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    • 4. 发明申请
    • METHOD TO PREVENT THIN SPOT IN LARGE SIZE SYSTEM
    • 在大型系统中防止漏点的方法
    • US20100151688A1
    • 2010-06-17
    • US12634921
    • 2009-12-10
    • Young Jin ChoiGaku FurutaSoo Young ChoiBeom Soo Park
    • Young Jin ChoiGaku FurutaSoo Young ChoiBeom Soo Park
    • H01L21/3065H01L21/302
    • C23C16/4583C23C16/505H01J37/32091H01J37/32733H01L21/68742
    • Embodiments disclosed herein generally include methods of ensuring uniform deposition on a substrate. The smallest gap between a portion of the substrate and the substrate support upon which the substrate rests may lead to uneven deposition of material or ‘thin spots’ on the substrate. Large area substrates, due to their size, are susceptible to numerous gaps at random locations. By inducing an electrostatic charge on the substrate prior to placing the substrate onto the substrate support, the substrate may be placed generally flush against the substrate support. The electrostatic charge on the substrate creates an attraction between the substrate and substrate support to pull substantially the entire surface of the substrate into contact with the substrate support. Material may then be substantially uniformly deposited on the substrate while reducing ‘thin spots’.
    • 本文公开的实施例通常包括确保在基底上均匀沉积的方法。 衬底的一部分和衬底支撑物之间的最小间隙可能导致材料的不均匀沉积或衬底上的“薄点”。 由于其大尺寸,大面积基板在随机位置易受许多间隙的影响。 通过在将衬底放置在衬底支撑件上之前在衬底上引起静电电荷,衬底可以放置在与衬底支撑件相对齐齐的位置。 衬底上的静电电荷在衬底和衬底支撑件之间产生吸引力,以基本上将衬底的整个表面拉到与衬底支撑件接触。 然后可以将材料基本均匀地沉积在衬底上,同时减少“薄点”。