape-type fabrication of devices such as inductors, transformers, and magnetic substrates in a manner faster, less complex, and more reliable than current methods. The invention also relates to use of an improved conductive material in such a process, the conductive material containing silver/palladium particles, ferrite particles, a cellulose-based or other organic binder, and a solvent. After firing of the substrate onto which the ink has been coated, and plating of copper thereon by a copper pyrophosphate bath, the plated copper exhibits a pull strength greater than about 4 kpsi, advantageously greater than about 5 kpsi. Use of a copper pyrophosphate bath also allow uniform plating within long, narrow vias.

4. 发明授权

US5802702A Method of making a device including a metallized magnetic substrate 失效
标题翻译：制造包括金属化磁性基板的装置的方法
公开(公告)号：US5802702A
公开(公告)日：1998-09-08
申请号：US923591
申请日：1997-09-04
申请人： Debra Anne Fleming , David Wilfred Johnson, Jr. , Vincent George Lambrecht, Jr. , Henry Hon Law , David Joseph Liptack , Apurba Roy , John Thomson, Jr.
发明人： Debra Anne Fleming , David Wilfred Johnson, Jr. , Vincent George Lambrecht, Jr. , Henry Hon Law , David Joseph Liptack , Apurba Roy , John Thomson, Jr.
IPC分类号： H01F17/00 , H01F41/04 , H01L21/48 , H05K1/03 , H05K1/09 , H05K1/11 , H05K3/00 , H05K3/24 , H05K3/40
CPC分类号： H01F17/0033 , H01F41/046 , H01L21/486 , H05K1/115 , H05K3/403 , H01F2017/004 , H05K1/0306 , H05K1/092 , H05K2201/09645 , H05K2201/09854 , H05K2203/1476 , H05K3/005 , H05K3/245 , H05K3/4061 , Y10T29/4902 , Y10T29/49076 , Y10T29/49165
摘要： The method of making a metallized magnetic substrate for devices including a magnetic component involves providing an unfired ceramic body. In one exemplary embodiment, the method further involves making one or more vias through the ceramic body, coating the via side walls with conductive material, forming an aperture through the ceramic body, such that an aperture edge intersects the via, and metallizing the unfired ceramic body such that a conductive pathway is formed that includes the conductive material in the via. Finally, the metallized unfired ceramic body is fired in conventional fashion, optionally followed by deposition of additional conductor material.
摘要翻译：制造包括磁性部件的装置的金属化磁性基板的方法包括提供未烧结的陶瓷体。在一个示例性实施例中，该方法还包括制造通过陶瓷体的一个或多个通孔，用导电材料涂覆通孔侧壁，通过陶瓷体形成孔，使得孔边缘与通孔相交，并且对未烧结的陶瓷进行金属化使得形成导电路径，其包括通孔中的导电材料。最后，金属化未焙烧陶瓷体以常规方式烧制，任选地随后沉积另外的导体材料。

5. 发明授权

US5349743A Method of making a multilayer monolithic magnet component 失效
标题翻译：制造多层单片磁铁部件的方法
公开(公告)号：US5349743A
公开(公告)日：1994-09-27
申请号：US695653
申请日：1991-05-02
申请人： Gideon S. Grader , David W. Johnson, Jr. , Apurba Roy , John Thomson, Jr.
发明人： Gideon S. Grader , David W. Johnson, Jr. , Apurba Roy , John Thomson, Jr.
IPC分类号： H01F1/37 , H01F17/00 , H01F27/255 , H01F27/28 , H01F41/02 , H01F41/04 , H01F41/16
CPC分类号： H01F41/16 , H01F17/0033 , Y10T29/4902
摘要： Magnetic components are fabricated as monolithic structures using multilayer co-fired ceramic tape techniques. Fabrication of these magnetic components involves constructing multiple layers of a magnetic material and an insulating non-magnetic mataerial to form a monolithic structure with well defined magnetic and insulating non-magnetic regions. Windings are formed using screen printed conductors connected through the multilayer structure by conducting vias.
摘要翻译：使用多层共烧陶瓷带技术将磁性部件制成为整体式结构。这些磁性部件的制造涉及构造多层磁性材料和绝缘非磁性材料以形成具有良好限定的磁性和绝缘非磁性区域的整体结构。通过导电通孔，通过多层结构连接的丝网印刷导体形成绕线。

6. 发明授权

US5479695A Method of making a multilayer monolithic magnetic component 失效
标题翻译：制造多层单片磁性部件的方法
公开(公告)号：US5479695A
公开(公告)日：1996-01-02
申请号：US270197
申请日：1994-07-01
申请人： Gideon S. Grader , David W. Johnson, Jr. , Apurba Roy , John Thomson, Jr.
发明人： Gideon S. Grader , David W. Johnson, Jr. , Apurba Roy , John Thomson, Jr.
IPC分类号： H01F1/37 , H01F17/00 , H01F27/255 , H01F27/28 , H01F41/02 , H01F41/04 , H01F41/16
CPC分类号： H01F41/16 , H01F17/0033 , Y10T29/4902
摘要： Magnetic components are fabricated as monolithic structures using multilayer co-fired ceramic tape techniques. Fabrication of these magnetic components involves constructing multiple layers of a magnetic material and an insulating non-magnetic material to form a monolithic structure with well defined magnetic and insulating non-magnetic regions. Windings are formed using screen printed conductors connected through the multilayer structure by conducting vias.
摘要翻译：使用多层共烧陶瓷带技术将磁性部件制成为整体式结构。这些磁性部件的制造涉及构造多层磁性材料和绝缘非磁性材料，以形成具有良好限定的磁性和绝缘非磁性区域的整体结构。通过导电通孔，通过多层结构连接的丝网印刷导体形成绕线。

7. 发明授权

US5914437A Fabrication including sol-gel float processing 失效
标题翻译：包括溶胶 - 凝胶浮法加工的制作
公开(公告)号：US5914437A
公开(公告)日：1999-06-22
申请号：US880319
申请日：1997-06-23
申请人： Edwin Arthur Chandross , David Wilfred Johnson, Jr. , John Burnette MacChesney , Eliezer M. Rabinovich , John Thomson, Jr.
发明人： Edwin Arthur Chandross , David Wilfred Johnson, Jr. , John Burnette MacChesney , Eliezer M. Rabinovich , John Thomson, Jr.
IPC分类号： C01B13/32 , C03B8/02 , C03B19/12 , C03C3/06 , C04B35/624 , C03B8/00
CPC分类号： C03B19/12 , C04B35/624 , Y02P40/57
摘要： Cracking in thin sheets of sol-gel-produced material is avoided by use of a support liquid during gelation and drying. Silica glass, as well as other glass and ceramic bodies, is contemplated.
摘要翻译：在凝胶化和干燥过程中，通过使用支持液来避免溶胶凝胶生产的材料薄片的破裂。预期二氧化硅玻璃以及其它玻璃和陶瓷体。

8. 发明授权

US5877666A Stackable, passively-tunable, cost-reduced inductor 失效
标题翻译：可堆叠，被动调谐，成本降低的电感
公开(公告)号：US5877666A
公开(公告)日：1999-03-02
申请号：US815618
申请日：1997-03-12
申请人： David Wilfred Johnson, Jr. , David A. Norte , John Thomson, Jr.
发明人： David Wilfred Johnson, Jr. , David A. Norte , John Thomson, Jr.
IPC分类号： H01F17/00 , H01F17/06 , H01F27/28 , H01F17/30
CPC分类号： H01F17/0006 , H01F17/062
摘要： An inductor (100) optimized for surface-mount vacuum-pickup automated circuit assembly eliminates the expense of an inductor housing. The inductor has a hollow rectangular ferrite core (101) and a winding defined by a stripline (102) deposited on the core surface. Winding ends are formed by conductive vias (103) in the core that open onto the core surface, where they connect and mount the inductor to a circuit board (150). A flat sheet (104) adhered to one face of the core provides a surface for vacuum pickup and for labeling of the inductor. The core of a passively tuneable inductor (200) defines multiple unconnected winding segments (102-103). Segment ends mount the inductor to the circuit board and connect the segments to circuit board striplines (254) that are laid out in a pattern to interconnect a number of the segments into a winding. The inductor is tuned by changing the stripline layout and thereby varying the number of interconnected segments. The core of an electromagnetic interference choke (300) defines two windings wound axially in parallel and radially in opposite directions. The core of a choke (500) that permits stacked mounting defines additional conductive vias (503) for connecting the windings of a second choke (300) mounted on the core to the circuit board. For electromagnetic isolation, the windings of the two chokes are oriented orthogonally to each other.
摘要翻译：为表面贴装真空拾取自动化电路组件而优化的电感器（100）消除了电感器外壳的费用。电感器具有中空矩形铁氧体磁芯（101）和由沉积在磁芯表面上的带状线（102）限定的绕组。卷绕端由芯体中的导电通路（103）形成，该通孔穿过芯体表面，其中它们将电感器连接并安装到电路板（150）上。粘附在芯的一个表面上的平板（104）提供用于真空吸收和用于标记电感器的表面。可调谐电感器（200）的核心限定多个未连接的绕组段（102-103）。段末端将电感器安装到电路板上，并将这些段连接到以图案布置的电路板带状线（254），以将多个段互连成一个绕组。通过改变带状线布局并因此改变互连段的数量来调整电感器。电磁干扰扼流圈（300）的核心限定了沿相反方向平行并径向缠绕的两个绕组。允许堆叠安装的扼流器（500）的核心定义了用于将安装在芯上的第二扼流器（300）的绕组连接到电路板的附加导电通孔（503）。对于电磁隔离，两个扼流圈的绕组彼此正交定向。

9. 发明授权

US5861790A Stackable and cost-reduced transformer with embedded EMI filters 失效
标题翻译：具有嵌入式EMI滤波器的可堆叠和成本降低的变压器
公开(公告)号：US5861790A
公开(公告)日：1999-01-19
申请号：US820325
申请日：1997-03-12
申请人： David Wilfred Johnson, Jr. , David A. Norte , John Thomson, Jr.
发明人： David Wilfred Johnson, Jr. , David A. Norte , John Thomson, Jr.
IPC分类号： H01F27/28 , H01F17/04 , H01F19/00 , H01F27/06 , H01F27/255 , H01F27/29 , H01F5/00
CPC分类号： H01F27/292 , H01F17/043 , H05K1/0233 , H05K1/18 , H05K2201/1003
摘要： A transformer (FIG. 1) optimized for surface-mount vacuum-pickup automated circuit assembly eliminates the expense of a transformer housing. The transformer has a ferrite body (100) that defines a pair of wells (208, 209) each opening onto an opposite face (108, 109) of the ferrite body. Transformer primary and secondary windings are wound in a coil (103) through slots (210, 211) around a transformer core (204) at the bottom of the wells. The windings do not protrude from the wells beyond the faces, resulting in flat faces. A first plurality of conductive vias (104-106), one pair for each winding, are completely embedded in the ferrite body and extend to both of the faces. Each pair of vias serves at one face to attach to the winding and at the other face to attach to solder pods of a PC board. The embedded vias also serve as EMI filters. A plate (107) covers the one face and provides a surface for vacuum pickup and for labeling of the transformer. The ferrite body (500) of a first transformer (FIG. 5) adapted for stacked mounting of transformers dispenses with the flat plate and further defines a second plurality of pairs of conductive vias (104-106). These vias are not connected to the first transformer's windings, but rather are positioned for connection to the winding-connected first pairs of vias of a second transformer that is positioned orthogonally to and mounted on the first transformer at the one of the faces.
摘要翻译：为表面贴装真空拾取自动化电路组件而优化的变压器（图1）消除了变压器外壳的费用。该变压器具有铁氧体本体（100），该铁氧体本体（100）限定了一对孔（208,209），每一个孔都开到铁氧体本体的相对面（108,109）上。变压器初级和次级绕组通过在井的底部的变压器芯（204）周围的槽（210,211）缠绕在线圈（103）中。绕组不会从孔之外突出，导致平面。对于每个绕组，第一组多个导电通孔（104-106）完全嵌入铁氧体中并延伸到两个面。每对通孔在一个面上起作用以连接到绕组上，而在另一个面上连接到PC板的焊盘。嵌入式通孔也可用作EMI滤波器。板（107）覆盖一个面并且提供用于真空拾取和变压器标签的表面。适用于堆叠安装变压器的第一变压器（图5）的铁氧体（500）免除平板，并进一步限定第二组多对导电通孔（104-106）。这些通孔不连接到第一变压器的绕组，而是被定位成连接到第二变压器的绕组连接的第一对通孔，该第二变压器的一个面正交于第一变压器并且安装在第一变压器上。

10. 发明授权

US5725938A Metallization of ceramic through application of an adherent reducible layer 失效
标题翻译：金属化的陶瓷通过应用粘附可还原层
公开(公告)号：US5725938A
公开(公告)日：1998-03-10
申请号：US699515
申请日：1996-08-29
申请人： Sungho Jin , David Wilfred Johnson, Jr. , Henry Hon Law , John Thomson, Jr. , Thomas Henry Tiefel
发明人： Sungho Jin , David Wilfred Johnson, Jr. , Henry Hon Law , John Thomson, Jr. , Thomas Henry Tiefel
IPC分类号： H05K1/16 , C04B41/45 , C04B41/51 , C04B41/52 , C04B41/81 , C04B41/85 , C04B41/88 , C04B41/89 , H01L39/24 , H01L41/22 , H05K1/03 , H05K3/10 , H05K3/12 , B32B3/00 , B22F3/00 , B32B9/06 , B32B15/00
CPC分类号： C04B41/009 , C04B41/4558 , C04B41/51 , C04B41/52 , C04B41/81 , C04B41/88 , C04B41/89 , H01L39/2474 , H01L41/29 , H05K3/105 , C04B2111/00844 , H05K1/0306 , Y10S428/901 , Y10T428/12007 , Y10T428/12493 , Y10T428/24926
摘要： The present invention provides improved techniques for metallizing ceramic substrates. The method comprises providing a ceramic substrate and depositing a layer of reducible material on the ceramic substrate. The layer of reducible material includes a reducible ceramic such as copper oxide. The ceramic substrate having the layer of reducible material disposed thereon is heated and the reducible material is contacted with a reducing agent to create a conductive region. The conductive region is either a metallized region formed by reduction, or it is a conductive ceramic formed through surface reduction. The present invention further provides a metallized ceramic substrate. The metallized layer comprises ceramic regions having at least one constituent in common with the ceramic substrate. The ceramic substrate and the ceramic regions of the metallized layer are sintered to each other such that the metallized region is interspersed between the sintered ceramic regions. In this fashion, the metal is firmly held to the ceramic substrate due to the presence of the bonded ceramic within the metallized layer.
摘要翻译：本发明提供了用于金属化陶瓷衬底的改进技术。该方法包括提供陶瓷衬底并在陶瓷衬底上沉积一层可还原材料。可还原材料层包括可还原陶瓷如氧化铜。将具有设置在其上的可还原材料层的陶瓷基板加热并使可还原材料与还原剂接触以产生导电区域。导电区域是通过还原形成的金属化区域，或者是通过表面还原形成的导电陶瓷。本发明还提供一种金属化陶瓷衬底。金属化层包括具有至少一种与陶瓷衬底相同的成分的陶瓷区域。陶瓷基板和金属化层的陶瓷区域彼此烧结，使得金属化区域散布在烧结陶瓷区域之间。以这种方式，由于在金属化层内存在结合的陶瓷，金属被牢固地保持在陶瓷基片上。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式