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1. 发明授权

US07061080B2 Power module package having improved heat dissipating capability 有权
公开(公告)号：US07061080B2
公开(公告)日：2006-06-13
申请号：US10167067
申请日：2002-06-10
申请人： Gi-young Jeun , Sung-min Park , Joo-sang Lee , Sung-won Lim , O-seob Jeon , Byoung-ok Lee , Young-gil Kim , Gwi-gyeon Yang
发明人： Gi-young Jeun , Sung-min Park , Joo-sang Lee , Sung-won Lim , O-seob Jeon , Byoung-ok Lee , Young-gil Kim , Gwi-gyeon Yang
IPC分类号： H01L23/495
CPC分类号： H01L21/565 , H01L23/4334 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/01078 , H01L2924/01079 , H01L2924/12036 , H01L2924/12042 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/2076 , H01L2924/00015 , H01L2924/00012
摘要： A power module package is provided. The power module package includes a power circuit element, a control circuit element, a lead frame, a heat sink, and an epoxy molding compound (EMC). The control circuit element is connected to the power circuit and controls chips in the power circuit. The lead frame has external connecting means formed at the edges thereof, and a down set part, namely, formed between the external connecting means. The lead frame has a first surface to which the power circuit and the control circuit are attached, and a second surface used as a heat dissipating path, in particular, the power circuit is attached to the down set part. The heat sink which is closely attached to the down set part of the second surface of the lead frame by an adhesive. The EMC surrounds the power circuit, the control circuit, the lead frame and the heat sink, and exposes the external connecting means of the lead frame and a side of the heat sink.

2. 发明申请

US20050056918A1 Power module package having improved heat dissipating capability 有权
标题翻译：功率模块封装具有改善的散热能力
公开(公告)号：US20050056918A1
公开(公告)日：2005-03-17
申请号：US10974357
申请日：2004-10-26
申请人： Gi-young Jeun , Sung-min Park , Joo-sang Lee , Sung-won Lim , O-seob Jeon , Byoung-ok Lee , Young-gil Kim , Gwi-gyeon Yang
发明人： Gi-young Jeun , Sung-min Park , Joo-sang Lee , Sung-won Lim , O-seob Jeon , Byoung-ok Lee , Young-gil Kim , Gwi-gyeon Yang
IPC分类号： H01L21/56 , H01L23/433 , H01L23/495
CPC分类号： H01L21/565 , H01L23/4334 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/01078 , H01L2924/01079 , H01L2924/12036 , H01L2924/12042 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/2076 , H01L2924/00015 , H01L2924/00012
摘要： A power module package is provided. The power module package includes a power circuit element, a control circuit element, a lead frame, a heat sink, and an epoxy molding compound (EMC). The control circuit element is connected to the power circuit and controls chips in the power circuit. The lead frame has external connecting means formed at the edges thereof, and a down set part, namely, formed between the external connecting means. The lead frame has a first surface to which the power circuit and the control circuit are attached, and a second surface used as a heat dissipating path, in particular, the power circuit is attached to the down set part. The heat sink which is closely attached to the down set part of the second surface of the lead frame by an adhesive. The EMC surrounds the power circuit, the control circuit, the lead frame and the heat sink, and exposes the external connecting means of the lead frame and a side of the heat sink.
摘要翻译：提供电源模块封装。功率模块封装包括电源电路元件，控制电路元件，引线框架，散热器和环氧树脂模塑料（EMC）。控制电路元件连接到电源电路并控制电源电路中的芯片。引线框架具有形成在其边缘处的外部连接装置和形成在外部连接装置之间的下降部分。引线框架具有安装电源电路和控制电路的第一表面，并且用作散热路径的第二表面，特别地，电源电路附接到下降部件。通过粘合剂紧密地附接到引线框架的第二表面的下降部分的散热器。 EMC围绕电源电路，控制电路，引线框架和散热器，并将引线框架的外部连接装置和散热片的一侧曝光。

3. 发明授权

US07208819B2 Power module package having improved heat dissipating capability 有权
标题翻译：功率模块封装具有改善的散热能力
公开(公告)号：US07208819B2
公开(公告)日：2007-04-24
申请号：US10974357
申请日：2004-10-26
申请人： Gi-young Jeun , Sung-min Park , Joo-sang Lee , Sung-won Lim , O-seob Jeon , Byoung-ok Lee , Young-gil Kim , Gwi-gyeon Yang
发明人： Gi-young Jeun , Sung-min Park , Joo-sang Lee , Sung-won Lim , O-seob Jeon , Byoung-ok Lee , Young-gil Kim , Gwi-gyeon Yang
IPC分类号： H01L23/495
CPC分类号： H01L21/565 , H01L23/4334 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/01078 , H01L2924/01079 , H01L2924/12036 , H01L2924/12042 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/2076 , H01L2924/00015 , H01L2924/00012
摘要： A power module package is provided. The power module package includes a power circuit element, a control circuit element, a lead frame, a heat sink, and an epoxy molding compound (EMC). The control circuit element is connected to the power circuit and controls chips in the power circuit. The lead frame has external connecting means formed at the edges thereof, and a down set part, namely, formed between the external connecting means. The lead frame has a first surface to which the power circuit and the control circuit are attached, and a second surface used as a heat dissipating path, in particular, the power circuit is attached to the down set part. The heat sink which is closely attached to the down set part of the second surface of the lead frame by an adhesive. The EMC surrounds the power circuit, the control circuit, the lead frame and the heat sink, and exposes the external connecting means of the lead frame and a side of the heat sink.
摘要翻译：提供电源模块封装。功率模块封装包括电源电路元件，控制电路元件，引线框架，散热器和环氧树脂模塑料（EMC）。控制电路元件连接到电源电路并控制电源电路中的芯片。引线框架具有形成在其边缘处的外部连接装置和形成在外部连接装置之间的下降部分。引线框架具有安装电源电路和控制电路的第一表面，并且用作散热路径的第二表面，特别地，电源电路附接到下降部件。通过粘合剂紧密地附接到引线框架的第二表面的下降部分的散热器。 EMC围绕电源电路，控制电路，引线框架和散热器，并将引线框架的外部连接装置和散热片的一侧曝光。

4. 发明申请

US20090179325A1 LEADLESS PACKAGE 有权
标题翻译：无铅包装
公开(公告)号：US20090179325A1
公开(公告)日：2009-07-16
申请号：US12349960
申请日：2009-01-07
申请人： Sung-min Park , Keun-hyuk Lee , Seung-Won Lim
发明人： Sung-min Park , Keun-hyuk Lee , Seung-Won Lim
IPC分类号： H01L23/48 , H01L23/49
CPC分类号： H01L24/49 , H01L23/142 , H01L23/49531 , H01L23/49541 , H01L23/49575 , H01L23/49861 , H01L24/36 , H01L24/37 , H01L24/45 , H01L24/48 , H01L2224/37124 , H01L2224/37144 , H01L2224/37147 , H01L2224/45014 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/49111 , H01L2224/73265 , H01L2924/01006 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Provided is a semiconductor package, and in particular a semiconductor package which is capable of electrically connecting to the outside without a lead. The leadless package includes a plurality of lower conducting layer patterns disposed separately from one another; an insulating layer pattern on the lower conducting layer patterns; a plurality of upper conducting layer patterns disposed separately from one another, on the insulating layer pattern; at least one semiconductor chip disposed on the upper conducting layer patterns; hole patterns formed through the upper conducting layer patterns and the insulating layer pattern, so that a part of the top surface of the lower conducting layer patterns are exposed; and electrical connectors electrically connecting: the at least one semiconductor chip and the upper conducting layer patterns; the upper conducting layer patterns and the lower conducting layer patterns exposed by the hole patterns; and the at least one semiconductor chip and the lower conducting layer patterns exposed by the hole patterns.
摘要翻译：提供了一种半导体封装，特别是能够在没有引线的情况下电连接到外部的半导体封装。无引线封装包括彼此分开设置的多个下导电层图案; 在下导电层图案上的绝缘层图案; 在绝缘层图案上彼此分开设置的多个上导电层图案; 设置在上导电层图案上的至少一个半导体芯片; 通过上导电层图案和绝缘层图案形成的孔图案，使得下导电层图案的顶表面的一部分露出; 以及电连接器，其电连接：所述至少一个半导体芯片和所述上导电层图案; 上导电层图案和由孔图案曝光的下导电层图案; 并且所述至少一个半导体芯片和由所述孔图案曝光的所述下导电层图案。

5. 发明授权

US08417133B2 Apparatus and method for supplying charge voltage to organic photoconductor drum 有权
标题翻译：向有机感光鼓提供充电电压的装置和方法
公开(公告)号：US08417133B2
公开(公告)日：2013-04-09
申请号：US12923225
申请日：2010-09-09
申请人： Myung-kook Ahn , Sang-don Lee , Sung-min Park
发明人： Myung-kook Ahn , Sang-don Lee , Sung-min Park
IPC分类号： G03G15/02
CPC分类号： G03G15/0275 , G03G15/0266 , G03G15/55 , G03G15/553 , G03G2215/00776
摘要： Provided is an apparatus and method for supplying a charge voltage to an organic photoconductor (OPC) drum. The apparatus includes a storage unit for storing first service life information of the OPC drum according to a first supplying method, and second service life information of the OPC drum according to a second supplying method, a sensor unit for measuring information about conditions surrounding the apparatus, a control unit for selecting one of the first and second supplying methods according to the measured information and determining a charge voltage corresponding to the service life information according to the selected method, and a voltage supplying unit using the selected method to supply the determined charge voltage to the OPC drum.
摘要翻译：提供了一种用于向有机感光鼓（OPC）鼓提供充电电压的装置和方法。该装置包括存储单元，用于根据第一供应方法存储OPC滚筒的第一使用寿命信息，以及根据第二提供方法存储OPC滚筒的第二使用寿命信息;传感器单元，用于测量关于设备周围的条件的信息控制单元，用于根据所测量的信息选择第一和第二供给方法之一，并根据所选择的方法确定与使用寿命信息相对应的充电电压;以及电压提供单元，使用所选择的方法来提供所确定的电荷电压到OPC鼓。

6. 发明授权

US08350369B2 High power semiconductor package 有权
标题翻译：大功率半导体封装
公开(公告)号：US08350369B2
公开(公告)日：2013-01-08
申请号：US11969410
申请日：2008-01-04
申请人： Keun-hyuk Lee , Seung-won Lim , Sung-min Park , Taek-keun Lee
发明人： Keun-hyuk Lee , Seung-won Lim , Sung-min Park , Taek-keun Lee
IPC分类号： H01L23/495
CPC分类号： H01L23/3107 , H01L23/15 , H01L23/3735 , H01L23/49844 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/16 , H01L2224/27013 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/49 , H01L2224/73265 , H01L2224/83051 , H01L2224/83385 , H01L2224/92247 , H01L2924/00011 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/2076 , H01L2924/00012
摘要： Provided is a high power semiconductor package including: an insulation substrate having first and second surfaces opposite to each other; an interconnection patterns formed on the first surface of the insulation substrate, the interconnection patterns including a plurality of first dimples; a power control semiconductor chip mounted on the first surface of the insulation substrate, the power control semiconductor chip electrically connected with the interconnection patterns; and an encapsulation member encapsulating the insulation substrate, the interconnection patterns, and the power control semiconductor chip and exposing at least a portion of the second surface of the insulation substrate.
摘要翻译：提供一种高功率半导体封装，包括：具有彼此相对的第一和第二表面的绝缘基板; 形成在绝缘基板的第一表面上的互连图案，所述互连图案包括多个第一凹坑; 功率控制半导体芯片，安装在所述绝缘基板的所述第一表面上，所述功率控制半导体芯片与所述互连图案电连接; 以及密封绝缘基板，互连图案和功率控制半导体芯片的封装构件，并且暴露绝缘基板的第二表面的至少一部分。

7. 发明申请

US20120148314A1 Developing unit and image forming apparatus employing the same 有权
标题翻译：显影单元和采用该显影单元的图像形成装置
公开(公告)号：US20120148314A1
公开(公告)日：2012-06-14
申请号：US13067513
申请日：2011-06-06
申请人： Sung-min Park , Hyun-wook Bae , Jong-woo Lee
发明人： Sung-min Park , Hyun-wook Bae , Jong-woo Lee
IPC分类号： G03G15/08
CPC分类号： G03G21/1814 , G03G15/0865 , G03G15/0868 , G03G15/0877 , G03G15/0891 , G03G2215/0836 , G03G2215/0844
摘要： A developing unit includes a toner storage portion containing toner and a toner supply member, and a development portion disposed above the toner storage portion. A partition wall divides the toner storage portion from the development portion. The partition wall includes a supply opening that defines a toner supply path from the toner storage portion to the development portion, and a discharge opening that defines a toner discharge path from the development portion to the toner storage portion.
摘要翻译：显影单元包括含有调色剂的调色剂存储部分和调色剂供应部件，以及设置在调色剂存储部分上方的显影部分。分隔壁将调色剂储存部分与显影部分分开。分隔壁包括限定从调色剂存储部分到显影部分的调色剂供应路径的供应开口，以及限定从显影部分到调色剂存储部分的调色剂排出路径的排出口。

8. 发明申请

US20080203559A1 Power device package and semiconductor package mold for fabricating the same 有权
标题翻译：功率器件封装和用于制造其的半导体封装模具
公开(公告)号：US20080203559A1
公开(公告)日：2008-08-28
申请号：US12011844
申请日：2008-01-29
申请人： Keun-hyuk Lee , Seung-won Lim , Sung-min Park
发明人： Keun-hyuk Lee , Seung-won Lim , Sung-min Park
IPC分类号： H01L23/34
CPC分类号： H01L23/4006 , H01L21/565 , H01L23/3107 , H01L2023/405 , H01L2023/4087 , H01L2224/45139 , H01L2224/48091 , H01L2224/73265 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
摘要： Provided are a power device package coupled to a heat sink using a bolt and a semiconductor package mold for fabricating the same. The power device package includes: a substrate; at least one power device mounted on the substrate; a mold member sealing the substrate and the power device; and at least one bushing member fixed to the mold member to provide a through hole for a bolt member for coupling a heat sink to the mold member.
摘要翻译：提供了使用螺栓和用于制造散热器的半导体封装模具耦合到散热器的功率器件封装。功率器件封装包括：衬底; 安装在所述基板上的至少一个功率器件; 密封基板和动力装置的模具构件; 以及固定到模具构件上的至少一个衬套构件，以提供用于将散热器耦合到模具构件的螺栓构件的通孔。

9. 发明申请

US20060132074A1 Lead-angle control method and device for operating permanent magnet synchronous motor in flux weakening regions 有权
标题翻译：永磁同步电动机在磁通弱化区域中的前角控制方法及装置
公开(公告)号：US20060132074A1
公开(公告)日：2006-06-22
申请号：US11266385
申请日：2005-11-04
申请人： Soon-bae Yang , Sung-min Park , Tae-won Kim , Tae-kyung Kim
发明人： Soon-bae Yang , Sung-min Park , Tae-won Kim , Tae-kyung Kim
IPC分类号： H02K23/16
CPC分类号： H02P21/06 , H02P25/024
摘要： A lead-angle control device according to the present invention includes: a space voltage vector controller calculating effective vector application times necessary for obtaining output voltage vectors of an inverter from stationary-coordinate-system instruction voltage components; a lead-angle compensator comparing the sum of the effective vector application times with a sampling period, and generating lead-angle compensation values; a speed controller generating an instruction current for compensating an error caused by a difference between an instruction speed and a current speed; an instruction current generator which generates a rotating-coordinate-system instruction current component by extracting a lead-angle component at a point where maximum torque-per-ampere can be obtained from the magnitude of the instruction current and performing a mathematical calculation on the magnitude of the instruction current and a lead-angle component; and an instruction voltage generator generating a stationary-coordinate-system instruction voltage component from the rotating-coordinate-system instruction current component.
摘要翻译：根据本发明的前角控制装置包括：空间电压矢量控制器，从静止坐标系指令电压分量计算获得逆变器的输出电压矢量所需的有效矢量应用次数; 将有效矢量施加时间的总和与采样周期进行比较并产生前角补偿值的前角补偿器; 速度控制器，产生用于补偿由指令速度和当前速度之间的差引起的误差的指令电流; 指令电流发生器，其通过从指令电流的大小获得最大每立方厘米转矩的点，通过提取旋转坐标系指令电流分量来产生旋转坐标系指令电流分量，并对该幅度进行数学计算的指令电流和一个引导角分量; 以及从旋转坐标系指令电流分量产生静止坐标系指令电压分量的指令电压发生器。

10. 发明授权

US08258622B2 Power device package and semiconductor package mold for fabricating the same 有权
标题翻译：功率器件封装和用于制造其的半导体封装模具
公开(公告)号：US08258622B2
公开(公告)日：2012-09-04
申请号：US12011844
申请日：2008-01-29
申请人： Keun-hyuk Lee , Seung-won Lim , Sung-min Park
发明人： Keun-hyuk Lee , Seung-won Lim , Sung-min Park
IPC分类号： H01L23/10 , H01L23/34
CPC分类号： H01L23/4006 , H01L21/565 , H01L23/3107 , H01L2023/405 , H01L2023/4087 , H01L2224/45139 , H01L2224/48091 , H01L2224/73265 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
摘要： Provided are a power device package coupled to a heat sink using a bolt and a semiconductor package mold for fabricating the same. The power device package includes: a substrate; at least one power device mounted on the substrate; a mold member sealing the substrate and the power device; and at least one bushing member fixed to the mold member to provide a through hole for a bolt member for coupling a heat sink to the mold member.
摘要翻译：提供了使用螺栓和用于制造散热器的半导体封装模具耦合到散热器的功率器件封装。功率器件封装包括：衬底; 安装在所述基板上的至少一个功率器件; 密封基板和动力装置的模具构件; 以及固定到模具构件上的至少一个衬套构件，以提供用于将散热器耦合到模具构件的螺栓构件的通孔。

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