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1. 发明授权

US06917524B2 Extension mechanism and method for assembling overhanging components 失效
公开(公告)号：US06917524B2
公开(公告)日：2005-07-12
申请号：US10918081
申请日：2004-08-12
申请人： Tom E. Pearson , George Arrigotti , Christopher D. Combs , Raiyomand F. Aspandiar
发明人： Tom E. Pearson , George Arrigotti , Christopher D. Combs , Raiyomand F. Aspandiar
IPC分类号： H05K1/14 , H05K3/34 , H05K7/12
CPC分类号： H05K3/3405 , H05K1/142 , H05K2201/09127 , H05K2201/10204 , H05K2201/10446 , H05K2201/209 , Y10T29/49126 , Y10T29/4913 , Y10T29/5313 , Y10T29/53252
摘要： A mechanism and method are provided for assembling a printed circuit board having a first surface, a second surface and an edge. The printed circuit board may include at least one female member to receive a corresponding male member. The mechanism may include an extension board having an edge to couple to the edge of the printed circuit board. The extension board may include a male member to extend from the edge of the extension board and to couple to the at least one male member so as to couple the extension board to the printed circuit board.

2. 发明授权

US06734371B2 Soldered heat sink anchor and method of use 失效
公开(公告)号：US06734371B2
公开(公告)日：2004-05-11
申请号：US09964812
申请日：2001-09-28
申请人： George Arrigotti , Tom E. Pearson , Raiyomand F. Aspandiar , Christopher D. Combs
发明人： George Arrigotti , Tom E. Pearson , Raiyomand F. Aspandiar , Christopher D. Combs
IPC分类号： H05K116
CPC分类号： H05K3/308 , H01L23/4093 , H01L2224/16
摘要： An anchoring mechanism and method are provided for securing a component to a printed circuit board. The anchoring mechanism may include a loop, a first leg extending from the loop, and a second leg extending from the loop. The first leg may mount through a first hole of the printed circuit board and include a compressible section to compress when inserted into the first hole and to expand after passing through the first hole. The compressible section of the first leg may support solder between the anchoring mechanism and the first hole. Likewise, the second leg may mount through a second hole of the printed circuit board and include a compressible section to compress when inserted into the second hole and to expand after passing through the second hole. The compressible section of the second leg may support solder between the anchoring mechanism and the second hole.

3. 发明授权

US07251880B2 Method and structure for identifying lead-free solder 失效
标题翻译：用于识别无铅焊料的方法和结构
公开(公告)号：US07251880B2
公开(公告)日：2007-08-07
申请号：US09964746
申请日：2001-09-28
申请人： Tom E. Pearson , George Arrigotti , Christopher D. Combs , Raiyomand F. Aspandiar
发明人： Tom E. Pearson , George Arrigotti , Christopher D. Combs , Raiyomand F. Aspandiar
IPC分类号： H01R43/00
CPC分类号： H05K1/0266 , H05K3/3463 , H05K3/3484 , H05K2201/09781 , H05K2201/09936 , H05K2203/043 , H05K2203/0545 , Y10T29/49117 , Y10T29/49144 , Y10T29/49155
摘要： A method and apparatus are provided for determining whether solder used during assembly of a printed circuit board is lead-free or not. This may include providing a pad on the printed circuit board and placing solder on the pad in a predetermined pattern. The solder may be heated so as to create reflow. The solder may later be examined to determine if the solder is lead-free.
摘要翻译：提供了一种用于确定在组装印刷电路板期间使用的焊料是否是无铅的方法和装置。这可以包括在印刷电路板上提供焊盘并以预定图案将焊料放置在焊盘上。可以加热焊料以产生回流。可以稍后检查焊料以确定焊料是否是无铅的。

4. 发明授权

US07183496B2 Soldered heat sink anchor and method of use 失效
标题翻译：焊接散热器锚和使用方法
公开(公告)号：US07183496B2
公开(公告)日：2007-02-27
申请号：US10843408
申请日：2004-05-11
申请人： George Arrigotti , Tom E. Pearson , Raiyomand F. Aspandiar , Christopher D. Combs
发明人： George Arrigotti , Tom E. Pearson , Raiyomand F. Aspandiar , Christopher D. Combs
IPC分类号： H05K1/16
CPC分类号： H05K3/308 , H01L23/4093 , H01L2224/16
摘要： An anchoring mechanism and method are provided for securing a component to a printed circuit board. The anchoring mechanism may include a loop, a first leg extending from the loop, and a second leg extending from the loop. The first leg may mount through a first hole of the printed circuit board and include a compressible section to compress when inserted into the first hole and to expand after passing through the first hole. The compressible section of the first leg may support solder between the anchoring mechanism and the first hole. Likewise, the second leg may mount through a second hole of the printed circuit board and include a compressible section to compress when inserted into the second hole and to expand after passing through the second hole. The compressible section of the second leg may support solder between the anchoring mechanism and the second hole.
摘要翻译：提供一种用于将组件固定到印刷电路板的锚定机构和方法。锚固机构可以包括环，从环延伸的第一腿和从环延伸的第二腿。第一支腿可以穿过印刷电路板的第一孔，并且包括可插入第一孔中的压缩部分，并且在穿过第一孔之后膨胀。第一腿部的可压缩部分可以支撑锚定机构和第一孔之间的焊料。类似地，第二支腿可以安装在印刷电路板的第二孔中，并且包括可插入到第二孔中的可压缩部分，并在通过第二孔之后膨胀。第二腿的可压缩部分可以支撑锚定机构和第二孔之间的焊料。

5. 发明授权

US06801436B2 Extension mechanism and method for assembling overhanging components 有权
标题翻译：用于组装突出部件的延伸机构和方法
公开(公告)号：US06801436B2
公开(公告)日：2004-10-05
申请号：US09964747
申请日：2001-09-28
申请人： Tom E. Pearson , George Arrigotti , Christopher D. Combs , Raiyomand F. Aspandiar
发明人： Tom E. Pearson , George Arrigotti , Christopher D. Combs , Raiyomand F. Aspandiar
IPC分类号： H05K712
CPC分类号： H05K3/3405 , H05K1/142 , H05K2201/09127 , H05K2201/10204 , H05K2201/10446 , H05K2201/209 , Y10T29/49126 , Y10T29/4913 , Y10T29/5313 , Y10T29/53252
摘要： A mechanism and method are provided for assembling a printed circuit board having a first surface, a second surface and an edge. The printed circuit board may include at least one female member to receive a corresponding male member. The mechanism may include an extension board having an edge to couple to the edge of the printed circuit board. The extension board may include a male member to extend from the edge of the extension board and to couple to the at least one male member so as to couple the extension board to the printed circuit board.
摘要翻译：提供了用于组装具有第一表面，第二表面和边缘的印刷电路板的机构和方法。印刷电路板可以包括至少一个阴构件以接收相应的阳构件。该机构可以包括具有连接到印刷电路板的边缘的边缘的延伸板。延伸板可以包括从延伸板的边缘延伸并连接到至少一个阳构件的阳构件，以便将延伸板耦合到印刷电路板。

6. 发明授权

US06764325B2 Zero insertion force heat-activated retention pin 有权
标题翻译：零插入力热启动保持针
公开(公告)号：US06764325B2
公开(公告)日：2004-07-20
申请号：US10152144
申请日：2002-05-20
申请人： George Arrigotti , Raiyomand Aspandiar , Christopher D. Combs , Tom E. Pearson
发明人： George Arrigotti , Raiyomand Aspandiar , Christopher D. Combs , Tom E. Pearson
IPC分类号： H01R1362
CPC分类号： H05K3/306 , H01R4/01 , H01R12/7035 , H05K2201/0308 , H05K2201/10189 , H05K2201/10598 , H05K2201/10856 , H05K2203/306
摘要： The present invention relates to apparatus and methods for minimizing open electrical connections between carrier substrates and components connected thereto that occur due to sag in the substrate incurred due to exposure to an increasing heat profile encountered to secure the component to the substrate. A zero insertion force heat activated retention pin expands or bends during the temperature increase, creating an upward force on the printed circuit board. This upward force counters the downward sag forces and enables the carrier substrate to maintain a coplanar relationship with the component being connected.
摘要翻译：本发明涉及用于最小化载体基底和与其连接的部件之间的开放电连接的装置和方法，其由于暴露于将部件固定到基板而遇到的增加的热分布而由于在基板中的下垂而发生。零插入力热活化固定销在升温过程中膨胀或弯曲，在印刷电路板上产生向上的力。该向上的力抵抗向下的下垂力，并使载体基板保持与所连接部件的共面关系。

7. 发明授权

US06817878B2 Zero mounting force solder-free connector/component and method 失效
标题翻译：零安装力无焊接连接器/部件和方法
公开(公告)号：US06817878B2
公开(公告)日：2004-11-16
申请号：US10032329
申请日：2001-12-31
申请人： Christopher D. Combs , George Arrigotti , Ralyomand F. Aspandiar , Tom E. Pearson
发明人： Christopher D. Combs , George Arrigotti , Ralyomand F. Aspandiar , Tom E. Pearson
IPC分类号： H01R1362
CPC分类号： H01R12/725 , H01R12/88
摘要： A zero mounting force solder-free connector/component and method.
摘要翻译：零安装力无焊接连接器/部件和方法。

8. 发明授权

US06651869B2 Methods and electronic board products utilizing endothermic material for filling vias to absorb heat during wave soldering 失效
标题翻译：方法和电子板产品利用吸热材料填充通孔，以在波峰焊时吸收热量
公开(公告)号：US06651869B2
公开(公告)日：2003-11-25
申请号：US09957532
申请日：2001-09-21
申请人： Raiyomand F. Aspandiar , Tom E. Pearson , Christopher Combs
发明人： Raiyomand F. Aspandiar , Tom E. Pearson , Christopher Combs
IPC分类号： B23K3100
CPC分类号： H05K3/3494 , B23K1/085 , B23K1/20 , B23K3/085 , B23K2101/42 , H05K3/3436 , H05K3/3468 , H05K2201/0129 , H05K2201/0959 , H05K2201/10734 , H05K2203/0455 , H05K2203/0776 , H05K2203/122 , Y02P70/613
摘要： A method of wave soldering a circuit board while avoiding reflow of a solder joint on the topside of the board from heat conducted from the solder wave through at least one via in the board in heat conducting relation with the topside solder joint, comprises subjecting the circuit board to a solder wave and absorbing heat being conducted from the solder wave through the at least one via with an endothermic material in the via hole which undergoes a heat absorbing reaction. The heat absorbing reaction of the endothermic material is preferably a phase change, such as melting. The melted endothermic material is retained in the via hole during wave soldering by capillary forces and a cap on the lower end of the via hole. A disclosed method of making the circuit board includes locating the endothermic material in the via hole by inserting a preform of the endothermic material into the via hole or hot dispensing the endothermic material into the via hole. An electronic board product for practicing the method/made by the method is also disclosed.
摘要翻译：一种波形焊接电路板的方法，同时避免了从焊锡波通过板中的至少一个通孔从顶部焊料导热关系的焊盘顶部的焊点的回流焊，焊接到焊波，并且吸收从焊料波通过至少一个通孔的热量，其中吸热材料在经过吸热反应的通孔中。吸热材料的吸热反应优选为相变，例如熔融。熔融的吸热材料通过毛细管的波峰焊和通孔的下端的盖保持在通孔中。公开的制造电路板的方法包括将吸热材料的预成型件插入通孔中或将吸热材料热分配到通孔中来将吸热材料定位在通孔中。还公开了用于实施该方法制造的电子板产品。

9. 发明授权

US06501658B2 Heatsink mounting with shock absorbers 失效
公开(公告)号：US06501658B2
公开(公告)日：2002-12-31
申请号：US09788128
申请日：2001-02-16
申请人： Tom E. Pearson , Arjang Fartash , Christopher Combs , Raiyomand F. Aspandiar
发明人： Tom E. Pearson , Arjang Fartash , Christopher Combs , Raiyomand F. Aspandiar
IPC分类号： H05K720
CPC分类号： H01L23/4093 , H01L2023/4062 , H01L2023/4081 , H01L2224/16 , H01L2224/73253 , H01L2924/00014 , H01L2924/15311 , H01L2224/0401
摘要： Shock absorbers or other dampening mechanisms are added to an assembly including a heatsink, a semiconductor device, and a board, to reduce shock and/or vibration induced relative motion between the heatsink and the board.

10. 发明授权

US06700800B2 Retainer for circuit board assembly and method for using the same 有权
标题翻译：电路板组装用保持器及其使用方法
公开(公告)号：US06700800B2
公开(公告)日：2004-03-02
申请号：US10173342
申请日：2002-06-14
申请人： Christopher Combs , Arjang Fartash , Tom E. Pearson , Raiyomand F. Aspandiar
发明人： Christopher Combs , Arjang Fartash , Tom E. Pearson , Raiyomand F. Aspandiar
IPC分类号： H02B101
CPC分类号： H05K3/303 , H05K3/3415 , H05K3/3436 , H05K2201/09072 , H05K2201/10598 , Y02P70/613
摘要： A retainer for a circuit board and method for using the same are provided. In one embodiment, a circuit board assembly includes a circuit board, an electronic component, a plurality of electric contacts between the circuit board and the electronic component, and a retainer. The retainer has a first component secured to the circuit board and a second component secured to the electronic component. The retainer allows for movement of the electronic component in a first direction towards the circuit board while simultaneously preventing movement of the circuit board and the electronic component in a second direction away from one another when the electric contacts melt.
摘要翻译：提供一种用于电路板的保持器及其使用方法。在一个实施例中，电路板组件包括电路板，电子部件，电路板和电子部件之间的多个电触头以及保持器。保持器具有固定到电路板的第一部件和固定到电子部件的第二部件。保持器允许电子部件沿着第一方向朝着电路板运动，同时防止当电触头熔化时电路板和电子部件在彼此远离彼此的第二方向上移动。

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