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1. 发明授权

US5316620A Method and an apparatus for polishing wafer chamfers 失效
标题翻译：抛光晶圆倒角的方法和装置
公开(公告)号：US5316620A
公开(公告)日：1994-05-31
申请号：US7888
申请日：1993-01-22
申请人： Fumihiko Hasegawa , Tatsuo Ohtani , Hiroshi Kawano , Masayuki Yamada
发明人： Fumihiko Hasegawa , Tatsuo Ohtani , Hiroshi Kawano , Masayuki Yamada
IPC分类号： B24B9/00 , B24B9/06 , H01L21/304 , H01L21/306 , B44C1/22 , H01L21/463
CPC分类号： H01L21/02021 , B24B9/065 , Y10S438/959
摘要： A method for polishing peripheral chamfers of a semiconductor wafer comprising steps of: (a) turning a cylindrical cup-like rotatory buff having an internal polish groove formed in the inner wall surface thereof, the groove having a profile complementary to the profile of the chamfered wafer edge to be polished; (b) disposing the wafer inside the turning buff; (c) turning the wafer at a relatively low rate; and (d) pressing the wafer edge into the running internal polish groove with an appropriate pressure; furthermore there is proposed an apparatus for this novel method including the cylindrical cup-like rotatory buff as described above.
摘要翻译：一种用于抛光半导体晶片的周边倒角的方法，包括以下步骤：（a）转动在其内壁表面中形成有内部抛光槽的圆柱形杯状旋转抛光器，所述凹槽具有与倒角的轮廓互补的轮廓晶圆边缘要抛光; （b）将晶片放置在转动抛光器内; （c）以相对较低的速率转动晶片; 和（d）以适当的压力将晶片边缘压入行进的内部抛光槽; 此外，提出了一种用于这种新方法的装置，其包括如上所述的圆柱形杯状旋转抛光器。

2. 发明授权

US5317836A Apparatus for polishing chamfers of a wafer 失效
标题翻译：用于抛光晶片倒角的装置
公开(公告)号：US5317836A
公开(公告)日：1994-06-07
申请号：US980358
申请日：1992-11-23
申请人： Fumihiko Hasegawa , Masayuki Yamada , Hiroshi Kawano , Tatsuo Ohtani
发明人： Fumihiko Hasegawa , Masayuki Yamada , Hiroshi Kawano , Tatsuo Ohtani
IPC分类号： B24B9/00 , B23Q1/36 , B24B9/06 , H01L21/304
CPC分类号： H01L21/02021 , B23Q1/36 , B24B9/065
摘要： An apparatus for polishing edge chamfers of a semiconductor wafer to mirror gloss, having a rotatory cylindrical buff formed with annular groove(s) in its side and a wafer vacuum holder capable of holding and turning the wafer circumferentially, wherein the cylindrical buff is adapted to shift axially, and the annular groove has a width substantially greater than the thickness of the wafer, and a drive mechanism for axially biasing the cylindrical buff is provided.
摘要翻译：一种用于将半导体晶片的边缘倒角抛光成镜面光泽的装置，具有在其侧面形成有环形槽的旋转圆柱形抛光器和能够周向保持和转动晶片的晶片真空保持器，其中圆柱形抛光器适于并且环形槽具有基本上大于晶片厚度的宽度，并且提供用于轴向偏压圆柱形抛光器的驱动机构。

3. 发明授权

US08585421B2 Connector 有权
标题翻译：连接器
公开(公告)号：US08585421B2
公开(公告)日：2013-11-19
申请号：US13258271
申请日：2010-03-05
申请人： Yasuhiro Yamaguchi , Nobuaki Yoshioka , Sakai Yagi , Sachiko Yagome , Hiroshi Kawano , Yuichiro Matsumoto
发明人： Yasuhiro Yamaguchi , Nobuaki Yoshioka , Sakai Yagi , Sachiko Yagome , Hiroshi Kawano , Yuichiro Matsumoto
IPC分类号： H01R13/64
CPC分类号： H01R13/6315 , H01R13/05 , H01R13/514
摘要： A connector 1 includes: a terminal 2; an inner housing 5; and an outer housing 30 receiving the terminal 2 and the inner housing 5. The terminal 2 is provided with a first electric connecting part 21 received and held in the inner housing 5 and electrically connected to the mating connector, a second electric connecting part 22, and a flexible coupling part 23 made of conductive material, movably coupling and electrically connecting the first electric connecting part 21 and the second electric connecting part 22. The outer housing 30 is provided with a receiving part 36 movably receiving the inner housing 5 which receives the first electric connecting part 21, and a fixing part 35 to which the second electric connecting part 22 is fixed.
摘要翻译：连接器1包括：端子2; 内壳5; 以及接收端子2和内壳体5的外壳体30.端子2设置有容纳并保持在内壳体5中并与配合连接器电连接的第一电连接部件21，第二电连接部件22，以及由导电材料制成的柔性联接部件23，可移动地联接并电连接第一电连接部件21和第二电连接部件22.外壳体30设置有可移动地接纳内壳体5的接收部分36，第一电连接部21和固定第二电连接部22的固定部35。

4. 外观设计

USD683285S1 Rear bumper for automobile 有权
公开(公告)号：USD683285S1
公开(公告)日：2013-05-28
申请号：US29414236
申请日：2012-02-27
申请人： Minoru Yoshida , Hiroshi Kawano , Masanobu Ino , Patrick Reimer , Marc Cogswell
设计人： Minoru Yoshida , Hiroshi Kawano , Masanobu Ino , Patrick Reimer , Marc Cogswell

5. 外观设计

USD682753S1 Radiator grill for automobile 有权
公开(公告)号：USD682753S1
公开(公告)日：2013-05-21
申请号：US29414230
申请日：2012-02-27
申请人： Minoru Yoshida , Hiroshi Kawano , Masanobu Ino , Patrick Reimer , Marc Cogswell
设计人： Minoru Yoshida , Hiroshi Kawano , Masanobu Ino , Patrick Reimer , Marc Cogswell

6. 发明申请

US20120017042A1 STORAGE CONTROL APPARATUS AND STORAGE SYSTEM COMPRISING MULTIPLE STORAGE CONTROL APPARATUSES 有权
标题翻译：包含多个存储控制装置的存储控制装置和存储系统
公开(公告)号：US20120017042A1
公开(公告)日：2012-01-19
申请号：US12918608
申请日：2010-07-16
申请人： Yuko Matsui , Hiroshi Kawano , Shigeo Homma , Masayuki Yamamoto
发明人： Yuko Matsui , Hiroshi Kawano , Shigeo Homma , Masayuki Yamamoto
IPC分类号： G06F12/08
CPC分类号： G06F3/0689 , G06F3/0608 , G06F3/061 , G06F3/0619 , G06F3/0635 , G06F3/0647 , G06F3/0658 , G06F3/0665 , G06F3/0685 , G06F12/023 , G06F12/08 , G06F12/0813 , G06F2206/1012
摘要： A storage system has multiple disk controller (DKC) units that are coupled to one another in accordance with a coupling mode that satisfies the following (a1) through (a3): (a1) One DKC inside one DKC unit and one DKC inside another DKC unit are coupled via a second type of coupling medium that differs from the internal bus of the DKC and has a longer maximum communication distance than a first type of coupling medium, which is the same type of coupling medium as the internal bus of the DKC; (a2) the one DKC unit virtualizes a logical volume of the other DKC unit and provides this virtualized logical volume to host(s) coupled to the one DKC unit; and (a3) the other DKC unit virtualizes a logical volume of the DKC unit and provides this virtualized logical volume to host(s) coupled to the other DKC unit.
摘要翻译：存储系统具有根据满足以下（a1）至（a3）的耦合模式彼此耦合的多个盘控制器（DKC）：（a1）一个DKC单元内的一个DKC和另一个DKC内的一个DKC 单元通过与DKC的内部总线不同的第二类型的耦合介质耦合，并且具有比与DKC的内部总线相同类型的耦合介质的第一类耦合介质的更长的最大通信距离; （a2）一个DKC单元虚拟化另一DKC单元的逻辑卷，并将该虚拟化逻辑卷提供给耦合到该DKC单元的主机; 和（a3）另一个DKC单元虚拟化DKC单元的逻辑卷并将该虚拟化逻辑卷提供给耦合到另一个DKC单元的主机。

7. 发明申请

US20090229846A1 Screw Driving Device and Screw 有权
公开(公告)号：US20090229846A1
公开(公告)日：2009-09-17
申请号：US12426982
申请日：2009-04-21
申请人： Hiroshi Kawano , Tatsuya Hirahara
发明人： Hiroshi Kawano , Tatsuya Hirahara
IPC分类号： B25B21/00
CPC分类号： B25B21/00 , B23P19/06 , B23P19/065 , B25B23/0085 , B25B23/12 , F16B23/00 , F16B31/04 , F16B39/26 , F16B43/00
摘要： To provide a screw fastening device that, when performing a screw tightening operation, can substantially reduce the running torque directly applied by external force to a screw driving device.A characteristic constitution is adopted that is equips a screw driving device α2 with a device body 1 that stacks a plurality of piezoelectric elements 3 and 4 that generate predetermined ultrasonic oscillations with the application of a predetermined AC voltage and excites mechanical oscillations in a predetermined direction on an oscillating end surface 1a based on the ultrasonic oscillations; and a male distal end portion 21 that is correspondingly formed to be capable of fitting in a female recess 103 formed in a screw β1 and integrally fixed to the device body 1 on the oscillating end surface 1a of the device body 1 to impart running torque, which is directly applied to the screw driving device α2 by external force, and transmit the mechanical oscillations in the predetermined direction that the device body 1 excites to the screw β1, with which contact is made by fitting in the female recess 103.

8. 发明申请

US20090208308A1 Screw Driving Device and Screw 有权
标题翻译：螺丝驱动装置和螺丝
公开(公告)号：US20090208308A1
公开(公告)日：2009-08-20
申请号：US12430949
申请日：2009-04-28
申请人： Hiroshi Kawano , Tatsuya Hirahara
发明人： Hiroshi Kawano , Tatsuya Hirahara
IPC分类号： F16B39/24
CPC分类号： B25B21/00 , B23P19/06 , B23P19/065 , B25B23/0085 , B25B23/12 , F16B23/00 , F16B31/04 , F16B39/26 , F16B43/00
摘要： To provide a screw fastening device that, when performing a screw tightening operation, can substantially reduce the running torque directly applied by external force to a screw driving device.A characteristic constitution is adopted that is equips a screw driving device α2 with a device body 1 that stacks a plurality of piezoelectric elements 3 and 4 that generate predetermined ultrasonic oscillations with the application of a predetermined AC voltage and excites mechanical oscillations in a predetermined direction on an oscillating end surface 1a based on the ultrasonic oscillations; and a male distal end portion 21 that is correspondingly formed to be capable of fitting in a female recess 103 formed in a screw β1 and integrally fixed to the device body 1 on the oscillating end surface 1a of the device body 1 to impart running torque, which is directly applied to the screw driving device α2 by external force, and transmit the mechanical oscillations in the predetermined direction that the device body 1 excites to the screw β1, with which contact is made by fitting in the female recess 103.
摘要翻译：为了提供螺钉紧固装置，当执行螺钉紧固操作时，可以将通过外力直接施加的行驶扭矩显着地减小到螺丝驱动装置。采用一种特征构造，其装备有螺旋驱动装置α2的装置主体1，其堆叠多个压电元件3和4，其通过施加预定的AC电压产生预定的超声波振荡，并且以预定方向激励机械振荡基于超声波振荡的振荡端面1a; 和相应地形成为能够装配在形成为螺钉β1的阴凹槽103中并且一体地固定到装置主体1的装置主体1的摆动端面1a上以赋予运行转矩的阳极远端部21，其通过外力直接施加到螺钉驱动装置α2，并且以装置主体1激励到预定方向的机械振动传递到螺钉β1，螺钉β1通过装配在凹槽103中而进行接触。

9. 发明申请

US20060173964A1 Communication terminal device and method for controlling same 审中-公开
标题翻译：通信终端装置及其控制方法
公开(公告)号：US20060173964A1
公开(公告)日：2006-08-03
申请号：US11236467
申请日：2005-09-27
申请人： Junichi Oohama , Hiroshi Kawano
发明人： Junichi Oohama , Hiroshi Kawano
IPC分类号： G06F15/16
CPC分类号： H04L51/28 , H04L29/12009 , H04L29/12594 , H04L51/066 , H04L51/12 , H04L61/301 , H04L61/303 , H04L67/04
摘要： A communication terminal device and a method for controlling the same which can operate a mail restriction function effectively without increasing a mail address registered for the mail restriction function are provided. The transmission and the reception of the mail is restricted by storing by a domain conversion table a corresponding relationship between an original domain by the automatic address conversion unit and the domain after the conversion, acquiring by the original domain acquiring unit the original domain based on the domain of the mail address converted by the automatic address conversion unit by referring to the domain conversion table, and controlling by the mail transmission and reception control means the transmission and the reception of the mail by comparing the mail address replaced with the domain of the mail address of the transmitting/receiving mail by the original domain acquired by the original domain acquiring unit with the registered mail address.
摘要翻译：提供了一种通信终端设备及其控制方法，其可以有效地操作邮件限制功能，而不增加为邮件限制功能注册的邮件地址。通过域转换表存储由自动地址转换单元的原始域与转换后的域之间的对应关系来限制邮件的发送和接收，由原始域获取单元基于原始域获取原始域，通过参考域转换表由自动地址转换单元转换的邮件地址的域，并且通过邮件发送和接收控制装置来控制邮件的发送和接收，通过比较邮件地址替换为邮件的域由原始域获取单元获得的原始域的发送/接收邮件的地址与登记的邮件地址。

10. 发明授权

US6002181A Structure of resin molded type semiconductor device with embedded thermal dissipator 失效
标题翻译：具有嵌入式散热器的树脂模制型半导体器件的结构
公开(公告)号：US6002181A
公开(公告)日：1999-12-14
申请号：US551917
申请日：1995-10-23
申请人： Etsuo Yamada , Yasushi Shiraishi , Hiroshi Kawano , Shinji Ohuchi , Hidekazu Nasu
发明人： Etsuo Yamada , Yasushi Shiraishi , Hiroshi Kawano , Shinji Ohuchi , Hidekazu Nasu
IPC分类号： H01L23/31 , H01L23/433 , H01L23/495 , H01L23/28
CPC分类号： H01L23/3107 , H01L23/4334 , H01L23/49503 , H01L23/4951 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/73215 , H01L2224/8592 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01079 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/18165
摘要： A resin molded type semiconductor device has an inner portion sandwiched between two outer surfaces. The device includes a chip support with a first, inwardly facing surface and a second, outwardly facing surface. The device also includes a semiconductor element with a first, inwardly facing surface and a second, outwardly facing surface. The respective first surfaces of the chip support and semiconductor element are fixed to each other. A mold resin is provided to seal the entire semiconductor device except for the respective second surfaces of the chip support and semiconductor element which remain exposed as part of the two outer surfaces of the device, in order to keep the semiconductor device thin.
摘要翻译：树脂模制型半导体器件具有夹在两个外表面之间的内部部分。该装置包括具有第一面向内的表面和第二向外表面的芯片支撑件。该装置还包括具有第一面向内的表面和第二向外表面的半导体元件。芯片支撑体和半导体元件的各个第一表面彼此固定。为了保持半导体器件的薄型化，提供了一种模制树脂来密封整个半导体器件，除了作为器件的两个外表面的一部分而保持暴露的芯片支撑件和半导体元件的相应的第二表面之外。

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