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    • 1. 发明申请
    • METHOD AND SYSTEM FOR CREATING SELF-ALIGNED TWIN WELLS WITH CO-PLANAR SURFACES IN A SEMICONDUCTOR DEVICE
    • 用于在半导体器件中用共平面表面形成自对准双阱的方法和系统
    • US20090206452A1
    • 2009-08-20
    • US12426921
    • 2009-04-20
    • Gayle W. Miller, JR.Bryan D. Sendelweck
    • Gayle W. Miller, JR.Bryan D. Sendelweck
    • H01L29/02
    • H01L21/823892H01L21/324
    • A method and system for providing a twin well in a semiconductor device is described. The method and system include providing at least one interference layer and providing a first mask that covers a first portion of the semiconductor device and uncovers a second portion of the semiconductor device. The first and second portions of the semiconductor device are adjacent. The method and system also include implanting a first well in the second portion of the semiconductor device after the first mask is provided. The method and system also include providing a second mask. The interference layer(s) are configured such that energy during a blanket exposure develops the second mask that uncovers the first portion and covers the second portion of the semiconductor device. The method and system also include implanting a second well in the first portion of the semiconductor device after the second mask is provided.
    • 描述了一种用于在半导体器件中提供双阱的方法和系统。 所述方法和系统包括提供至少一个干涉层并提供覆盖半导体器件的第一部分并露出半导体器件的第二部分的第一掩模。 半导体器件的第一和第二部分相邻。 该方法和系统还包括在提供第一掩模之后将第一阱注入半导体器件的第二部分。 该方法和系统还包括提供第二掩模。 干涉层被配置为使得在覆盖曝光期间的能量产生露出第一部分并覆盖半导体器件的第二部分的第二掩模。 该方法和系统还包括在提供第二掩模之后将第二阱注入半导体器件的第一部分。
    • 2. 发明申请
    • Method and system for creating self-aligned twin wells with co-planar surfaces in a semiconductor device
    • 用于在半导体器件中产生具有共面表面的自对准双阱的方法和系统
    • US20080166862A1
    • 2008-07-10
    • US11650164
    • 2007-01-05
    • Gayle W. MillerBryan D. Sendelweck
    • Gayle W. MillerBryan D. Sendelweck
    • H01L21/426
    • H01L21/823892H01L21/324
    • A method and system for providing a twin well in a semiconductor device is described. The method and system include providing at least one interference layer and providing a first mask that covers a first portion of the semiconductor device and uncovers a second portion of the semiconductor device. The first and second portions of the semiconductor device are adjacent. The method and system also include implanting a first well in the second portion of the semiconductor device after the first mask is provided. The method and system also include providing a second mask. The interference layer(s) are configured such that energy during a blanket exposure develops the second mask that uncovers the first portion and covers the second portion of the semiconductor device. The method and system also include implanting a second well in the first portion of the semiconductor device after the second mask is provided.
    • 描述了一种用于在半导体器件中提供双阱的方法和系统。 所述方法和系统包括提供至少一个干涉层并提供覆盖半导体器件的第一部分并露出半导体器件的第二部分的第一掩模。 半导体器件的第一和第二部分相邻。 该方法和系统还包括在提供第一掩模之后将第一阱注入半导体器件的第二部分。 该方法和系统还包括提供第二掩模。 干涉层被配置为使得在覆盖曝光期间的能量产生露出第一部分并覆盖半导体器件的第二部分的第二掩模。 该方法和系统还包括在提供第二掩模之后将第二阱注入半导体器件的第一部分。
    • 4. 发明授权
    • Method and system for creating self-aligned twin wells with co-planar surfaces in a semiconductor device
    • 用于在半导体器件中产生具有共面表面的自对准双阱的方法和系统
    • US08138578B2
    • 2012-03-20
    • US12426921
    • 2009-04-20
    • Gayle W. Miller, Jr.Bryan D. Sendelweck
    • Gayle W. Miller, Jr.Bryan D. Sendelweck
    • H01L23/58
    • H01L21/823892H01L21/324
    • A method and system for providing a twin well in a semiconductor device is described. The method and system include providing at least one interference layer and providing a first mask that covers a first portion of the semiconductor device and uncovers a second portion of the semiconductor device. The first and second portions of the semiconductor device are adjacent. The method and system also include implanting a first well in the second portion of the semiconductor device after the first mask is provided. The method and system also include providing a second mask. The interference layer(s) are configured such that energy during a blanket exposure develops the second mask that uncovers the first portion and covers the second portion of the semiconductor device. The method and system also include implanting a second well in the first portion of the semiconductor device after the second mask is provided.
    • 描述了一种用于在半导体器件中提供双阱的方法和系统。 所述方法和系统包括提供至少一个干涉层并提供覆盖半导体器件的第一部分并露出半导体器件的第二部分的第一掩模。 半导体器件的第一和第二部分相邻。 该方法和系统还包括在提供第一掩模之后将第一阱注入半导体器件的第二部分。 该方法和系统还包括提供第二掩模。 干涉层被配置为使得在覆盖曝光期间的能量产生露出第一部分并覆盖半导体器件的第二部分的第二掩模。 该方法和系统还包括在提供第二掩模之后将第二阱注入半导体器件的第一部分。
    • 5. 发明授权
    • LOCOS self-aligned twin well with a co-planar silicon surface
    • LOCOS自对准双井与共面硅表面
    • US07642181B2
    • 2010-01-05
    • US11343179
    • 2006-01-30
    • Gayle W. Miller, Jr.Irwin D. RathbunBryan D. SendelweckThomas S. Moss, III
    • Gayle W. Miller, Jr.Irwin D. RathbunBryan D. SendelweckThomas S. Moss, III
    • H01L21/425
    • H01L21/823892
    • A method and system for providing a twin well in a semiconductor device is described. The method and system include masking a first portion of the device such that a second portion of the device is exposed. A sacrificial layer has a first portion on the first portion of the device and a second portion on the second portion of the device. In one aspect, an oxidation stop layer may be below the sacrificial layer. The method and system include implanting a first well in the second portion of the device, exposing the first portion of the device after the first well is implanted, and oxidizing the second portion of sacrificial layer after the exposing. The method and system further include implanting the second well in the first portion of the device after the oxidizing and planarizing the device after the second well is implanted.
    • 描述了一种用于在半导体器件中提供双阱的方法和系统。 该方法和系统包括屏蔽设备的第一部分,使得设备的第二部分被暴露。 牺牲层在器件的第一部分上具有第一部分,在器件的第二部分上具有第二部分。 在一个方面,氧化停止层可以在牺牲层的下方。 该方法和系统包括在装置的第二部分中注入第一阱,在第一阱被注入之后露出装置的第一部分,以及在曝光之后氧化牺牲层的第二部分。 所述方法和系统还包括在第二阱被植入之后,在将器件氧化和平坦化之后,将第二阱注入器件的第一部分。
    • 6. 发明授权
    • Method and system for creating self-aligned twin wells with co-planar surfaces in a semiconductor device
    • 用于在半导体器件中产生具有共面表面的自对准双阱的方法和系统
    • US07521312B2
    • 2009-04-21
    • US11650164
    • 2007-01-05
    • Gayle W. Miller, Jr.Bryan D. Sendelweck
    • Gayle W. Miller, Jr.Bryan D. Sendelweck
    • H01L21/8238
    • H01L21/823892H01L21/324
    • A method and system for providing a twin well in a semiconductor device is described. The method and system include providing at least one interference layer and providing a first mask that covers a first portion of the semiconductor device and uncovers a second portion of the semiconductor device. The first and second portions of the semiconductor device are adjacent. The method and system also include implanting a first well in the second portion of the semiconductor device after the first mask is provided. The method and system also include providing a second mask. The interference layer(s) are configured such that energy during a blanket exposure develops the second mask that uncovers the first portion and covers the second portion of the semiconductor device. The method and system also include implanting a second well in the first portion of the semiconductor device after the second mask is provided.
    • 描述了一种用于在半导体器件中提供双阱的方法和系统。 所述方法和系统包括提供至少一个干涉层并提供覆盖半导体器件的第一部分并露出半导体器件的第二部分的第一掩模。 半导体器件的第一和第二部分相邻。 该方法和系统还包括在提供第一掩模之后将第一阱注入半导体器件的第二部分。 该方法和系统还包括提供第二掩模。 干涉层被配置为使得在覆盖曝光期间的能量产生露出第一部分并覆盖半导体器件的第二部分的第二掩模。 该方法和系统还包括在提供第二掩模之后将第二阱注入半导体器件的第一部分。