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1. 发明授权

US5796616A Apparatus for automatically replenishing chips 失效
标题翻译：用于自动补充芯片的装置
公开(公告)号：US5796616A
公开(公告)日：1998-08-18
申请号：US590126
申请日：1996-01-23
申请人： Mitsuro Hamuro , Keiichi Shimamaki
发明人： Mitsuro Hamuro , Keiichi Shimamaki
IPC分类号： B65G65/40 , B65G47/14 , H05K13/02 , G06F19/00
CPC分类号： H05K13/028 , H05K13/021 , Y10T29/53178
摘要： An alignment/feed mechanism includes a container for receiving a plurality of chips, and an outlet port through which the chips are fed one by one in an aligned fashion. A sensor is operable to detect whether the number of the chips within the container is reduced below a predetermined level. If below the level, additional chips are fed from a chip tank into the container through a replenishment line or pipe. The chip tank is located above the alignment/feed mechanism. An on-off valve is disposed in the replenishment line and operable to open the replenishment line in response the sensed result of the sensor and close the replenishment line when a required number of additional chips are fed to the container.
摘要翻译：一个对准/进给机构包括用于容纳多个芯片的容器和一个排出端口，芯片以对齐的方式一个接一个地供给到该出口端口。传感器可操作以检测容器内的碎屑数目是否减少到预定水平以下。如果低于该水平，则通过补充管线或管道将附加的切屑从芯片槽送入容器。芯片槽位于对准/进给机构上方。开关阀设置在补充线路中，并且当所需数量的附加切屑被供给到容器时，可响应于感测器的感测结果打开补充线并关闭补充线。

2. 发明授权

US5653344A Electronic parts storage cassette 失效
标题翻译：电子零件存放盒
公开(公告)号：US5653344A
公开(公告)日：1997-08-05
申请号：US551652
申请日：1995-11-01
申请人： Hirokazu Higuchi , Keiichi Shimamaki
发明人： Hirokazu Higuchi , Keiichi Shimamaki
IPC分类号： B65D85/00 , B65D85/86 , H05K13/02 , B65D73/02 , B65D43/04
CPC分类号： H05K13/021
摘要： An electronic parts storage cassette for supplying a plurality of electronic parts to a mounting machine includes a plurality of electronic parts contained in a case body member for storing the electronic parts and an adaptor member to be attached to the mounting machine. The case body member may be formed of a disposable sheet material such as paper.
摘要翻译：一种用于向安装机提供多个电子部件的电子部件存储盒包括容纳在用于存储电子部件的盒体部件中的多个电子部件和要附接到安装机器的适配器部件。外壳本体构件可以由诸如纸的一次性片材形成。

3. 发明授权

US4736841A Electronic component series 失效
标题翻译：电子元件系列
公开(公告)号：US4736841A
公开(公告)日：1988-04-12
申请号：US828021
申请日：1986-02-10
申请人： Fumihiko Kaneko , Takashi Kawamura , Kimiharu Anao , Keiichi Shimamaki
发明人： Fumihiko Kaneko , Takashi Kawamura , Kimiharu Anao , Keiichi Shimamaki
IPC分类号： B65D75/32 , B65D75/34 , H05K13/00 , B65D73/02
CPC分类号： B65D75/327 , H05K13/0084
摘要： In an electronic component series of the type wherein a plurality of electronic components are distributed in the longitudinal direction of a tape-like receiving member to be retained by the same, a cover tape is heat-sealed to a receiving tape having receiving concavities for receiving the respective electronic components. Stepped portions or protrusions are forned in the receiving tape to define regions not in contact with the cover tape. This restricts the extent of the sealed regions wherein the cover tape is heat-sealed to the receiving tape, such that the sealed regions are substantially constant in width which results in a substantially constant force being required for removing the cover tape from the receiving tape.
摘要翻译：在其中多个电子部件沿着待保持的带状接收部件的纵向方向分布的类型的电子部件系列中，盖带被热封到具有接收凹部的接收带相应的电子元件。步进部分或突起被插入接收带中以限定不与盖带接触的区域。这限制了将盖带热密封到接收带的密封区域的程度，使得密封区域的宽度基本上恒定，这导致从接收带去除盖带所需的基本上恒定的力。

4. 发明授权

US4633370A Chip-like electronic component series 失效
标题翻译：片状电子元件系列
公开(公告)号：US4633370A
公开(公告)日：1986-12-30
申请号：US707581
申请日：1985-03-04
申请人： Mitsuro Hamuro , Kimiharu Anao , Keiichi Shimamaki
发明人： Mitsuro Hamuro , Kimiharu Anao , Keiichi Shimamaki
IPC分类号： B65D73/02 , B65D75/34 , H05K13/00 , B65D75/24
CPC分类号： H05K13/0038 , B65D75/327
摘要： A chip-like electronic component series retains a plurality of chip-like electronic components (2) distributed along a longitudinal direction of a tape (1). The tape (1) is formed with a plurality of cavities (5) distributed in its longitudinal direction, so that the chip-like electronic components are received in respective ones of the cavities. In order to retain the chip-like electronic components in the cavities, the cavities are covered by a cover sheet (3). Each of the cavities comprises a relatively flat receiving portion (7) having a bottom surface (6) extending along the longitudinal direction of the tape and a projecting receiving portion (8) projecting from a part of the bottom surface of the flat receiving portion. With such configuration, the cavities can retain at least two types of chip-like electronic components of different geometry or retain the chip-like electronic components at least in two types of conditions.
摘要翻译：片状电子部件系列保持沿着带（1）的长度方向分布的多个片状电子部件（2）。带（1）形成有沿其纵向方向分布的多个空腔（5），使得芯片状电子部件容纳在相应的空腔中。为了将芯片状电子部件保持在空腔中，空腔被覆盖片（3）覆盖。每个空腔包括具有沿着带的纵向方向延伸的底表面（6）的相对平坦的接收部分（7）和从平坦容纳部分的底表面的一部分突出的突出接收部分（8）。通过这种构造，空腔可以保持至少两种不同几何形状的类似芯片的电子部件，或者至少在两种类型的条件下保持芯片状电子部件。

5. 发明授权

US5806715A Chip alignment/feed apparatus 失效
标题翻译：芯片对准/进给装置
公开(公告)号：US5806715A
公开(公告)日：1998-09-15
申请号：US589948
申请日：1996-01-23
申请人： Mitsuro Hamuro , Keiichi Shimamaki , Kenji Ijichi
发明人： Mitsuro Hamuro , Keiichi Shimamaki , Kenji Ijichi
IPC分类号： B23P19/00 , B65G47/14 , B65G65/40 , H05K13/02 , H05K13/04 , B23Q7/00
CPC分类号： H05K13/028 , H05K13/0434
摘要： A bulk cassette has a container chamber at its rear end, and an outlet port at its front end. A plurality of chips within the container chamber are discharged from the outlet port one by one in an aligned fashion. A chip case is detachably connected to the rear end of the bulk cassette and includes an internal container space within which a plurality of chips can be contained. The chip case has a supply opening at its front end so as to feed the chips from the container space to the container chamber of the bulk cassette. The chip case also has a receiving opening at its rear end so as to feed additional chips into the container space. A closure member is mounted to the rear end of the chip case to open and close the receiving opening. A pipe is inserted into the receiving opening for replenishment of chips.
摘要翻译：大容量盒在其后端具有容器室，在其前端具有出口。容器室内的多个碎屑以排列的方式逐个排出出口。芯片壳体可拆卸地连接到散装盒的后端，并且包括容纳多个芯片的内部容器空间。芯片壳体在其前端具有供给开口，以将芯片从容器空间供给到大容量盒的容器室。芯片壳体在其后端还具有接收开口，以便将额外的芯片馈送到容器空间中。封闭构件安装到芯片壳体的后端以打开和关闭接收开口。管道插入接收口用于补充芯片。

6. 发明授权

US4870225A Mounting arrangement of chip type component onto printed circuit board 失效
标题翻译：将芯片型元件安装在印刷电路板上
公开(公告)号：US4870225A
公开(公告)日：1989-09-26
申请号：US331004
申请日：1989-03-27
申请人： Kimiharu Anao , Yoshitsugu Hori , Keiichi Shimamaki , Tadashi Sato
发明人： Kimiharu Anao , Yoshitsugu Hori , Keiichi Shimamaki , Tadashi Sato
IPC分类号： H05K1/11 , H05K3/34
CPC分类号： H05K1/111 , H05K3/3442 , H05K2201/09427 , H05K2201/10636 , Y02P70/611 , Y02P70/613
摘要： A mounting arrangement of a chip type component onto a printed circuit board, which includes a chip type component having terminal electrodes at its opposite end portions, and land portions provided on a printed circuit board so as to fix the chip type component on them by soldering through cream type solder applied onto the land portions. The land portions are each formed to have such a length as will not project externally in a longitudinal direction of the chip type component.
摘要翻译：芯片型部件在印刷电路板上的安装结构，其包括在其相对端部具有端子电极的芯片型部件和设置在印刷电路板上的焊盘部分，以便通过焊接将芯片型部件固定在其上通过奶油型焊料施加到陆部上。接地部分各自形成为具有不会在芯片型部件的纵向外侧突出的长度。

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