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    • 2. 发明授权
    • Silicon semiconductor component with an edge contour made by an etching
technique, and method for manufacturing this component
    • 具有通过蚀刻技术制成的边缘轮廓的硅半导体部件及其制造方法
    • US4680615A
    • 1987-07-14
    • US744811
    • 1985-06-14
    • Oswald GotzenbruckerGerhard Popp
    • Oswald GotzenbruckerGerhard Popp
    • H01L21/308H01L29/06H01L29/74B44C1/22C03C15/00H01L21/306
    • H01L29/0661H01L21/3085Y10S438/978
    • Silicon semiconductor component with a wafer-like silicon semiconductor body with an edge contour made by an etching technique. The component has a p-region parallel to a principal surface of the semiconductor body and has in this principal surface a passivating ditch, into which leads a pn-junction extending between the more heavily doped p-region and a less heavily doped n-region, in which the edge contour has in the vicinity of a flank length, between the emergence of the pn-junction into the passivating ditch and this principal surface of the semiconductor body, a small angle of inclination of 1.degree. to 7.degree.. The angle of inclination (.alpha.) of the edge contour is nearly uniform over the major part of the flank length (L) and the following relationships apply:L=(0.8 . . . 1.6).multidot.x.sub.n andH=(0.5 . . . 1.2).multidot.x.sub.p, whereH=the height of the p-doped silicon layer over the pn-junction, measured in the center of the flank length (L),x.sub.n =the extent of the space charge zone into the n-region,x.sub.p =the extent of the space charge zone into the p-region at the cut-off voltage of the component.
    • 具有通过蚀刻技术制成的具有边缘轮廓的晶片状硅半导体主体的硅半导体部件。 该部件具有平行于半导体主体的主表面的p区,并且在该主表面中具有钝化沟,在该钝化沟中引出在更重掺杂的p区和较重掺杂的n区之间延伸的pn结 ,其中边缘轮廓在侧面长度附近,在pn结到钝化沟的出现和半导体主体的主表面之间,倾斜角小于1°至7°。 边缘轮廓的倾角(α)在侧面长度(L)的主要部分上几乎是均匀的,并且以下关系适用:L =(0.8。1.6)xxn和H =(0.5。1.2 )xxp,其中H =在侧面长度(L)的中心测量的pn结上的p掺杂硅层的高度,xn =到n区域的空间电荷区域的程度,xp = 在组件的截止电压下的空间电荷区域到p区域的程度。