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    • 1. 发明授权
    • Method for manufacturing semiconductor device
    • 制造半导体器件的方法
    • US07528046B2
    • 2009-05-05
    • US11676814
    • 2007-02-20
    • Masayuki IchigeMakoto SakumaFumitaka Arai
    • Masayuki IchigeMakoto SakumaFumitaka Arai
    • H01L21/336H01L21/76H01L21/3205
    • H01L27/105H01L27/11526H01L27/11529H01L29/0638
    • A method for manufacturing a semiconductor device including a substrate, a memory cell region including first pattern, first guard ring around the memory cell, second guard ring around the first guard ring, an isolation region between the first and second guard ring, and a peripheral circuit region around the second guard ring and including second pattern, the method including exposing the resist film by multiple exposure including first and second exposures for forming latent images corresponding to the first and second patterns, a boundary area of the multiple exposure being set on the isolation region, on the first or second guard ring, or on an area between the first guard ring and the memory cell region, forming a resist pattern by developing the resist film, and etching the substrate with the resist pattern as a mask.
    • 一种半导体器件的制造方法,包括:衬底,包括第一图案的存储单元区域,存储单元周围的第一保护环,第一保护环周围的第二保护环,第一和第二保护环之间的隔离区域, 电路区域,并且包括第二图案,所述方法包括通过多次曝光曝光所述抗蚀剂膜,所述多次曝光包括用于形成对应于所述第一和第二图案的潜像的第一和第二曝光,所述多次曝光的边界区域设置在 在第一或第二保护环上或第一保护环和存储单元区域之间的区域上,通过显影抗蚀剂膜形成抗蚀剂图案,并用抗蚀剂图案作为掩模蚀刻基板。
    • 2. 发明申请
    • SEMICONDUCTOR DEVICE WITH DOUBLE BARRIER FILM
    • 具有双屏障膜的半导体器件
    • US20080251881A1
    • 2008-10-16
    • US12143597
    • 2008-06-20
    • Makoto SakumaYasuhiko MatsunagaFumitaka AraiKikuko Sugimae
    • Makoto SakumaYasuhiko MatsunagaFumitaka AraiKikuko Sugimae
    • H01L29/00
    • H01L27/115H01L27/105H01L27/11526H01L27/11529
    • A semiconductor device comprising a first insulation layer, a second insulation layer, a first barrier film, a second barrier film, a diffusion layer. The device further comprises an upper contact hole, a lower contact hole, and a contact plug. The upper contact hole penetrates the second insulation layer and has a bottom in the second barrier film. The bottom has a width greater than a trench made in the first insulation layer, as measured in a direction crossing the widthwise direction of the trench. The lower contact hole penetrates the first insulation layer and first barrier film, communicates with the first contact hole via the trench and is provided on the diffusion layer. The upper portion of the lower contact hole has the same width as the trench. The contact plug is provided in the upper contact hole and lower contact hole.
    • 一种半导体器件,包括第一绝缘层,第二绝缘层,第一阻挡膜,第二阻挡膜,扩散层。 该装置还包括上接触孔,下接触孔和接触塞。 上接触孔穿透第二绝缘层,并且在第二阻挡膜中具有底部。 底部的宽度大于在与沟槽宽度方向交叉的方向上测量的在第一绝缘层中形成的沟槽。 下接触孔穿过第一绝缘层和第一阻挡膜,经由沟槽与第一接触孔连通并设置在扩散层上。 下接触孔的上部具有与沟槽相同的宽度。 接触塞设置在上接触孔和下接触孔中。
    • 9. 发明申请
    • Nonvolatile semiconductor memory device having adjacent selection transistors connected together
    • 具有连接在一起的相邻选择晶体管的非易失性半导体存储器件
    • US20060186464A1
    • 2006-08-24
    • US11407242
    • 2006-04-20
    • Makoto SakumaFumitaka Arai
    • Makoto SakumaFumitaka Arai
    • H01L29/788
    • H01L27/11521H01L27/115H01L27/11524H01L29/42324
    • A semiconductor memory device comprising a semi-conductor substrate, a plurality of cell transistors provided on the substrate, a plurality of selection gates provided on the substrate, and element-isolation regions provided between the cell transistors and between the selection gates. Each cell transistor has a floating gate provided on a gate insulating film provided on the substrate, a source and drain provided in the substrate and aligned with the sides of the floating gate, an inter-gate insulating film provided on one side of the floating gate, and a control gate provided on the inter-gate insulating film and laying over the one side of the floating gate. The selection gates are connected by conductive members which are provided on the gate insulating film and embedded in the selection gates.
    • 一种半导体存储器件,包括半导体衬底,设置在衬底上的多个单元晶体管,设置在衬底上的多个选择栅极以及设置在单元晶体管之间和选择栅极之间的元件隔离区域。 每个单元晶体管具有设置在设置在基板上的栅极绝缘膜上的浮置栅极,设置在基板中并与浮置栅极的侧对准的源极和漏极,设置在浮置栅极的一侧的栅极间绝缘膜 以及设置在栅极间绝缘膜上并铺设在浮动栅极的一侧上的控制栅极。 选择栅极由设置在栅极绝缘膜上并嵌入选择栅极的导电构件连接。