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    • 4. 发明授权
    • LED array
    • LED阵列
    • US07726835B2
    • 2010-06-01
    • US11816951
    • 2006-02-06
    • Georg BognerMoritz EnglStefan GrötschPatrick KromotisJorg Erich Sorg
    • Georg BognerMoritz EnglStefan GrötschPatrick KromotisJorg Erich Sorg
    • H01L27/15
    • H01L33/62H01L25/0753H01L33/42H01L33/505H01L33/507H01L2924/0002H01L2924/00
    • In an LED array comprising a plurality of radiation-emitting semiconductor chips each of which has a radiation outcoupling surface, the radiation emitted by the semiconductor chips being outcoupled substantially through said radiation outcoupling surface, and a cover body that is transparent to the emitted radiation, the transparent cover body comprises, on a surface facing toward the radiation outcoupling surfaces of the semiconductor chips, one or more conductive traces made of a conductive material that is transparent to the emitted radiation, and the semiconductor chips each comprise, on the radiation outcoupling surface, at least one electrical contact that is connected to the conductive trace or to at least one of the plurality of conductive traces. At least one luminescence conversion material is contained in the transparent cover body and/or applied in a layer to the cover body and/or the semiconductor chips.
    • 在包括多个具有辐射输出耦合表面的多个辐射发射半导体芯片的LED阵列中,由半导体芯片发射的辐射基本上通过所述辐射输出耦合表面耦合,以及对所发射的辐射透明的盖体, 透明盖体在面向半导体芯片的辐射输出耦合表面的表面上包括由对所发射的辐射透明的导电材料制成的一个或多个导电迹线,并且半导体芯片各自包括在辐射输出耦合表面 ,至少一个电触点,其连接到所述导电迹线或所述多个导电迹线中的至少一个。 至少一个发光转换材料被包含在透明盖体中和/或被涂覆到覆盖体和/或半导体芯片的层中。