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1. 发明授权

US08739627B2 Inertial sensor with off-axis spring system 有权
标题翻译：惯性传感器带离轴弹簧系统
公开(公告)号：US08739627B2
公开(公告)日：2014-06-03
申请号：US13282192
申请日：2011-10-26
申请人： Gary G. Li , Yizhen Lin , Andrew C. McNeil , Lisa Z. Zhang
发明人： Gary G. Li , Yizhen Lin , Andrew C. McNeil , Lisa Z. Zhang
IPC分类号： G01C19/56
CPC分类号： G01C19/5747 , G01C19/5762
摘要： An inertial sensor (20) includes a drive mass (30) configured to undergo oscillatory motion and a sense mass (32) linked to the drive mass (30). On-axis torsion springs (58) are coupled to the sense mass (32), the on-axis torsion springs (58) being co-located with an axis of rotation (22). The inertial sensor (20) further includes an off-axis spring system (60). The off-axis spring system (60) includes off-axis springs (68, 70, 72, 74), each having a connection interface (76) coupled to the sense mass (32) at a location on the sense mass (32) that is displaced away from the axis of rotation (22). Together, the on-axis torsion springs (58) and the off-axis spring system (60) enable the sense mass (32) to oscillate out of plane about the axis of rotation (22) at a sense frequency that substantially matches a drive frequency of the drive mass (30).
摘要翻译：惯性传感器（20）包括构造成经历振荡运动的驱动质量块（30）和与驱动质量块（30）连接的感测质量块（32）。轴上扭转弹簧（58）联接到感测质量块（32），所述轴上扭转弹簧（58）与旋转轴线（22）共同定位。惯性传感器（20）还包括离轴弹簧系统（60）。离轴弹簧系统（60）包括离轴弹簧（68,70,72,74），每个离轴弹簧具有在感测质量块（32）上的位置处耦合到感测质量块（32）的连接界面（76）其远离旋转轴线（22）移位。一起，轴上扭转弹簧（58）和离轴弹簧系统（60）使得感测质量（32）能够以基本匹配驱动器的感测频率围绕旋转轴线（22）摆动离开平面驱动质量（30）的频率。

2. 发明申请

US20130319117A1 MEMS SENSOR WITH STRESS ISOLATION AND METHOD OF FABRICATION 有权
标题翻译：具有应力隔离的MEMS传感器和制造方法
公开(公告)号：US20130319117A1
公开(公告)日：2013-12-05
申请号：US13482332
申请日：2012-05-29
申请人： Andrew C. McNeil , Gary G. Li , Lisa Z. Zhang , Yizhen Lin
发明人： Andrew C. McNeil , Gary G. Li , Lisa Z. Zhang , Yizhen Lin
IPC分类号： G01P15/125 , H01R43/00
CPC分类号： G01P15/125 , G01P15/0802 , G01P15/18 , G01P2015/0831
摘要： A MEMS sensor (20, 86) includes a support structure (26) suspended above a surface (28) of a substrate (24) and connected to the substrate (24) via spring elements (30, 32, 34). A proof mass (36) is suspended above the substrate (24) and is connected to the support structure (26) via torsional elements (38). Electrodes (42, 44), spaced apart from the proof mass (36), are connected to the support structure (26) and are suspended above the substrate (24). Suspension of the electrodes (42, 44) and proof mass (36) above the surface (28) of the substrate (24) via the support structure (26) substantially physically isolates the elements from deformation of the underlying substrate (24). Additionally, connection via the spring elements (30, 32, 34) result in the MEMS sensor (22, 86) being less susceptible to movement of the support structure (26) due to this deformation.
摘要翻译： MEMS传感器（20,86）包括悬挂在基板（24）的表面（28）上方并通过弹簧元件（30,32,34）连接到基板（24）的支撑结构（26）。证明物质（36）悬挂在基底（24）上方，并通过扭转元件（38）连接到支撑结构（26）。与证明物质（36）间隔开的电极（42,44）连接到支撑结构（26）并悬挂在基底（24）上方。通过支撑结构（26）将基片（24）的表面（28）上方的电极（42,44）和检验质量块（36）悬挂在基本上物理上隔离下面的基底（24）的变形。此外，通过弹簧元件（30,32,34）的连接导致MEMS传感器（22,86）由于这种变形而不易受支撑结构（26）的移动的影响。

3. 发明授权

US08925384B2 MEMS sensor with stress isolation and method of fabrication 有权
标题翻译：具有应力隔离的MEMS传感器和制造方法
公开(公告)号：US08925384B2
公开(公告)日：2015-01-06
申请号：US13482332
申请日：2012-05-29
申请人： Andrew C. McNeil , Gary G. Li , Lisa Z. Zhang , Yizhen Lin
发明人： Andrew C. McNeil , Gary G. Li , Lisa Z. Zhang , Yizhen Lin
IPC分类号： G01P15/125
CPC分类号： G01P15/125 , G01P15/0802 , G01P15/18 , G01P2015/0831
摘要： A MEMS sensor (20, 86) includes a support structure (26) suspended above a surface (28) of a substrate (24) and connected to the substrate (24) via spring elements (30, 32, 34). A proof mass (36) is suspended above the substrate (24) and is connected to the support structure (26) via torsional elements (38). Electrodes (42, 44), spaced apart from the proof mass (36), are connected to the support structure (26) and are suspended above the substrate (24). Suspension of the electrodes (42, 44) and proof mass (36) above the surface (28) of the substrate (24) via the support structure (26) substantially physically isolates the elements from deformation of the underlying substrate (24). Additionally, connection via the spring elements (30, 32, 34) result in the MEMS sensor (22, 86) being less susceptible to movement of the support structure (26) due to this deformation.
摘要翻译： MEMS传感器（20,86）包括悬挂在基板（24）的表面（28）上方并通过弹簧元件（30,32,34）连接到基板（24）的支撑结构（26）。证明物质（36）悬挂在基底（24）上方，并通过扭转元件（38）连接到支撑结构（26）。与证明物质（36）间隔开的电极（42,44）连接到支撑结构（26）并悬挂在基底（24）上方。通过支撑结构（26）将基片（24）的表面（28）上方的电极（42,44）和检验质量块（36）悬挂在基本上物理上隔离下面的基底（24）的变形。此外，通过弹簧元件（30,32,34）的连接导致MEMS传感器（22,86）由于这种变形而不易受支撑结构（26）的移动的影响。

4. 发明授权

US08610222B2 MEMS device with central anchor for stress isolation 有权
标题翻译：具有中心锚杆的MEMS器件用于应力隔离
公开(公告)号：US08610222B2
公开(公告)日：2013-12-17
申请号：US13088579
申请日：2011-04-18
申请人： Yizhen Lin , Gary G. Li , Andrew C. McNeil , Todd F. Miller , Lisa Z. Zhang
发明人： Yizhen Lin , Gary G. Li , Andrew C. McNeil , Todd F. Miller , Lisa Z. Zhang
IPC分类号： H01L27/14
CPC分类号： B81B3/0072 , B81B2203/0136 , B81B2203/0307
摘要： A MEMS device (20) includes a proof mass (32) coupled to and surrounding an immovable structure (30). The immovable structure (30) includes fixed fingers (36, 38) extending outwardly from a body (34) of the structure (30). The proof mass (32) includes movable fingers (60), each of which is disposed between a pair (62) of the fixed fingers (36, 38). A central area (42) of the body (34) is coupled to an underlying substrate (24), with the remainder of the immovable structure (30) and the proof mass (32) being suspended above the substrate (24) to largely isolate the MEMS device (20) from package stress, Additionally, the MEMS device (20) includes isolation trenches (80) and interconnects (46, 50, 64) so that the fixed fingers (36), the fixed fingers (38), and the movable fingers (60) are electrically isolated from one another to yield a differential device configuration.
摘要翻译： MEMS装置（20）包括联接到并围绕不可移动结构（30）的检验质量块（32）。不动结构（30）包括从结构（30）的主体（34）向外延伸的固定指状物（36,38）。检测质量块（32）包括可动指状物（60），每个指状物设置在固定指状物（36,38）的一对（62）之间。主体（34）的中心区域（42）联接到下面的基板（24），其中不可移动的结构（30）的其余部分和证明质量块（32）悬挂在基板（24）上方以大大隔离另外，MEMS器件（20）包括隔离沟槽（80）和互连（46,50,64），使得固定指状物（36），固定指状物（38）和可动指状物（60）彼此电隔离以产生差分装置构型。

5. 发明申请

US20130104651A1 INERTIAL SENSOR WITH OFF-AXIS SPRING SYSTEM 有权
标题翻译：具有偏轴弹簧系统的惯性传感器
公开(公告)号：US20130104651A1
公开(公告)日：2013-05-02
申请号：US13282192
申请日：2011-10-26
申请人： Gary G. Li , Yizhen Lin , Andrew C. McNeil , Lisa Z. Zhang
发明人： Gary G. Li , Yizhen Lin , Andrew C. McNeil , Lisa Z. Zhang
IPC分类号： G01C19/56
CPC分类号： G01C19/5747 , G01C19/5762
摘要： An inertial sensor (20) includes a drive mass (30) configured to undergo oscillatory motion and a sense mass (32) linked to the drive mass (30). On-axis torsion springs (58) are coupled to the sense mass (32), the on-axis torsion springs (58) being co-located with an axis of rotation (22). The inertial sensor (20) further includes an off-axis spring system (60). The off-axis spring system (60) includes off-axis springs (68, 70, 72, 74), each having a connection interface (76) coupled to the sense mass (32) at a location on the sense mass (32) that is displaced away from the axis of rotation (22). Together, the on-axis torsion springs (58) and the off-axis spring system (60) enable the sense mass (32) to oscillate out of plane about the axis of rotation (22) at a sense frequency that substantially matches a drive frequency of the drive mass (30).
摘要翻译：惯性传感器（20）包括构造成经历振荡运动的驱动质量块（30）和与驱动质量块（30）连接的感测质量块（32）。轴上扭转弹簧（58）联接到感测质量块（32），所述轴上扭转弹簧（58）与旋转轴线（22）共同定位。惯性传感器（20）还包括离轴弹簧系统（60）。离轴弹簧系统（60）包括离轴弹簧（68,70,72,74），每个离轴弹簧具有在感测质量块（32）上的位置处耦合到感测质量块（32）的连接界面（76）其远离旋转轴线（22）移位。一起，轴上扭转弹簧（58）和离轴弹簧系统（60）使得感测质量（32）能够以基本匹配驱动器的感测频率围绕旋转轴线（22）摆动离开平面驱动质量（30）的频率。

6. 发明申请

US20120262026A1 MEMS DEVICE WITH CENTRAL ANCHOR FOR STRESS ISOLATION 有权
标题翻译：具有中心锚杆的应力分离的MEMS装置
公开(公告)号：US20120262026A1
公开(公告)日：2012-10-18
申请号：US13088579
申请日：2011-04-18
申请人： Yizhen Lin , Gary G. Li , Andrew C. McNeil , Lisa Z. Zhang , Todd F. Miller
发明人： Yizhen Lin , Gary G. Li , Andrew C. McNeil , Lisa Z. Zhang , Todd F. Miller
IPC分类号： H02N11/00
CPC分类号： B81B3/0072 , B81B2203/0136 , B81B2203/0307
摘要： A MEMS device (20) includes a proof mass (32) coupled to and surrounding an immovable structure (30). The immovable structure (30) includes fixed fingers (36, 38) extending outwardly from a body (34) of the structure (30). The proof mass (32) includes movable fingers (60), each of which is disposed between a pair (62) of the fixed fingers (36, 38). A central area (42) of the body (34) is coupled to an underlying substrate (24), with the remainder of the immovable structure (30) and the proof mass (32) being suspended above the substrate (24) to largely isolate the MEMS device (20) from package stress, Additionally, the MEMS device (20) includes isolation trenches (80) and interconnects (46, 50, 64) so that the fixed fingers (36), the fixed fingers (38), and the movable fingers (60) are electrically isolated from one another to yield a differential device configuration.
摘要翻译： MEMS装置（20）包括联接到并围绕不可移动结构（30）的检验质量块（32）。不动结构（30）包括从结构（30）的主体（34）向外延伸的固定指状物（36,38）。检测质量块（32）包括可动指状物（60），每个指状物设置在固定指状物（36,38）的一对（62）之间。主体（34）的中心区域（42）联接到下面的基板（24），其中不可移动的结构（30）的其余部分和证明质量块（32）悬挂在基板（24）上方以大大隔离另外，MEMS器件（20）包括隔离沟槽（80）和互连（46,50,64），使得固定指状物（36），固定指状物（38）和可动指状物（60）彼此电隔离以产生差分装置构型。

7. 发明授权

US08927311B2 MEMS device having variable gap width and method of manufacture 有权
标题翻译：具有可变间隙宽度的MEMS器件和制造方法
公开(公告)号：US08927311B2
公开(公告)日：2015-01-06
申请号：US13028930
申请日：2011-02-16
申请人： Andrew C. McNeil , Yizhen Lin , Lisa Z. Zhang
发明人： Andrew C. McNeil , Yizhen Lin , Lisa Z. Zhang
IPC分类号： B81B3/00 , G01P15/08 , G01P15/125
CPC分类号： B81B3/0056 , B81B7/02 , B81B2201/0235 , B81B2203/058 , B81B2203/06 , G01P15/0802 , G01P15/125 , G01P2015/0831 , H01L21/6835 , H01L22/34 , H01L2924/1461 , Y10T29/49156
摘要： A MEMS device (40) includes a base structure (42) and a microstructure (44) suspended above the structure (42). The base structure (42) includes an oxide layer (50) formed on a substrate (48), a structural layer (54) formed on the oxide layer (50), and an insulating layer (56) formed over the structural layer (54). A sacrificial layer (112) is formed overlying the base structure (42), and the microstructure (44) is formed in another structural layer (116) over the sacrificial layer (112). Methodology (90) entails removing the sacrificial layer (112) and a portion of the oxide layer (50) to release the microstructure (44) and to expose a top surface (52) of the substrate (48). Following removal, a width (86) of a gap (80) produced between the microstructure (44) and the top surface (52) is greater than a width (88) of a gap (84) produced between the microstructure (44) and the structural layer (54).
摘要翻译： MEMS器件（40）包括基部结构（42）和悬挂在结构（42）上方的微结构（44）。基底结构（42）包括形成在基底（48）上的氧化物层（50），形成在氧化物层（50）上的结构层（54）和形成在结构层（54）上的绝缘层）。牺牲层（112）形成在基部结构（42）上方，并且微结构（44）形成在牺牲层（112）上方的另一个结构层（116）中。方法（90）需要去除牺牲层（112）和氧化物层（50）的一部分以释放微结构（44）并暴露衬底（48）的顶表面（52）。在移除之后，在微结构（44）和顶表面（52）之间产生的间隙（80）的宽度（86）大于在微结构（44）和微结构（44）之间产生的间隙（84）的宽度（88）结构层（54）。

8. 发明申请

US20140260616A1 MEMS DEVICE HAVING VARIABLE GAP WIDTH AND METHOD OF MANUFACTURE 有权
标题翻译：具有可变宽度宽度的MEMS器件及其制造方法
公开(公告)号：US20140260616A1
公开(公告)日：2014-09-18
申请号：US14290297
申请日：2014-05-29
申请人： Andrew C. McNeil , Yizhen Lin , Lisa Z. Zhang
发明人： Andrew C. McNeil , Yizhen Lin , Lisa Z. Zhang
IPC分类号： G01P15/125 , B81B7/02 , G01P15/08
CPC分类号： B81B3/0056 , B81B7/02 , B81B2201/0235 , B81B2203/058 , B81B2203/06 , G01P15/0802 , G01P15/125 , G01P2015/0831 , H01L21/6835 , H01L22/34 , H01L2924/1461 , Y10T29/49156
摘要： A MEMS device (40) includes a base structure (42) and a microstructure (44) suspended above the structure (42). The base structure (42) includes an oxide layer (50) formed on a substrate (48), a structural layer (54) formed on the oxide layer (50), and an insulating layer (56) formed over the structural layer (54). A sacrificial layer (112) is formed overlying the base structure (42), and the microstructure (44) is formed in another structural layer (116) over the sacrificial layer (112). Methodology (90) entails removing the sacrificial layer (112) and a portion of the oxide layer (50) to release the microstructure (44) and to expose a top surface (52) of the substrate (48). Following removal, a width (86) of a gap (80) produced between the microstructure (44) and the top surface (52) is greater than a width (88) of a gap (84) produced between the microstructure (44) and the structural layer (54).
摘要翻译： MEMS器件（40）包括基部结构（42）和悬挂在结构（42）上方的微结构（44）。基底结构（42）包括形成在基板（48）上的氧化物层（50），形成在氧化物层（50）上的结构层（54）和形成在结构层（54）上的绝缘层）。牺牲层（112）形成在基部结构（42）上方，并且微结构（44）形成在牺牲层（112）上方的另一个结构层（116）中。方法（90）需要去除牺牲层（112）和氧化物层（50）的一部分以释放微结构（44）并暴露衬底（48）的顶表面（52）。在移除之后，在微结构（44）和顶表面（52）之间产生的间隙（80）的宽度（86）大于在微结构（44）和微结构（44）之间产生的间隙（84）的宽度（88）结构层（54）。

9. 发明申请

US20120204642A1 MEMS Device Having Variable Gap Width and Method of Manufacture 有权
标题翻译：具有可变间隙宽度的MEMS器件和制造方法
公开(公告)号：US20120204642A1
公开(公告)日：2012-08-16
申请号：US13028930
申请日：2011-02-16
申请人： Andrew C. McNeil , Yizhen Lin , Lisa Z. Zhang
发明人： Andrew C. McNeil , Yizhen Lin , Lisa Z. Zhang
IPC分类号： G01P15/125 , H05K3/02
CPC分类号： B81B3/0056 , B81B7/02 , B81B2201/0235 , B81B2203/058 , B81B2203/06 , G01P15/0802 , G01P15/125 , G01P2015/0831 , H01L21/6835 , H01L22/34 , H01L2924/1461 , Y10T29/49156
摘要： A MEMS device (40) includes a base structure (42) and a microstructure (44) suspended above the structure (42). The base structure (42) includes an oxide layer (50) formed on a substrate (48), a structural layer (54) formed on the oxide layer (50), and an insulating layer (56) formed over the structural layer (54). A sacrificial layer (112) is formed overlying the base structure (42), and the microstructure (44) is formed in another structural layer (116) over the sacrificial layer (112). Methodology (90) entails removing the sacrificial layer (112) and a portion of the oxide layer (50) to release the microstructure (44) and to expose a top surface (52) of the substrate (48). Following removal, a width (86) of a gap (80) produced between the microstructure (44) and the top surface (52) is greater than a width (88) of a gap (84) produced between the microstructure (44) and the structural layer (54).
摘要翻译： MEMS器件（40）包括基部结构（42）和悬挂在结构（42）上方的微结构（44）。基底结构（42）包括形成在基板（48）上的氧化物层（50），形成在氧化物层（50）上的结构层（54）和形成在结构层（54）上的绝缘层）。牺牲层（112）形成在基部结构（42）上方，并且微结构（44）形成在牺牲层（112）上方的另一个结构层（116）中。方法（90）需要去除牺牲层（112）和氧化物层（50）的一部分以释放微结构（44）并暴露衬底（48）的顶表面（52）。在移除之后，在微结构（44）和顶表面（52）之间产生的间隙（80）的宽度（86）大于在微结构（44）和微结构（44）之间产生的间隙（84）的宽度（88）结构层（54）。

10. 发明授权

US09003886B2 Microelectromechanical systems devices and methods for the fabrication thereof 有权
标题翻译：微机电系统装置及其制造方法
公开(公告)号：US09003886B2
公开(公告)日：2015-04-14
申请号：US13458950
申请日：2012-04-27
申请人： Yizhen Lin , Sung Jin Jo , Lisa Z. Zhang
发明人： Yizhen Lin , Sung Jin Jo , Lisa Z. Zhang
IPC分类号： G01P15/125 , G01C19/56 , G01P15/08
CPC分类号： G01P15/0802 , G01P15/125 , G01P2015/0814 , Y10T29/49002
摘要： Embodiments of compact micro-electro-mechanical systems (MEMS) devices are provided, as are embodiments of methods for fabricating MEMS devices. In one embodiment, the MEMS device includes a substrate, a movable structure resiliently coupled to the substrate, and an anchored structure fixedly coupled to the substrate. The movable structure includes a first plurality of movable fingers, and a second plurality of movable fingers electrically isolated from and interspersed with the first plurality of movable fingers. The anchored structure includes fixed fingers interspersed with first and second pluralities of movable fingers in a capacitor-forming relationship. First and second interconnects are electrically coupled to the first and second pluralities of movable fingers, respectively.
摘要翻译：提供紧凑型微机电系统（MEMS）装置的实施例，如制造MEMS器件的方法的实施例。在一个实施例中，MEMS器件包括衬底，弹性地耦合到衬底的可移动结构以及固定地耦合到衬底的锚定结构。可移动结构包括第一多个可动指状物，以及与第一多个活动指状物电隔离并与之分散的第二多个可移动指状物。锚固结构包括以电容器形成关系散布有第一和第二多个可动指状物的固定指状物。第一和第二互连分别电耦合到第一和第二多个可动指状物。

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