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    • 2. 发明授权
    • Hermetically sealable silicon system and method of making same
    • 密封硅系统及其制作方法
    • US07402899B1
    • 2008-07-22
    • US11622647
    • 2007-01-12
    • James S. WhitingNeal L. EiglerBrian M. MannWerner Hafelfinger
    • James S. WhitingNeal L. EiglerBrian M. MannWerner Hafelfinger
    • H01L21/30
    • H01L23/10B81B7/0077H01L2924/0002H01L2924/01079H01L2924/09701H01L2924/00
    • A device and method for hermetically sealing a medical device is provided. In one aspect, a silicon device is coupled to a sensor, such as a pressure transducer, which benefits from having direct contact with its environment, which in many cases, is the human body. Thus, a method to hermetically seal the non-sensing portion of a silicon device while allowing the sensing portion (e.g. the pressure transducer) to have direct contact with the body is provided. In one aspect, a silicon chip, a gold preform and a metallic housing are each primed for sealing and are assembled. The assembly is then heated to react the gold preform to the silicon chip and to form a molten gold-silicon alloy in-situ to bind the metallic housing to the non-sensing portion of the silicon chip. In this way, the non-sensing portion of the silicon chip is hermetically sealed and protected from exposure, while still permitting exposure of the sensing portion to the environment.
    • 提供一种用于密封医疗装置的装置和方法。 在一个方面,硅器件耦合到诸如压力传感器的传感器,其受益于与其环境的直接接触,其在许多情况下是人体。 因此,提供了一种使允许感测部分(例如压力传感器)与身体直接接触的硅器件的非感测部分密封的方法。 在一个方面,硅芯片,金预成型件和金属外壳各自用于密封并组装。 然后将组件加热以使金预成型件与硅芯片反应,并原位形成熔融的金 - 硅合金,以将金属外壳固定到硅芯片的非感测部分。 以这种方式,硅芯片的非感测部分被气密地密封并防止暴露,同时仍然允许感测部分暴露于环境中。