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    • 1. 发明授权
    • Heat spreading substrate
    • 散热基板
    • US09390998B2
    • 2016-07-12
    • US13399952
    • 2012-02-17
    • Ilyas MohammedLiang WangGabriel Z. Guevara
    • Ilyas MohammedLiang WangGabriel Z. Guevara
    • H01L23/62H01L23/373
    • H01L23/3735H01L2924/0002H01L2924/00
    • Heat spreading substrate. In accordance with an embodiment of the present invention, an apparatus includes a thermally conductive, electrically insulating regular solid, a first electrically conductive coating mechanically coupled to a first edge of the regular solid and a second electrically conductive coating mechanically coupled to a second edge of the regular solid. The first and the second electrically conductive coatings are electrically isolated from one another and the faces of the first electrically conductive coating, the second electrically conductive coating and the regular solid are substantially co-planar. The primary and secondary surfaces of the regular solid may be free of electrically conductive materials.
    • 散热基板。 根据本发明的实施例,一种装置包括导热的,电绝缘的规则固体,机械耦合到正常固体的第一边缘的第一导电涂层和机械耦合到第二边缘的第二导电涂层 正规固体。 第一和第二导电涂层彼此电隔离,并且第一导电涂层,第二导电涂层和常规固体的表面基本上是共面的。 正规固体的主表面和次表面可以不含导电材料。