专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US4692557A Encapsulated solar cell assemblage and method of making 失效
标题翻译：封装太阳能电池组合及制作方法
公开(公告)号：US4692557A
公开(公告)日：1987-09-08
申请号：US919918
申请日：1986-10-16
申请人： Gay M. Samuelson , David J. St. Clair
发明人： Gay M. Samuelson , David J. St. Clair
IPC分类号： H01L31/048 , H01L25/02 , H01L21/56 , H01L31/18
CPC分类号： B32B17/10761 , B32B17/10678 , B32B17/10788 , H01L31/048 , Y02E10/50 , Y10T156/1092
摘要： A solar cell assemblage and method of making, comprising:(a) a pre-treated silanized transparent substrate;(b) a layer of semiconductor material;(c) an electrical contact on the surface of said layer of semiconductor material;(d) an extruded transparent film encapsulating the assemblage which comprises 75 to 91 parts by weight of a blend of:65 to 75 parts by weight of a selectively hydrogenated two-block polymer wherein(1) each A is a polymer block of a monovinyl or alpha alkyl monovinyl arene and the A blocks are from 10 to 40% by weight of the total block copolymer, and(2) each B is a polymer block formed by polymerizing a conjugated diene, and the B blocks are 90 to 60% weight of the total block copolymer, and25 to 35 parts by weight of a selectively hydrogenated multiblock copolymer wherein:(1) each A is a polymer endblock of a monovinyl or alpha alkyl monovinyl arene and the A blocks are 10 to 40% by weight of the total block copolymer, and(2) each B is a polymer midblock is formed by polymerizing a conjugated diene and the B blocks are 90 to 10% weight of the total block copolymer,about 8.5 to about 23.5 parts by weight of an (alpha) methyl styrene polymer tackifying resin; andabout 0.5 to about 1.5 parts by weight of a mixture of a phenolic antioxidant, a UV absorber with benzotriazole functionality and a UV absorber with hindered amine functionality;(e) a carbon filled polymer frame; and(f) sealant.
摘要翻译：一种太阳能电池组件及其制造方法，包括：（a）预处理的硅烷化透明基板; （b）半导体材料层; （c）在所述半导体材料层的表面上的电接触; （d）封装组合物的挤出透明膜，其包含75至91重量份的以65至75重量份的选择性氢化的二嵌段聚合物的共混物，其中（A）每个A是单乙烯基的聚合物嵌段或α-烷基单乙烯基芳烃，并且A嵌段占总嵌段共聚物的10〜40重量％，（2）各B是通过使共轭二烯聚合而形成的聚合物嵌段，B嵌段为90〜60重量％的总嵌段共聚物和25至35重量份的选择性氢化的多嵌段共聚物，其中：（1）每个A是单乙烯基或α-烷基单乙烯基芳烃的聚合物端嵌段，并且A嵌段是10至40重量％总嵌段共聚物和（2）每个B是聚合物中间嵌段通过聚合共轭二烯而形成，并且B嵌段是总嵌段共聚物的90至10重量％，约8.5至约23.5重量份的（α ）甲基苯乙烯聚合物增粘树脂; 和约0.5至约1.5重量份的酚类抗氧化剂，具有苯并三唑官能团的UV吸收剂和具有受阻胺官能团的UV吸收剂的混合物; （e）碳填充聚合物框架; 和（f）密封剂。

2. 发明授权

US4869966A Encapsulated assemblage and method of making 失效
公开(公告)号：US4869966A
公开(公告)日：1989-09-26
申请号：US204335
申请日：1988-05-27
申请人： Gay M. Samuelson , David J. St. Clair , Richard L. Danforth
发明人： Gay M. Samuelson , David J. St. Clair , Richard L. Danforth
IPC分类号： C03C17/32 , C08L53/02
CPC分类号： B32B17/10761 , B32B17/1055 , B32B17/10678 , B32B17/10788 , C03C17/32 , C08L53/025 , Y10T428/31612 , Y10T428/31663
摘要： An encapsulated assemblage and a process for making an encapsulated assemblage comprising:(a) silanizing a substrate thereby forming a silanized substrate;(b) coating said silanized substrate with at least one thin extruded coherent film forming a coated substrate, said film consisting essentially of:(1) about 75 to about 90 parts by weight of a blend of:(a) about 65 to about 75 parts by weight of a selectively hydrogenated two-block polymer wherein one polymer block is designated by A and a second polmer block is designated by B such that prior to hydrogenation,(1) each A is a polymer block of a monovinyl or alpha alkyl monovinyl arene having a number average molecular weight in the range of from about 5,000 to about 75,000, said A blocks comprising from about 10 to about 40% by weight of the total block copolymer, and(2) each B is a polymer block having a number average molecular weight in the range of from about 10,000 to 150,000 and is formed by polymerizing a conjugated diene having from 4 to 10 carbon atoms per molecule, and said B blocks comprising from about 90 to about 60% weight of the total block copolymer, and(b) about 25 to about 35 parts by weight of a selectively hydrogenated multiblock copolymer which contains at least two kinds of polymer blocks wherein one polymer block is designated by A and a second polymer block is designated by B such that:(1) each A is a polymer endblock of a monovinyl or alpha alkyl monovinyl arene having a number average molecular weight in the range of from about 5,000 to about 75,000, said A blocks comprising from about 10 to about 40% by weight of the total block copolymer, and(2) each B is a polymer midblock having a number average molecular weight in the range of from about 10,000 to about 150,000 and is formed polymerizing a conjugated diene having from 4 to 10 carbon atoms per molecule, and said B blocks comprising from about 90 to about 10% weight of the total block copolymer, and(2) about 9.5 to about 23.5 parts by weight of a hydrogenated .alpha.-methyl styrene polymer resin;(3) about 0.5 to about 1.5 parts by weight of a phenolic antioxidant, a UV absorber with benzotriazole functionality, and a UV absorber with hindered amine functionality;(c) applying a vacuum to the assemblage thereby forming a pressure gradient between said substrate and said film, and thereby vacuum laminating the assemblage; and(d) heating said vacuum laminated assemblage to a temperature greater than the softening point of said film and less than the melting point of solder and thereby heat sealing said assemblage.

3. 发明授权

US4749430A Method of making an encapsulated assemblage 失效
标题翻译：制作封装组合的方法
公开(公告)号：US4749430A
公开(公告)日：1988-06-07
申请号：US919919
申请日：1986-10-16
申请人： Gay M. Samuelson , David J. St. Clair , Richard L. Danforth
发明人： Gay M. Samuelson , David J. St. Clair , Richard L. Danforth
IPC分类号： C03C17/32 , C08L53/02 , B29C47/04
CPC分类号： B32B17/1055 , B32B17/10678 , B32B17/10761 , B32B17/10788 , C03C17/32 , C08L53/025 , Y10T428/2995 , Y10T428/2998 , Y10T428/31612
摘要： An encapsulated assemblage and a process for making comprising:(a) silanizing a substrate;(b) coating the silanized substrate with at least one thin extruded coherent film consisting essentially of:(1) about 75-90 parts by weight of:(a) about 65 to about 75 parts of a selectively hydrogenated two-block polymer (A-B) such that prior to hydrogenation,(1) each A is a polymer block of a monovinyl or alpha alkyl monovinyl arene having a number average molecular weight of 5000 to 75,000 and comprising from about 10 to about 40% by weight of the total block copolymer, and(2) each B is a polymer block having a number average molecular weight of 10,000 to 150,000 and comprising from about 90 to about 60% weight of the total block copolymer, and(b) about 25 to about 35 parts by weight of a selectively hydrogenated multiblock copolymer (A-B) such that:(1) each A is a polymer endblock of a monovinyl or alpha alkyl monovinyl arene having a number average molecular weight of 5,000 to 75,000, said A blocks comprising from about 10 to about 40% by weight of the total block copolymer, and(2) each B is a polymer midblock having a number average molecular weight of 10,000 to 150,000 and is formed by polymerizing a conjugated diene having from 4 to 10 carbon atoms per molecule, and said B blocks comprising from about 90 to about 10% weight of the total block copolymer and(2) about 9.5 to about 23.5 parts by weight of a hydrogenated .alpha.-methyl styrene polymer resin;(3) about 0.5 to about 1.5 parts by weight of a phenolic antioxidant, a UV absorber with benzotriazole functionality, and a UV absorber with hindered amine functionality;(c) vacuum laminating the assemblage; and(d) heat sealing said assemblage.
摘要翻译：封装的组合物和制备方法包括：（a）使基底硅烷化; （b）用至少一种薄的挤出相干膜涂覆硅烷化基材，该薄膜基本上由以下组成：（1）约75-90重量份：（a）约65至约75份选择性氢化的二嵌段聚合物），使得在氢化之前，（1）每个A是数均分子量为5000至75,000并且包含总嵌段共聚物的约10至约40重量％的单乙烯基或α烷基单乙烯基芳烃的聚合物嵌段，和（2）每个B是数均分子量为10,000至150,000且包含总嵌段共聚物的约90至约60重量％的聚合物嵌段，和（b）约25至约35重量份的选择性氢化多嵌段共聚物（AB），使得：（1）每个A是数均分子量为5,000至75,000的单乙烯基或α-烷基单乙烯基芳烃的聚合物端嵌段，所述A嵌段包含约10至约40％的总嵌段共聚物，和（2）每个B是数均分子量为10,000至150,000的聚合物中间嵌段，并且通过每分子聚合具有4至10个碳原子的共轭二烯而形成，并且所述B嵌段包含约90至约10重量％总嵌段共聚物的重量和（2）约9.5至约23.5重量份的氢化α-甲基苯乙烯聚合物树脂; （3）约0.5至约1.5重量份的酚类抗氧化剂，具有苯并三唑官能团的UV吸收剂和具有受阻胺官能团的UV吸收剂; （c）真空层压组合件; 和（d）热封所述组合件。

4. 发明授权

US5567981A Bonding pad structure having an interposed rigid layer 失效
标题翻译：具有中间刚性层的粘结垫结构
公开(公告)号：US5567981A
公开(公告)日：1996-10-22
申请号：US40521
申请日：1993-03-31
申请人： Ameet S. Bhansali , Gay M. Samuelson , Venkatesan Murali , Michael J. Gasparek , Shou H. Chen , Nicholas P. Mencinger , Ching C. Lee , Kevin Jeng
发明人： Ameet S. Bhansali , Gay M. Samuelson , Venkatesan Murali , Michael J. Gasparek , Shou H. Chen , Nicholas P. Mencinger , Ching C. Lee , Kevin Jeng
IPC分类号： H01L23/485 , H01L23/58 , H01L23/48 , H01L23/495
CPC分类号： H01L24/85 , H01L24/03 , H01L24/05 , H01L24/48 , H01L2224/02166 , H01L2224/04042 , H01L2224/05073 , H01L2224/05093 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/0518 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05669 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/48463 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48724 , H01L2224/48739 , H01L2224/48769 , H01L2224/85205 , H01L24/45 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/05042 , H01L2924/10253 , H01L2924/14
摘要： A bonding pad structure for use with compliant dielectric materials and a method for wire bonding is described in which a rigid layer is formed between the bonding pad and the compliant dielectric layer. The rigid layer increases the stiffness of the bonding structure such that an effective bond may be achieved by conventional ultrasonic and thermosonic bonding methods.
摘要翻译：描述了用于柔性电介质材料的接合焊盘结构和引线接合方法，其中在焊盘和柔性电介质层之间形成刚性层。刚性层增加了接合结构的刚度，使得可以通过常规的超声波和热超声键合方法实现有效的接合。

5. 发明授权

US06265300B1 Wire bonding surface and bonding method 失效
标题翻译：引线接合面和接合方法
公开(公告)号：US06265300B1
公开(公告)日：2001-07-24
申请号：US08154268
申请日：1993-11-18
申请人： Ameet S. Bhansali , Gay M. Samuelson , Venkatesan Murali , Michael J. Gasparek , Shou H. Chen , Nicholas P. Mencinger , Ching C. Lee , Kevin Jeng
发明人： Ameet S. Bhansali , Gay M. Samuelson , Venkatesan Murali , Michael J. Gasparek , Shou H. Chen , Nicholas P. Mencinger , Ching C. Lee , Kevin Jeng
IPC分类号： H01L2144
CPC分类号： H01L24/85 , H01L24/03 , H01L24/05 , H01L24/45 , H01L24/48 , H01L2224/02166 , H01L2224/04042 , H01L2224/05073 , H01L2224/05093 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/0518 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05669 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/48463 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48724 , H01L2224/48739 , H01L2224/48769 , H01L2224/85205 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01042 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/05042 , H01L2924/10253 , H01L2924/14 , H01L2924/00014 , H01L2924/00 , H01L2224/48669 , H01L2224/48744 , H01L2924/00015 , H01L2924/01202
摘要： A bonding pad structure for use with compliant dielectric materials and a method for wire bonding is described in which a rigid layer is formed between the bonding pad and the compliant dielectric layer. The rigid layer increases the stiffness of the bonding structure such that an effective bond may be achieved by conventional ultrasonic and thermosonic bonding methods.
摘要翻译：描述了用于柔性电介质材料的接合焊盘结构和引线接合方法，其中在焊盘和柔性电介质层之间形成刚性层。刚性层增加了接合结构的刚度，使得可以通过常规的超声波和热超声键合方法实现有效的接合。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式