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1. 发明授权

US07579692B2 Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument 失效
公开(公告)号：US07579692B2
公开(公告)日：2009-08-25
申请号：US11980126
申请日：2007-10-30
申请人： Fumiaki Matsushima , Tsutomu Ota , Akira Makabe
发明人： Fumiaki Matsushima , Tsutomu Ota , Akira Makabe
IPC分类号： H01L23/48
CPC分类号： H01L24/94 , H01L24/11 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05568 , H01L2224/11462 , H01L2224/1147 , H01L2224/11822 , H01L2224/11849 , H01L2224/11901 , H01L2224/13012 , H01L2224/13078 , H01L2224/1308 , H01L2224/13083 , H01L2224/131 , H01L2224/13144 , H01L2224/13155 , H01L2224/1411 , H01L2224/274 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01061 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/00014 , H01L2224/13099 , H01L2924/00012 , H01L2224/05644 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164
摘要： A method for forming a bump includes the steps of forming a resist layer so that a through-hole formed therein is located on a pad; and forming a metal layer to be electrically connected to the pad conforming to the shape of the through-hole. The metal layer is formed so as to have a shape in which is formed a region for receiving a soldering or brazing material.

2. 发明申请

US20080073783A1 Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument 失效
公开(公告)号：US20080073783A1
公开(公告)日：2008-03-27
申请号：US11980126
申请日：2007-10-30
申请人： Fumiaki Matsushima , Tsutomu Ota , Akira Makabe
发明人： Fumiaki Matsushima , Tsutomu Ota , Akira Makabe
IPC分类号： H01L23/488
CPC分类号： H01L24/94 , H01L24/11 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05568 , H01L2224/11462 , H01L2224/1147 , H01L2224/11822 , H01L2224/11849 , H01L2224/11901 , H01L2224/13012 , H01L2224/13078 , H01L2224/1308 , H01L2224/13083 , H01L2224/131 , H01L2224/13144 , H01L2224/13155 , H01L2224/1411 , H01L2224/274 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01061 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/00014 , H01L2224/13099 , H01L2924/00012 , H01L2224/05644 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164
摘要： A method for forming a bump includes the steps of forming a resist layer so that a through-hole formed therein is located on a pad; and forming a metal layer to be electrically connected to the pad conforming to the shape of the through-hole. The metal layer is formed so as to have a shape in which is formed a region for receiving a soldering or brazing material.

3. 发明授权

US07355280B2 Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument 有权
标题翻译：用于形成凸块的方法，半导体器件及其制造方法，半导体芯片，电路板和电子仪器
公开(公告)号：US07355280B2
公开(公告)日：2008-04-08
申请号：US11009995
申请日：2004-12-10
申请人： Fumiaki Matsushima , Tsutomu Ota , Akira Makabe
发明人： Fumiaki Matsushima , Tsutomu Ota , Akira Makabe
IPC分类号： H01L23/48 , H01L23/52
CPC分类号： H01L24/94 , H01L24/11 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05568 , H01L2224/11462 , H01L2224/1147 , H01L2224/11822 , H01L2224/11849 , H01L2224/11901 , H01L2224/13012 , H01L2224/13078 , H01L2224/1308 , H01L2224/13083 , H01L2224/131 , H01L2224/13144 , H01L2224/13155 , H01L2224/1411 , H01L2224/274 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01061 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/00014 , H01L2224/13099 , H01L2924/00012 , H01L2224/05644 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164
摘要： A method for forming a bump includes the steps of forming a resist layer so that a through-hole formed therein is located on a pad; and forming a metal layer to be electrically connected to the pad conforming to the shape of the through-hole. The metal layer is formed so as to have a shape in which is formed a region for receiving a soldering or brazing material.
摘要翻译：形成凸块的方法包括以下步骤：形成抗蚀剂层，使得其中形成的通孔位于焊盘上; 以及形成与所述通孔的形状电连接的所述垫的金属层。金属层形成为形成有用于接收焊接或钎焊材料的区域的形状。

4. 发明申请

US20050087863A1 Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument 有权
标题翻译：用于形成凸块的方法，半导体器件及其制造方法，半导体芯片，电路板和电子仪器
公开(公告)号：US20050087863A1
公开(公告)日：2005-04-28
申请号：US11009995
申请日：2004-12-10
申请人： Fumiaki Matsushima , Tsutomu Ota , Akira Makabe
发明人： Fumiaki Matsushima , Tsutomu Ota , Akira Makabe
IPC分类号： H01L21/60 , H01L23/485 , H01L21/44
CPC分类号： H01L24/94 , H01L24/11 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05568 , H01L2224/11462 , H01L2224/1147 , H01L2224/11822 , H01L2224/11849 , H01L2224/11901 , H01L2224/13012 , H01L2224/13078 , H01L2224/1308 , H01L2224/13083 , H01L2224/131 , H01L2224/13144 , H01L2224/13155 , H01L2224/1411 , H01L2224/274 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01061 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/00014 , H01L2224/13099 , H01L2924/00012 , H01L2224/05644 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164
摘要： A method for forming a bump includes the steps of forming a resist layer so that a through-hole formed therein is located on a pad; and forming a metal layer to be electrically connected to the pad conforming to the shape of the through-hole. The metal layer is formed so as to have a shape in which is formed a region for receiving a soldering or brazing material.
摘要翻译：形成凸块的方法包括以下步骤：形成抗蚀剂层，使得其中形成的通孔位于焊盘上; 以及形成与所述通孔的形状电连接的所述垫的金属层。金属层形成为形成有用于接收焊接或钎焊材料的区域的形状。

5. 发明授权

US06809020B2 Method for forming bump, semiconductor device and method for making the same, circuit board, and electronic device 失效
标题翻译：凸块形成方法，半导体装置及其制造方法，电路板和电子装置
公开(公告)号：US06809020B2
公开(公告)日：2004-10-26
申请号：US09843924
申请日：2001-04-30
申请人： Kazunori Sakurai , Tsutomu Ota , Fumiaki Matsushima , Akira Makabe
发明人： Kazunori Sakurai , Tsutomu Ota , Fumiaki Matsushima , Akira Makabe
IPC分类号： H01L2144
CPC分类号： H01L24/12 , H01L23/3128 , H01L24/11 , H01L24/16 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/05647 , H01L2224/11464 , H01L2224/11472 , H01L2224/11474 , H01L2224/1182 , H01L2224/11849 , H01L2224/11901 , H01L2224/13076 , H01L2224/1308 , H01L2224/13082 , H01L2224/13083 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2224/13562 , H01L2224/13566 , H01L2224/1357 , H01L2224/1358 , H01L2224/13582 , H01L2224/136 , H01L2224/13611 , H01L2224/13644 , H01L2224/16225 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/73204 , H01L2224/81894 , H01L2224/83851 , H01L2924/00011 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/351 , H01L2924/00014 , H01L2224/13099 , H01L2924/00 , H01L2224/29075
摘要： The invention provides a method for readily forming a bump with a desired width, a semiconductor device and a method for making the same, a circuit board, and an electronic device. A method for forming a bump includes forming an opening in an insulating film which exposes at least a part of a pad, and forming the bump so as to be connected to the pad. A resist layer 20 defines a through hole which extends over at least a part of the pad in plan view. A metal layer is formed in the opening so as to connect to the exposed portion of the pad.
摘要翻译：本发明提供一种容易地形成具有期望宽度的凸块的方法，半导体器件及其制造方法，电路板和电子器件。用于形成凸块的方法包括在绝缘膜中形成露出至少一部分焊盘的开口，并形成凸块以便连接到焊盘。抗蚀剂层20限定了在平面图中在衬垫的至少一部分上延伸的通孔。在开口中形成金属层，以便连接到焊盘的暴露部分。

6. 发明授权

US07413333B2 Lighting apparatus and liquid crystal display apparatus 失效
标题翻译：照明装置和液晶显示装置
公开(公告)号：US07413333B2
公开(公告)日：2008-08-19
申请号：US11246202
申请日：2005-10-11
申请人： Tsutomu Ota
发明人： Tsutomu Ota
IPC分类号： F21V7/04
CPC分类号： G02B6/0068 , G02B6/0031 , G09G3/3406 , G09G2320/0233 , Y10S362/80
摘要： A lighting apparatus including a light guiding plate, and a light source including a plurality of light-emitting elements which emit light at a plurality of brightness levels. The light emitting elements is provided opposite to a side edge of the light guiding plate and arranged along the side edge of the light guiding plate. The light-emitting elements are divided into a plurality of sets according to the brightness levels, and light-emitting elements in each of the sets are connected in series.
摘要翻译：一种照明装置，包括导光板和包括以多个亮度发光的多个发光元件的光源。发光元件设置成与导光板的侧边缘相对并且沿着导光板的侧边缘布置。发光元件根据亮度级分为多组，并且各组中的发光元件串联连接。

7. 发明授权

US06635850B2 Laser machining method for precision machining 失效
标题翻译：激光加工方法用于精密加工
公开(公告)号：US06635850B2
公开(公告)日：2003-10-21
申请号：US10047952
申请日：2002-01-15
申请人： Jun Amako , Masami Murai , Tsutomu Ota , Tomio Sonehara
发明人： Jun Amako , Masami Murai , Tsutomu Ota , Tomio Sonehara
IPC分类号： B23K2636
CPC分类号： B23K26/0676 , B23K26/0622 , B23K26/066 , B23K26/067 , G02F1/13439
摘要： A laser machining method and apparatus performs high-speed and high-precision machining on a thin film and a liquid crystal panel. The apparatus includes: a plurality of pulse laser generators, drivers for alternately driving a plurality of pulse laser generators to generate laser beams delayed in phase between each other; collimators for making the generated laser beams equal in quality; a wave plate for converting the laser beams into elliptically polarized laser beams; and a phase grating for dividing each laser beam emitted by each of the plurality of laser beam generators into a plurality of laser beams; such that an object to be processed is selectively illuminated with the plurality of laser beams produced by the phase grating. The phase grating has structure on its surface for dividing each of the laser beams into equal intensity beams. Open grooves are formed having uniform shape and quality.
摘要翻译：激光加工方法和装置在薄膜和液晶面板上进行高速高精度加工。该装置包括：多个脉冲激光发生器，用于交替驱动多个脉冲激光发生器以产生彼此相位延迟的激光束的驱动器; 用于使所生成的激光束的质量相等的准直器; 用于将激光束转换成椭圆偏振激光束的波片; 以及相位光栅，用于将由所述多个激光束发生器中的每一个发射的每个激光束分成多个激光束; 使得由相位光栅产生的多个激光束选择性地照射被处理物体。相位光栅在其表面上具有用于将每个激光束分成相等强度光束的结构。形成具有均匀形状和质量的开放凹槽。

8. 发明授权

US6049318A Display control device and display control method 失效
标题翻译：显示控制装置及显示控制方式
公开(公告)号：US6049318A
公开(公告)日：2000-04-11
申请号：US721954
申请日：1996-09-27
申请人： Tsutomu Ota
发明人： Tsutomu Ota
IPC分类号： G09G3/20 , G09G3/36 , G09G5/00 , G09G5/18
CPC分类号： G09G3/20 , G09G3/3677 , G09G2310/0289 , G09G2310/08 , G09G2340/0414 , G09G5/008
摘要： A display control device for a liquid crystal display is comprised of a detecting section for extracting a horizontal and vertical synchronizing signal from a video signal, a control signal generating circuit for generating a scanning start signal synchronous to the vertical synchronizing signal and a reference clock signal synchronous to the horizontal synchronizing signal, an X-driver circuit for extracting a horizontal picture signal from the video signal in synchronism with the horizontal synchronizing signal and supplying the horizontal picture signal to each of the horizontal pixel lines, and a Y-driver circuit having a shift register for shifting the scanning start pulse in one direction in response to the reference clock signal and selecting the horizontal pixel line corresponding to a holding position of the scanning start pulse, for supplying a selecting signal to the selected horizontal pixel line.
摘要翻译：一种用于液晶显示器的显示控制装置包括用于从视频信号中提取水平和垂直同步信号的检测部分，用于产生与垂直同步信号同步的扫描开始信号的控制信号产生电路和参考时钟信号与水平同步信号同步的X驱动器电路，用于与水平同步信号同步地从视频信号中提取水平图像信号并将水平图像信号提供给每个水平像素线的X驱动器电路，以及Y驱动器电路，其具有移位寄存器，用于响应于参考时钟信号沿一个方向移动扫描起始脉冲，并选择与扫描开始脉冲的保持位置相对应的水平像素线，以向所选择的水平像素线提供选择信号。

9. 发明授权

US5265086A Information recording disk 失效
标题翻译：信息记录盘
公开(公告)号：US5265086A
公开(公告)日：1993-11-23
申请号：US927542
申请日：1992-07-29
申请人： Tsutomu Ota , Mamoru Sugimoto , Yasuto Nose , Hidetoshi Yoshitaki , Tatsuro Higashi , Takashi Hayashi
发明人： Tsutomu Ota , Mamoru Sugimoto , Yasuto Nose , Hidetoshi Yoshitaki , Tatsuro Higashi , Takashi Hayashi
IPC分类号： G11B7/24 , G11B23/00 , G11B3/70
CPC分类号： G11B7/24 , G11B23/0035
摘要： An information recording disk formed from two substrates with a stepped central opening for receiving a hub within the stepped recess of at least one of the substrates is provided. In one embodiment, the central aperture of the first substrate is larger than the central aperture of the second substrate to form the stepped recess. In another embodiment, at least one substrate has a stepped surface defining a central aperture and a hub structure is mounted within this stepped recess to reduce overall thickness of the disk.
摘要翻译：提供了一种信息记录盘，其由具有台阶中心开口的两个基板形成，用于在至少一个基板的台阶凹槽内容纳轮毂。在一个实施例中，第一基板的中心孔径大于第二基板的中心孔径以形成台阶凹槽。在另一个实施例中，至少一个基板具有限定中心孔的台阶表面，并且毂结构安装在该阶梯形凹槽内以减小盘的整体厚度。

10. 发明申请

US20060087487A1 Lighting apparatus and liquid crystal display apparatus 失效
标题翻译：照明装置和液晶显示装置
公开(公告)号：US20060087487A1
公开(公告)日：2006-04-27
申请号：US11246202
申请日：2005-10-11
申请人： Tsutomu Ota
发明人： Tsutomu Ota
IPC分类号： G09G3/36
CPC分类号： G02B6/0068 , G02B6/0031 , G09G3/3406 , G09G2320/0233 , Y10S362/80
摘要： There is provided a lighting apparatus comprising a light guiding plate, and a light source including a plurality of light-emitting elements which emit light at a plurality of brightness levels. The light emitting elements is provided opposite to a side edge of the light guiding plate and arranged along the side edge of the light guiding plate. The light-emitting elements are divided into a plurality of sets according to the brightness levels, and light-emitting elements in each of the sets are connected in series.
摘要翻译：提供了一种照明装置，包括导光板和包括以多个亮度发光的多个发光元件的光源。发光元件设置成与导光板的侧边缘相对并且沿着导光板的侧边缘布置。发光元件根据亮度级分为多组，并且各组中的发光元件串联连接。

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