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    • 2. 发明授权
    • Nonvolatile semiconductor memory device
    • 非易失性半导体存储器件
    • US07501678B2
    • 2009-03-10
    • US11550636
    • 2006-10-18
    • Fumitaka AraiMasayuki Ichige
    • Fumitaka AraiMasayuki Ichige
    • H01L29/788H01L29/76
    • H01L27/115G11C16/0408G11C16/26H01L27/11519
    • A nonvolatile semiconductor memory device includes a semiconductor substrate. Active regions are formed on the surface of the substrate, separated from one another by element separating regions and extend in a first direction. A first word line and a second word line extend in a second direction crossing the first direction. A pair of first select gate lines extend in the second direction between the first and second word lines. Memory cell transistors are each provided at each of intersections of the first and second word lines and the active regions on the surface of the substrate. First select gate transistors are each provided at each of intersections of the pair of first select gate lines and the active regions on the surface of the substrate. A first contact is provided between the pair of first select gate lines and contacts adjacent two of the active regions.
    • 非易失性半导体存储器件包括半导体衬底。 活性区域形成在基板的表面上,通过元件分离区域彼此分开并沿第一方向延伸。 第一字线和第二字线在与第一方向交叉的第二方向上延伸。 一对第一选择栅极线在第一和第二字线之间沿第二方向延伸。 存储单元晶体管分别设置在基板的表面上的第一和第二字线以及有源区的交点处。 第一选择栅极晶体管分别设置在该对第一选择栅极线和基板表面上的有源区的交点处。 在一对第一选择栅极线和邻近两个有源区之间的触点之间提供第一触点。
    • 5. 发明申请
    • NONVOLATILE SEMICONDUCTOR MEMORY AND FABRICATION METHOD FOR THE SAME
    • 非易失性半导体存储器及其制造方法
    • US20100173471A1
    • 2010-07-08
    • US12720062
    • 2010-03-09
    • Kikuko SugimaeMasayuki IchigeFumitaka AraiYasuhiko MatsunagaAtsuhiro Sato
    • Kikuko SugimaeMasayuki IchigeFumitaka AraiYasuhiko MatsunagaAtsuhiro Sato
    • H01L21/336H01L21/762
    • H01L27/115G11C16/0416G11C16/0433G11C16/0483G11C16/30H01L27/11521H01L27/11524
    • A nonvolatile semiconductor memory includes a memory cell transistor including a first floating gate electrode layer formed on a first tunneling insulating film, a first inter-gate insulating film, a first and a second control gate electrode layer, and a first metallic silicide film; a high voltage transistor including a high voltage gate electrode layer formed on the high voltage gate insulating film, a second inter-gate insulating film having an aperture, a third and a fourth control gate electrode layer, and a second metallic silicide film; a low voltage transistor including a second floating gate electrode layer formed on the second tunneling insulating film, a third inter-gate insulating film having an aperture, a fifth and a sixth control gate electrode layer, and a third metallic silicide film; and a liner insulating film directly disposed on a first source and drain region of the memory cell transistor, a second source and drain region of the low voltage transistor, and a third source and drain region of the high voltage transistor.
    • 非易失性半导体存储器包括:存储单元晶体管,包括形成在第一隧道绝缘膜上的第一浮栅电极层,第一栅间绝缘膜,第一和第二控制栅极电极层和第一金属硅化物膜; 包括形成在高压栅极绝缘膜上的高电压栅极电极层,具有孔径的第二栅极间绝缘膜,第三和第四控制栅极电极层和第二金属硅化物膜的高压晶体管; 包括形成在第二隧道绝缘膜上的第二浮栅电极层,具有孔的第三栅间绝缘膜,第五和第六控制栅极电极层和第三金属硅化物膜的低压晶体管; 以及直接设置在存储单元晶体管的第一源极和漏极区域,低压晶体管的第二源极和漏极区域以及高压晶体管的第三源极和漏极区域中的衬垫绝缘膜。
    • 8. 发明申请
    • METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    • 制造半导体器件的方法
    • US20070196986A1
    • 2007-08-23
    • US11676814
    • 2007-02-20
    • Masayuki IchigeMakoto SakumaFumitaka Arai
    • Masayuki IchigeMakoto SakumaFumitaka Arai
    • H01L21/336
    • H01L27/105H01L27/11526H01L27/11529H01L29/0638
    • A method for manufacturing a semiconductor device including a substrate, a memory cell region including first pattern, first guard ring around the memory cell, second guard ring around the first guard ring, an isolation region between the first and second guard ring, and a peripheral circuit region around the second guard ring and including second pattern, the method including exposing the resist film by multiple exposure including first and second exposures for forming latent images corresponding to the first and second patterns, a boundary area of the multiple exposure being set on the isolation region, on the first or second guard ring, or on an area between the first guard ring and the memory cell region, forming a resist pattern by developing the resist film, and etching the substrate with the resist pattern as a mask.
    • 一种半导体器件的制造方法,包括:衬底,包括第一图案的存储单元区域,存储单元周围的第一保护环,第一保护环周围的第二保护环,第一和第二保护环之间的隔离区域, 电路区域,并且包括第二图案,所述方法包括通过多次曝光曝光所述抗蚀剂膜,所述多次曝光包括用于形成对应于所述第一和第二图案的潜像的第一和第二曝光,所述多次曝光的边界区域设置在 在第一或第二保护环上或第一保护环和存储单元区域之间的区域上,通过显影抗蚀剂膜形成抗蚀剂图案,并用抗蚀剂图案作为掩模蚀刻基板。
    • 9. 发明申请
    • NONVOLATILE SEMICONDUCTOR MEMORY DEVICE
    • 非易失性半导体存储器件
    • US20070120166A1
    • 2007-05-31
    • US11550636
    • 2006-10-18
    • Fumitaka AraiMasayuki Ichige
    • Fumitaka AraiMasayuki Ichige
    • H01L29/94
    • H01L27/115G11C16/0408G11C16/26H01L27/11519
    • A nonvolatile semiconductor memory device includes a semiconductor substrate. Active regions are formed on the surface of the substrate, separated from one another by element separating regions and extend in a first direction. A first word line and a second word line extend in a second direction crossing the first direction. A pair of first select gate lines extend in the second direction between the first and second word lines. Memory cell transistors are each provided at each of intersections of the first and second word lines and the active regions on the surface of the substrate. First select gate transistors are each provided at each of intersections of the pair of first select gate lines and the active regions on the surface of the substrate. A first contact is provided between the pair of first select gate lines and contacts adjacent two of the active regions.
    • 非易失性半导体存储器件包括半导体衬底。 活性区域形成在基板的表面上,通过元件分离区域彼此分开并沿第一方向延伸。 第一字线和第二字线在与第一方向交叉的第二方向上延伸。 一对第一选择栅极线在第一和第二字线之间沿第二方向延伸。 存储单元晶体管分别设置在基板的表面上的第一和第二字线以及有源区的交点处。 第一选择栅极晶体管分别设置在该对第一选择栅极线和基板表面上的有源区的交点处。 在一对第一选择栅极线和邻近两个有源区之间的触点之间提供第一触点。
    • 10. 发明申请
    • NONVOLATILE SEMICONDUCTOR MEMORY AND FABRICATION METHOD FOR THE SAME
    • 非易失性半导体存储器及其制造方法
    • US20070109848A1
    • 2007-05-17
    • US11553661
    • 2006-10-27
    • Kikuko SugimaeMasayuki IchigeFumitaka AraiYasuhiko MatsunagaAtsuhiro Sato
    • Kikuko SugimaeMasayuki IchigeFumitaka AraiYasuhiko MatsunagaAtsuhiro Sato
    • G11C16/04
    • H01L27/115G11C16/0416G11C16/0433G11C16/0483G11C16/30H01L27/11521H01L27/11524
    • A nonvolatile semiconductor memory includes a memory cell transistor including a first floating gate electrode layer formed on a first tunneling insulating film, a first inter-gate insulating film, a first and a second control gate electrode layer, and a first metallic silicide film; a high voltage transistor including a high voltage gate electrode layer formed on the high voltage gate insulating film, a second inter-gate insulating film having an aperture, a third and a fourth control gate electrode layer, and a second metallic silicide film; a low voltage transistor including a second floating gate electrode layer formed on the second tunneling insulating film, a third inter-gate insulating film having an aperture, a fifth and a sixth control gate electrode layer, and a third metallic silicide film; and a liner insulating film directly disposed on a first source and drain region of the memory cell transistor, a second source and drain region of the low voltage transistor, and a third source and drain region of the high voltage transistor.
    • 非易失性半导体存储器包括:存储单元晶体管,包括形成在第一隧道绝缘膜上的第一浮栅电极层,第一栅间绝缘膜,第一和第二控制栅极电极层和第一金属硅化物膜; 包括形成在高压栅极绝缘膜上的高电压栅极电极层,具有孔径的第二栅极间绝缘膜,第三和第四控制栅极电极层和第二金属硅化物膜的高压晶体管; 包括形成在第二隧道绝缘膜上的第二浮栅电极层,具有孔的第三栅间绝缘膜,第五和第六控制栅极电极层和第三金属硅化物膜的低压晶体管; 以及直接设置在存储单元晶体管的第一源极和漏极区域,低压晶体管的第二源极和漏极区域以及高压晶体管的第三源极和漏极区域中的衬垫绝缘膜。