专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US4736841A Electronic component series 失效
标题翻译：电子元件系列
公开(公告)号：US4736841A
公开(公告)日：1988-04-12
申请号：US828021
申请日：1986-02-10
申请人： Fumihiko Kaneko , Takashi Kawamura , Kimiharu Anao , Keiichi Shimamaki
发明人： Fumihiko Kaneko , Takashi Kawamura , Kimiharu Anao , Keiichi Shimamaki
IPC分类号： B65D75/32 , B65D75/34 , H05K13/00 , B65D73/02
CPC分类号： B65D75/327 , H05K13/0084
摘要： In an electronic component series of the type wherein a plurality of electronic components are distributed in the longitudinal direction of a tape-like receiving member to be retained by the same, a cover tape is heat-sealed to a receiving tape having receiving concavities for receiving the respective electronic components. Stepped portions or protrusions are forned in the receiving tape to define regions not in contact with the cover tape. This restricts the extent of the sealed regions wherein the cover tape is heat-sealed to the receiving tape, such that the sealed regions are substantially constant in width which results in a substantially constant force being required for removing the cover tape from the receiving tape.
摘要翻译：在其中多个电子部件沿着待保持的带状接收部件的纵向方向分布的类型的电子部件系列中，盖带被热封到具有接收凹部的接收带相应的电子元件。步进部分或突起被插入接收带中以限定不与盖带接触的区域。这限制了将盖带热密封到接收带的密封区域的程度，使得密封区域的宽度基本上恒定，这导致从接收带去除盖带所需的基本上恒定的力。

2. 发明授权

US4870225A Mounting arrangement of chip type component onto printed circuit board 失效
标题翻译：将芯片型元件安装在印刷电路板上
公开(公告)号：US4870225A
公开(公告)日：1989-09-26
申请号：US331004
申请日：1989-03-27
申请人： Kimiharu Anao , Yoshitsugu Hori , Keiichi Shimamaki , Tadashi Sato
发明人： Kimiharu Anao , Yoshitsugu Hori , Keiichi Shimamaki , Tadashi Sato
IPC分类号： H05K1/11 , H05K3/34
CPC分类号： H05K1/111 , H05K3/3442 , H05K2201/09427 , H05K2201/10636 , Y02P70/611 , Y02P70/613
摘要： A mounting arrangement of a chip type component onto a printed circuit board, which includes a chip type component having terminal electrodes at its opposite end portions, and land portions provided on a printed circuit board so as to fix the chip type component on them by soldering through cream type solder applied onto the land portions. The land portions are each formed to have such a length as will not project externally in a longitudinal direction of the chip type component.
摘要翻译：芯片型部件在印刷电路板上的安装结构，其包括在其相对端部具有端子电极的芯片型部件和设置在印刷电路板上的焊盘部分，以便通过焊接将芯片型部件固定在其上通过奶油型焊料施加到陆部上。接地部分各自形成为具有不会在芯片型部件的纵向外侧突出的长度。

3. 发明授权

US4633370A Chip-like electronic component series 失效
标题翻译：片状电子元件系列
公开(公告)号：US4633370A
公开(公告)日：1986-12-30
申请号：US707581
申请日：1985-03-04
申请人： Mitsuro Hamuro , Kimiharu Anao , Keiichi Shimamaki
发明人： Mitsuro Hamuro , Kimiharu Anao , Keiichi Shimamaki
IPC分类号： B65D73/02 , B65D75/34 , H05K13/00 , B65D75/24
CPC分类号： H05K13/0038 , B65D75/327
摘要： A chip-like electronic component series retains a plurality of chip-like electronic components (2) distributed along a longitudinal direction of a tape (1). The tape (1) is formed with a plurality of cavities (5) distributed in its longitudinal direction, so that the chip-like electronic components are received in respective ones of the cavities. In order to retain the chip-like electronic components in the cavities, the cavities are covered by a cover sheet (3). Each of the cavities comprises a relatively flat receiving portion (7) having a bottom surface (6) extending along the longitudinal direction of the tape and a projecting receiving portion (8) projecting from a part of the bottom surface of the flat receiving portion. With such configuration, the cavities can retain at least two types of chip-like electronic components of different geometry or retain the chip-like electronic components at least in two types of conditions.
摘要翻译：片状电子部件系列保持沿着带（1）的长度方向分布的多个片状电子部件（2）。带（1）形成有沿其纵向方向分布的多个空腔（5），使得芯片状电子部件容纳在相应的空腔中。为了将芯片状电子部件保持在空腔中，空腔被覆盖片（3）覆盖。每个空腔包括具有沿着带的纵向方向延伸的底表面（6）的相对平坦的接收部分（7）和从平坦容纳部分的底表面的一部分突出的突出接收部分（8）。通过这种构造，空腔可以保持至少两种不同几何形状的类似芯片的电子部件，或者至少在两种类型的条件下保持芯片状电子部件。

4. 发明授权

US5508562A Outer electrode structure for a chip type electronic part appropriate for reflow soldering 失效
标题翻译：适用于回流焊接的芯片型电子部件的外电极结构
公开(公告)号：US5508562A
公开(公告)日：1996-04-16
申请号：US352446
申请日：1994-12-09
申请人： Shigeyuki Horie , Kimiharu Anao
发明人： Shigeyuki Horie , Kimiharu Anao
IPC分类号： H01G4/008 , H01C1/142 , H01G4/12 , H01G4/228 , H01G4/252 , H05K1/18 , H05K3/28 , H05K3/34 , H01L23/48 , H01L23/52
CPC分类号： H01C1/142 , H01G4/228 , H05K3/3442 , H05K2201/10636 , H05K2201/10909 , H05K2201/10992 , H05K3/284 , H05K3/3431 , H05K3/3457 , H05K3/3463 , Y02P70/611 , Y02P70/613
摘要： A chip type electronic part has an outer electrode structure appropriate mainly for reflow soldering.An outermost layer of the outer electrode, provided at both end portions of the chip type electronic part, is to be soldered and made of a metal having a solidus temperature lower than 183.degree. C. and a difference not smaller than 10.degree. C., or more preferably not smaller than 30.degree. C., between its liquidus temperature and its solidus temperature, and is formed of a plating coat. The above-mentioned arrangement allows reflow soldering for the mounting of the chip type electronic part onto a substrate to be achieved at a low temperature while preventing the harmful influences of high-temperature soldering, and prevents the tombstone phenomenon in the soldering process.
摘要翻译：片式电子部件具有主要用于回流焊接的外部电极结构。在芯片型电子部件的两端部设置的外部电极的最外层，由固相线温度低于183℃，不低于10℃的金属进行焊接，或更优选不低于30℃，在其液相线温度与其固相线温度之间，并由镀层形成。上述布置允许回流焊接用于将芯片型电子部件安装在要在低温下实现的基板上，同时防止高温焊接的有害影响，并且防止焊接过程中的墓碑现象。

5. 发明授权

US06855222B2 Method for manufacturing laminated multilayer electronic components 有权
标题翻译：层叠多层电子部件的制造方法
公开(公告)号：US06855222B2
公开(公告)日：2005-02-15
申请号：US10448048
申请日：2003-05-30
申请人： Masaharu Konoue , Kimiharu Anao
发明人： Masaharu Konoue , Kimiharu Anao
IPC分类号： H01G4/232 , C04B35/26 , H01B1/22 , H01F17/00 , H01F41/04 , H01G4/008 , H01G4/012 , H01G4/30 , H05K1/09 , B32B31/26 , H01F1/34 , H05K3/46
CPC分类号： H01G4/008 , B32B18/00 , B32B2309/022 , B32B2311/08 , C04B35/265 , C04B35/6264 , C04B35/62655 , C04B2235/3279 , C04B2235/3281 , C04B2235/3284 , C04B2235/96 , C04B2237/34 , C04B2237/408 , C04B2237/704 , H01B1/22 , H01F17/0013 , H01F41/046 , H01F2017/048 , H01G4/012 , H01G4/30 , H05K1/092
摘要： A method for producing a laminated electronic component produces a laminated electronic component having a superior surge-proofing property, a sufficient resistance to a flux, and excellent electrical properties, without experience the occurrence of structural effects such as cracking, delamination, or other structural defects. Conductive paste is prepared to contain conductive particles and resin particles having a thermal decomposition-ability. The resin particles have an average particle size of about 0.25 to about 1.50 times the average particle size of the conductive particles. The volume ratio of the resin particles is in the range of about 0.5 to about 1.0 the volume of the conductive particles. The conductive paste is applied to the surface of a ceramic layer to form a conductor layer. The ceramic layers and the conductor layers are alternately laminated. The laminate is fired to form a ceramic sintered laminate. Thus, a laminated electronic component is produced.
摘要翻译：层压电子部件的制造方法制造具有优异的防浪涌性，足够的耐焊接性和优异的电性能的层压电子部件，而不会发生结构效应如开裂，分层或其他结构缺陷。制备导电浆料以含有具有热分解能力的导电颗粒和树脂颗粒。树脂颗粒的平均粒径为导电颗粒的平均粒径的约0.25至约1.50倍。树脂颗粒的体积比在导电颗粒体积的约0.5至约1.0的范围内。将导电膏施加到陶瓷层的表面以形成导体层。陶瓷层和导体层交替层叠。将层压体烧成以形成陶瓷烧结层压体。因此，制造层叠电子部件。

6. 发明授权

US06733696B2 Conductive paste 有权
标题翻译：导电胶
公开(公告)号：US06733696B2
公开(公告)日：2004-05-11
申请号：US10453585
申请日：2003-06-04
申请人： Kimiharu Anao
发明人： Kimiharu Anao
IPC分类号： H01B122
CPC分类号： H01G4/0085 , H01B1/22 , H01F2017/002
摘要： A conductive paste contains a metal powder as the conductive component, and an organic vehicle. The metal powder is mainly composed of silver, and has an average particle diameter of about 1.5 to 3.5 &mgr;m. The cumulative volume percent of particles of the metal powder which are within the average particle diameter ±0.5 &mgr;m in a particle-size distribution is about 40% or less. The average particle diameter and the cumulative volume percent are measured with a laser diffraction/scattering analyzer. The conductive paste can be used to form inner electrodes of a composite inductor.
摘要翻译：导电性糊剂含有作为导电成分的金属粉末和有机载体。金属粉末主要由银构成，平均粒径为1.5〜3.5μm左右。在粒度分布中，平均粒径±0.5μm的金属粉末的颗粒的累积体积百分比为约40％以下。平均粒径和累积体积百分比用激光衍射/散射分析仪测量。导电膏可用于形成复合电感器的内部电极。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式