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1. 发明授权

US06365260B1 Arrangement for heat dissipation in chip modules on multilayered ceramic carriers, in particular multichip modules 失效
标题翻译：多层陶瓷载体上芯片模块散热的布置，特别是多芯片模块
公开(公告)号：US06365260B1
公开(公告)日：2002-04-02
申请号：US09202112
申请日：1999-07-08
申请人： Günther Stecher , Annette Seibold
发明人： Günther Stecher , Annette Seibold
IPC分类号： H01L23427
CPC分类号： H01L23/427 , H01L25/0655 , H01L25/072 , H01L2924/0002 , H01L2924/09701 , H05K1/0272 , H05K1/0306 , Y10S428/901 , Y10T428/24331 , Y10T428/24562 , Y10T428/24661 , Y10T428/24744 , H01L2924/00
摘要： A heat dissipation arrangement for chip modules on multilayer ceramic substrates, in particular multichip modules, in which passages for a heat-conducting medium are provided in the ceramic substrate. The multilayer ceramic substrate is mounted on a metal heat sink. Thermal passages, in particular in the form of a hole pattern or array, are provided in the top layer of the multilayer ceramic substrate, in the region of the chip to be mounted. A cavity functioning as an evaporation chamber is provided in the layer of the multilayer ceramic substrate directly beneath the top layer, in the region of the chip to be mounted, and a trough-shaped recess functioning as a condenser is provided in the metal heat sink, in the region of the chip to be mounted. In the layers of the multilayer ceramic substrate located between the evaporation chamber and the condenser, in the region of these two chambers, a series of large steam channels and small condensate channels, the latter functioning as capillaries is provided, which interconnect these two chambers. This arrangement forms a miniaturized heat pipe structure which can transport a great amount of energy per unit of time across short distances.
摘要翻译：在多层陶瓷基板，特别是多芯片模块中的芯片模块的散热装置，其中在陶瓷基板中提供用于导热介质的通道。多层陶瓷基板安装在金属散热器上。特别是孔图案或阵列形式的热通道在待安装的芯片的区域中设置在多层陶瓷基板的顶层中。作为蒸发室的空腔设置在多层陶瓷基板的正下方的顶层的下方，在要安装的芯片的区域中，并且用作冷凝器的槽形凹部设置在金属散热器，在要安装的芯片的区域。在位于蒸发室和冷凝器之间的多层陶瓷基板的层中，在这两个室的区域中，提供了一系列大的蒸汽通道和小的冷凝物通道，后者用作毛细管，其连接这两个室。这种布置形成了一种小型化的热管结构，其可以在短距离内每单位时间输送大量的能量。

2. 发明授权

US5974898A Force sensor having test deflection device 失效
标题翻译：力传感器具有测试偏转装置
公开(公告)号：US5974898A
公开(公告)日：1999-11-02
申请号：US782915
申请日：1997-01-13
申请人： Wolfgang Golderer , Andreas Reppich , Manfred Moser , Annette Seibold , Reiner Schuetz
发明人： Wolfgang Golderer , Andreas Reppich , Manfred Moser , Annette Seibold , Reiner Schuetz
IPC分类号： G01L1/14 , G01L9/00 , G01L9/12 , G01L25/00 , G01D7/00
CPC分类号： G01L25/00 , G01L1/142 , G01L9/0072
摘要： A force sensor has a measuring diaphragm adapted to undergo a deflection in response to a force being applied thereto. The force sensor further has a test deflection device operatively coupled to the measuring diaphragm for effecting a test deflection thereof independently of any force external to the force sensor being applied to the measuring diaphragm.
摘要翻译：力传感器具有适于经受施加于其上的力的偏转的测量膜片。力传感器还具有可操作地耦合到测量膜片的测试偏转装置，用于独立于施加到测量膜片的力传感器外部的任何力而进行测试偏转。

3. 发明授权

US5990028A Dielectric paste 失效
标题翻译：电介质糊
公开(公告)号：US5990028A
公开(公告)日：1999-11-23
申请号：US934489
申请日：1997-09-19
申请人： Walter Roethlingshoefer , Annette Seibold , Susumu Nishigaki
发明人： Walter Roethlingshoefer , Annette Seibold , Susumu Nishigaki
IPC分类号： C04B35/00 , C04B35/46 , C04B35/468 , H01B3/12 , H05K1/03 , H05K1/16 , H05K3/46
CPC分类号： H01B3/12 , C04B35/468 , H05K1/162 , H05K1/0306 , H05K2201/0187 , H05K3/4614 , H05K3/4629
摘要： A high-dielectric lead-free paste serves for the manufacture of at least one area having a high dielectric constant in a ceramic multilayer circuit. The lead-free dielectric paste is basically made of barium titanate nano powder of a suitable particle size and sinters at temperatures below 1000.degree. C., preferably in a range of 800.degree. C. to 1000.degree. C.
摘要翻译：高介电无铅膏用于在陶瓷多层电路中制造具有高介电常数的至少一个区域。无铅电介质糊料基本上由适当粒径的钛酸钡纳米粉末制成，在低于1000℃的温度下烧结，优选在800℃至1000℃的范围内。

4. 发明授权

US5987202A Arrangement for converting optical signals into electrical signals and method of producing the arrangement 失效
标题翻译：将光信号转换为电信号的装置及其制造方法
公开(公告)号：US5987202A
公开(公告)日：1999-11-16
申请号：US875263
申请日：1997-07-18
申请人： Werner Gruenwald , Gerhard Benz , Klaus-Michael Mayer , Annette Seibold
发明人： Werner Gruenwald , Gerhard Benz , Klaus-Michael Mayer , Annette Seibold
IPC分类号： G02B6/36 , G02B6/42 , G02B6/30
CPC分类号： G02B6/4232 , G02B6/4214 , G02B6/3692 , G02B6/3696
摘要： Proposed is a method for producing an arrangement for converting optical signals into electrical signals, the arrangement comprising a substrate having structures for guiding an optical fiber and for deflecting light transmitted by way of the optical fiber. The structures (11, 12, 13) on the substrate (10) are created through the production of a mold of the contour of a molding tool. A ceramic base material is advisably used as the starting material for the substrate (10). The molding is effected through pressing, injection pressing, slip casting, injection molding or reaction casting.
摘要翻译： PCT No.PCT / DE96 / 00026 Sec。 371日期1997年7月18日 102（e）1997年7月18日PCT PCT 1996年1月10日PCT公布。出版物WO96 / 22177 PCT 日期1996年7月25日提出了一种制造用于将光信号转换为电信号的装置的方法，该装置包括具有用于引导光纤并用于偏转通过光纤传输的光的结构的基板。基板（10）上的结构（11,12,13）通过生产模具的轮廓的模具而形成。陶瓷基材优选用作基材（10）的原料。通过压制，注射压力，滑移浇铸，注射成型或反应铸造来实现模制。

5. 发明授权

US5573808A Method for producing a multilayer circuit 失效
标题翻译：多层电路的制造方法
公开(公告)号：US5573808A
公开(公告)日：1996-11-12
申请号：US589234
申请日：1996-01-22
申请人： Werner Gruenwald , Walter Roethlingshoefer , Ulrich Goebel , Ralf Haug , Manfred Moser , Annette Seibold
发明人： Werner Gruenwald , Walter Roethlingshoefer , Ulrich Goebel , Ralf Haug , Manfred Moser , Annette Seibold
IPC分类号： H01G4/30 , H01L21/48 , H01L23/538 , H05K1/09 , H05K1/16 , H05K3/20 , H05K3/46 , B05D5/12 , B41M3/12
CPC分类号： H05K1/162 , H01G4/30 , H01L21/4857 , H01L23/5383 , H01L2924/0002 , H05K1/092 , H05K2201/09236 , H05K2201/09763 , H05K3/207 , H05K3/4611 , H05K3/4629 , Y10T29/435
摘要： In a method for producing a multilayer circuit, it is possible to produce capacitor structures including electrodes and a dielectric arranged in between. By pressing the capacitor structures into a ceramic layer, it is possible to produce a high-quality capacitor inside the multilayer circuit.
摘要翻译：在制造多层电路的方法中，可以制造包括电极和布置在其间的电介质的电容器结构。通过将电容器结构压入陶瓷层，可以在多层电路内产生高质量的电容器。

6. 发明授权

US5885429A Electrochemical measuring sensor and method for producing an electrochemical measuring sensor 失效
标题翻译：电化学测量传感器及电化学测量传感器的制造方法
公开(公告)号：US5885429A
公开(公告)日：1999-03-23
申请号：US860661
申请日：1997-08-08
申请人： Karl-Hermann Friese , Werner Gruenwald , Kurt Schmid , Claudio De La Prieta , Gerhard Schneider , Hans-Joerg Renz , Harald Neumann , Uwe Glanz , Stefan Kuschel , Ralf Haug , Manfred Moser , Kurt Bayha , Annette Seibold , Carmen Schmiedel , Reiner Schuetz
发明人： Karl-Hermann Friese , Werner Gruenwald , Kurt Schmid , Claudio De La Prieta , Gerhard Schneider , Hans-Joerg Renz , Harald Neumann , Uwe Glanz , Stefan Kuschel , Ralf Haug , Manfred Moser , Kurt Bayha , Annette Seibold , Carmen Schmiedel , Reiner Schuetz
IPC分类号： G01N27/409 , G01N27/407 , G01N27/26
CPC分类号： G01N27/4075
摘要： An electrochemical measuring sensor having a solid electrolyte, a first electrode exposed to a gas to be measured and a second electrode exposed to a reference gas, with the electrodes preferably being arranged on opposite sides of the solid electrolyte. At least one of the electrodes (16, 20) is provided with a contouring (24) on its side (22) that is exposed to the gas to be measured or to the reference gas, with the contouring being a trench-shaped groove (26) embossed into the surface of the electrode such that the electrode is pressed into the adjacent solid electrolyte in the region of the groove. According to the method, the embossing is done while the electrode and the solid electrolyte are in the non-sintered state, and the sensor is subsequently sintered.
摘要翻译： PCT No.PCT / DE96 / 01753 Sec。 371日期：1997年8月8日 102（e）日期1997年8月8日PCT提交1996年9月17日PCT公布。公开号WO97 / 17608 日期1997年5月15日具有固体电解质的电化学测量传感器，暴露于待测气体的第一电极和暴露于参考气体的第二电极，电极优选布置在固体电解质的相对侧上。电极（16,20）中的至少一个在其侧面（22）处设置有暴露于待测量气体或参考气体的轮廓（24），其中轮廓是沟槽形凹槽 26）压印到电极的表面中，使得电极在凹槽的区域中被压入相邻的固体电解质中。根据该方法，在电极和固体电解质处于非烧结状态下进行压花，随后将传感器烧结。

7. 发明授权

US5876538A Method for manufacturing a ceramic multilayer substrate for complex electronic circuits 失效
标题翻译：复杂电子电路用陶瓷多层基板的制造方法
公开(公告)号：US5876538A
公开(公告)日：1999-03-02
申请号：US805524
申请日：1997-02-26
申请人： Klaus Steinle , Claudio De La Prieta , Manfred Moser , Annette Seibold
发明人： Klaus Steinle , Claudio De La Prieta , Manfred Moser , Annette Seibold
IPC分类号： H05K3/46 , H01L21/48 , H05K1/03 , H05K1/09 , H05K1/16 , B32B31/26 , H01G4/12 , H01G4/224
CPC分类号： H05K1/162 , H01L21/4857 , H01L21/4867 , H05K1/0306 , H05K1/092 , H05K2201/09763 , H05K3/4611 , H05K3/4629 , Y10T29/435
摘要： Ceramic multilayer substrates as circuit supports for complex electronic circuits wth integrated capacitors are manufactured by printing capacitor structures, using the screen printing process, directly onto a first green ceramic film. The first green ceramic film with the printed structures is arranged in a stack with further green ceramic films, laminated, and fired. During lamination of the ceramic films, the printed structures are pressed into the ceramic films so that after firing, a multilayer substrate with integrated capacitors results.
摘要翻译：作为集成电容器的复杂电子电路的电路支撑体的陶瓷多层基板通过使用丝网印刷工艺将电容器结构印刷在第一个绿色陶瓷膜上而制造。具有印刷结构的第一个绿色陶瓷膜以更多的绿色陶瓷膜堆叠堆叠并层压并烧制。在层压陶瓷膜期间，印刷结构被压入陶瓷膜中，使得在烧制之后，形成具有集成电容器的多层基板。

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