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1. 发明授权

US09390998B2 Heat spreading substrate 有权
标题翻译：散热基板
公开(公告)号：US09390998B2
公开(公告)日：2016-07-12
申请号：US13399952
申请日：2012-02-17
申请人： Ilyas Mohammed , Liang Wang , Gabriel Z. Guevara
发明人： Ilyas Mohammed , Liang Wang , Gabriel Z. Guevara
IPC分类号： H01L23/62 , H01L23/373
CPC分类号： H01L23/3735 , H01L2924/0002 , H01L2924/00
摘要： Heat spreading substrate. In accordance with an embodiment of the present invention, an apparatus includes a thermally conductive, electrically insulating regular solid, a first electrically conductive coating mechanically coupled to a first edge of the regular solid and a second electrically conductive coating mechanically coupled to a second edge of the regular solid. The first and the second electrically conductive coatings are electrically isolated from one another and the faces of the first electrically conductive coating, the second electrically conductive coating and the regular solid are substantially co-planar. The primary and secondary surfaces of the regular solid may be free of electrically conductive materials.
摘要翻译：散热基板。根据本发明的实施例，一种装置包括导热的，电绝缘的规则固体，机械耦合到正常固体的第一边缘的第一导电涂层和机械耦合到第二边缘的第二导电涂层正规固体。第一和第二导电涂层彼此电隔离，并且第一导电涂层，第二导电涂层和常规固体的表面基本上是共面的。正规固体的主表面和次表面可以不含导电材料。

2. 发明申请

US20130215121A1 HEAT SPREADING SUBSTRATE 有权
标题翻译：热传播基板
公开(公告)号：US20130215121A1
公开(公告)日：2013-08-22
申请号：US13399952
申请日：2012-02-17
申请人： Gabriel Z. Guevara , Ilyas Mohammed , Liang Wang
发明人： Gabriel Z. Guevara , Ilyas Mohammed , Liang Wang
IPC分类号： H05K7/20 , G06T1/00 , B05D5/12 , F21V29/00
CPC分类号： H01L23/3735 , H01L2924/0002 , H01L2924/00
摘要： Heat spreading substrate. In accordance with an embodiment of the present invention, an apparatus includes a thermally conductive, electrically insulating regular solid, a first electrically conductive coating mechanically coupled to a first edge of the regular solid and a second electrically conductive coating mechanically coupled to a second edge of the regular solid. The first and the second electrically conductive coatings are electrically isolated from one another and the faces of the first electrically conductive coating, the second electrically conductive coating and the regular solid are substantially co-planar. The primary and secondary surfaces of the regular solid may be free of electrically conductive materials.
摘要翻译：散热基板。根据本发明的实施例，一种装置包括导热的，电绝缘的规则固体，机械耦合到正常固体的第一边缘的第一导电涂层和机械耦合到第二边缘的第二导电涂层正规固体。第一和第二导电涂层彼此电隔离，并且第一导电涂层，第二导电涂层和常规固体的表面基本上是共面的。正规固体的主表面和次表面可以不含导电材料。

3. 发明授权

US08900974B2 High yield substrate assembly 有权
公开(公告)号：US08900974B2
公开(公告)日：2014-12-02
申请号：US13462676
申请日：2012-05-02
申请人： Liang Wang , Ilyas Mohammed , Masud Beroz
发明人： Liang Wang , Ilyas Mohammed , Masud Beroz
IPC分类号： H01L21/20 , H01L21/36 , H01L23/00 , H01L33/00 , H01L25/00 , H01L21/683
CPC分类号： H01L23/562 , H01L21/02002 , H01L21/02035 , H01L21/02378 , H01L21/02381 , H01L21/02389 , H01L21/02392 , H01L21/02395 , H01L21/02414 , H01L21/6835 , H01L23/544 , H01L24/19 , H01L24/32 , H01L24/83 , H01L25/50 , H01L27/0207 , H01L33/005 , H01L33/0062 , H01L2924/12041 , H01L2924/12042 , H01L2924/13091 , H01L2924/351 , H01L2924/00
摘要： High yield substrate assembly. In accordance with a first method embodiment, a plurality of piggyback substrates are attached to a carrier substrate. The edges of the plurality of the piggyback substrates are bonded to one another. The plurality of piggyback substrates are removed from the carrier substrate to form a substrate assembly. The substrate assembly is processed to produce a plurality of integrated circuit devices on the substrate assembly. The processing may use manufacturing equipment designed to process wafers larger than individual instances of the plurality of piggyback substrates.

4. 发明授权

US08841204B2 High yield substrate assembly 有权
标题翻译：高产量基板组件
公开(公告)号：US08841204B2
公开(公告)日：2014-09-23
申请号：US13908902
申请日：2013-06-03
申请人： Liang Wang , Ilyas Mohammed , Masud Beroz
发明人： Liang Wang , Ilyas Mohammed , Masud Beroz
IPC分类号： H01L21/00 , H01L21/30 , H01L21/46 , H01L23/00 , H01L33/00 , H01L21/683 , H01L25/00
CPC分类号： H01L23/562 , H01L21/02002 , H01L21/02035 , H01L21/02378 , H01L21/02381 , H01L21/02389 , H01L21/02392 , H01L21/02395 , H01L21/02414 , H01L21/6835 , H01L23/544 , H01L24/19 , H01L24/32 , H01L24/83 , H01L25/50 , H01L27/0207 , H01L33/005 , H01L33/0062 , H01L2924/12041 , H01L2924/12042 , H01L2924/13091 , H01L2924/351 , H01L2924/00
摘要： High yield substrate assembly. In accordance with a first method embodiment, a plurality of piggyback substrates are attached to a carrier substrate. The edges of the plurality of the piggyback substrates are bonded to one another. The plurality of piggyback substrates are removed from the carrier substrate to form a substrate assembly. The substrate assembly is processed to produce a plurality of integrated circuit devices on the substrate assembly. The processing may use manufacturing equipment designed to process wafers larger than individual instances of the plurality of piggyback substrates.
摘要翻译：高产量基板组件。根据第一方法实施例，将多个搭载基板附接到载体基板。多个搭载基板的边缘彼此接合。将多个搭载基板从载体基板上移除以形成基板组件。处理衬底组件以在衬底组件上产生多个集成电路器件。处理可以使用设计成处理大于多个背负式基板的单独实例的晶片的制造设备。

5. 发明申请

US20140008607A1 QUANTUM EFFICIENCY OF MULTIPLE QUANTUM WELLS 有权
标题翻译：多量子阱的量子效率
公开(公告)号：US20140008607A1
公开(公告)日：2014-01-09
申请号：US13541559
申请日：2012-07-03
申请人： Liang Wang , Ilyas Mohammed , Masud Beroz
发明人： Liang Wang , Ilyas Mohammed , Masud Beroz
IPC分类号： H01L33/06
CPC分类号： H01L33/0075 , B82Y20/00 , H01L31/035236 , H01L31/105 , H01L33/0025 , H01L33/0066 , H01L33/06 , H01L33/24 , H01L33/32 , H01L33/62 , H01L2933/0033 , H01L2933/0066 , H01S5/2009 , H01S5/3205 , H01S5/3407 , H01S5/34333
摘要： Improved quantum efficiency of multiple quantum wells. In accordance with an embodiment of the present invention, an article of manufacture includes a p side for supplying holes and an n side for supplying electrons. The article of manufacture also includes a plurality of quantum well periods between the p side and the n side, each of the quantum well periods includes a quantum well layer and a barrier layer, with each of the barrier layers having a barrier height. The plurality of quantum well periods include different barrier heights.
摘要翻译：提高多量子阱的量子效率。根据本发明的实施例，制品包括用于供应空穴的p侧和用于提供电子的n侧。制品还包括在p侧和n侧之间的多个量子阱周期，每个量子阱周期包括量子阱层和阻挡层，其中每个势垒层具有势垒高度。多个量子阱周期包括不同的屏障高度。

6. 发明申请

US20130126921A1 INVERTED OPTICAL DEVICE 有权
标题翻译：反转光学器件
公开(公告)号：US20130126921A1
公开(公告)日：2013-05-23
申请号：US13299714
申请日：2011-11-18
申请人： Ilyas Mohammed , Masud Beroz , Liang Wang
发明人： Ilyas Mohammed , Masud Beroz , Liang Wang
IPC分类号： H01L33/58 , H01L33/62 , H01L33/08
CPC分类号： H01L25/167 , H01L33/0079 , H01L33/06 , H01L33/22 , H01L33/32 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： Inverted optical device. In accordance with an embodiment of the present invention, a plurality of piggyback substrates are attached to a carrier wafer. The plurality of piggyback substrates are dissimilar in composition to the carrier wafer. The plurality of piggyback substrates are processed, while attached to the carrier wafer, to produce a plurality of integrated circuit devices. A flip wafer is attached to the plurality of light emitting diodes, away from the carrier wafer and the carrier wafer is removed. The plurality of light emitting diodes may be singulated to form individual light emitting diode devices.
摘要翻译：倒置光学器件。根据本发明的一个实施例，多个搭载基板被附着在载体晶片上。多个背负衬底的组成与载体晶片不同。在附着于载体晶片的同时处理多个搭载基板以产生多个集成电路装置。翻转晶片附着到多个发光二极管，远离载体晶片，并移除载体晶片。多个发光二极管可以被单个化以形成单独的发光二极管器件。

7. 发明申请

US20140008669A1 PARALLEL PLATE SLOT EMISSION ARRAY 有权
标题翻译：平行板槽排放阵列
公开(公告)号：US20140008669A1
公开(公告)日：2014-01-09
申请号：US13543697
申请日：2012-07-06
申请人： Ilyas Mohammed , Liang Wang , Steven D. Gottke
发明人： Ilyas Mohammed , Liang Wang , Steven D. Gottke
IPC分类号： H01L27/15 , H01L33/60
CPC分类号： H01L33/60 , F21K9/23 , F21Y2115/10 , H01L25/0753 , H01L27/156 , H01L33/62 , H01L2224/48463 , H01L2224/73265 , H01L2224/8592 , H01L2924/19107 , H01L2933/0066
摘要： Parallel plate slot emission array. In accordance with an embodiment of the present invention, an article of manufacture includes a side-emitting light emitting diode configured to emit light from more than two surfaces. The article of manufacture includes a first sheet electrically and thermally coupled to a first side of the light emitting diode, and a second sheet electrically and thermally coupled to a second side of the light emitting diode. The article of manufacture further includes a plurality of reflective surfaces configured to reflect light from all of the surfaces of the light emitting diode through holes in the first sheet. The light may be reflected via total internal reflection.
摘要翻译：平行板槽发射阵列。根据本发明的实施例，制品包括被配置为从多于两个表面发射光的侧面发光发光二极管。该制品包括电和热耦合到发光二极管的第一侧的第一片，以及电耦合到发光二极管的第二侧的第二片。制品还包括多个反射表面，其被配置为通过第一片材中的孔反射来自发光二极管的所有表面的光。光可以通过全内反射来反射。

8. 发明申请

US20130127364A1 FRONT FACING PIGGYBACK WAFER ASSEMBLY 有权
公开(公告)号：US20130127364A1
公开(公告)日：2013-05-23
申请号：US13299672
申请日：2011-11-18
申请人： Ilyas Mohammed , Masud Beroz , Liang Wang
发明人： Ilyas Mohammed , Masud Beroz , Liang Wang
IPC分类号： H05B37/02 , H01L33/62 , H01L33/38 , H01L21/78
CPC分类号： H01L25/162 , F21K9/23 , F21Y2115/10 , H01L21/6835 , H01L21/78 , H01L24/24 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/97 , H01L25/167 , H01L33/0079 , H01L33/62 , H01L33/644 , H01L2221/6835 , H01L2224/05567 , H01L2224/05686 , H01L2224/06102 , H01L2224/24105 , H01L2224/24226 , H01L2224/29186 , H01L2224/32225 , H01L2224/73267 , H01L2224/83896 , H01L2224/92244 , H01L2224/94 , H01L2224/97 , H01L2924/00014 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/1461 , Y02B20/42 , H01L2924/01031 , H01L2924/0503 , H01L2924/053 , H01L2224/83 , H01L2924/00 , H01L2224/05552
摘要： Front facing piggyback wafer assembly. In accordance with an embodiment of the present invention, a plurality of piggyback substrates are attached to a carrier wafer. The plurality of piggyback substrates are dissimilar in composition to the carrier wafer. The plurality of piggyback substrates are processed, while attached to the carrier wafer, to produce a plurality of integrated circuit devices. The plurality of integrated circuit devices are singulated to form individual integrated circuit devices. The carrier wafer may be processed to form integrated circuit structures prior to the attaching.

9. 发明授权

US08975616B2 Quantum efficiency of multiple quantum wells 有权
标题翻译：多量子阱的量子效率
公开(公告)号：US08975616B2
公开(公告)日：2015-03-10
申请号：US13541559
申请日：2012-07-03
申请人： Liang Wang , Ilyas Mohammed , Masud Beroz
发明人： Liang Wang , Ilyas Mohammed , Masud Beroz
IPC分类号： H01L29/06 , H01L31/00 , H01L33/06 , H01L31/0352 , H01L31/105 , H01L33/24 , H01S5/20 , H01S5/34 , H01S5/343 , H01S5/32
CPC分类号： H01L33/0075 , B82Y20/00 , H01L31/035236 , H01L31/105 , H01L33/0025 , H01L33/0066 , H01L33/06 , H01L33/24 , H01L33/32 , H01L33/62 , H01L2933/0033 , H01L2933/0066 , H01S5/2009 , H01S5/3205 , H01S5/3407 , H01S5/34333
摘要： Improved quantum efficiency of multiple quantum wells. In accordance with an embodiment of the present invention, an article of manufacture includes a p side for supplying holes and an n side for supplying electrons. The article of manufacture also includes a plurality of quantum well periods between the p side and the n side, each of the quantum well periods includes a quantum well layer and a barrier layer, with each of the barrier layers having a barrier height. The plurality of quantum well periods include different barrier heights.
摘要翻译：提高多量子阱的量子效率。根据本发明的实施例，制品包括用于供应空穴的p侧和用于提供电子的n侧。制品还包括在p侧和n侧之间的多个量子阱周期，每个量子阱周期包括量子阱层和阻挡层，其中每个势垒层具有势垒高度。多个量子阱周期包括不同的屏障高度。

10. 发明授权

US08664681B2 Parallel plate slot emission array 有权
标题翻译：平行板槽发射阵列
公开(公告)号：US08664681B2
公开(公告)日：2014-03-04
申请号：US13543697
申请日：2012-07-06
申请人： Ilyas Mohammed , Liang Wang , Steven D. Gottke
发明人： Ilyas Mohammed , Liang Wang , Steven D. Gottke
IPC分类号： H01L29/22 , H01L29/227 , H01L33/00 , H01L29/18 , H01L27/15 , H01L29/26 , H01L31/12 , H01L29/06 , H01L31/0328 , H01L31/0336 , H01L31/072 , H01L31/109
CPC分类号： H01L33/60 , F21K9/23 , F21Y2115/10 , H01L25/0753 , H01L27/156 , H01L33/62 , H01L2224/48463 , H01L2224/73265 , H01L2224/8592 , H01L2924/19107 , H01L2933/0066
摘要： Parallel plate slot emission array. In accordance with an embodiment of the present invention, an article of manufacture includes a side-emitting light emitting diode configured to emit light from more than two surfaces. The article of manufacture includes a first sheet electrically and thermally coupled to a first side of the light emitting diode, and a second sheet electrically and thermally coupled to a second side of the light emitting diode. The article of manufacture further includes a plurality of reflective surfaces configured to reflect light from all of the surfaces of the light emitting diode through holes in the first sheet. The light may be reflected via total internal reflection.
摘要翻译：平行板槽发射阵列。根据本发明的实施例，制品包括被配置为从多于两个表面发射光的侧面发光发光二极管。该制品包括电和热耦合到发光二极管的第一侧的第一片，以及电耦合到发光二极管的第二侧的第二片。制品还包括多个反射表面，其被配置为通过第一片材中的孔反射来自发光二极管的所有表面的光。光可以通过全内反射来反射。

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