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    • 7. 发明授权
    • Electronic apparatus and cooling module mounted in that electronic apparatus
    • 安装在该电子设备中的电子设备和冷却模块
    • US09223362B2
    • 2015-12-29
    • US14028963
    • 2013-09-17
    • FUJITSU LIMITED
    • Masayuki WatanabeKenji SasabeEiji WajimaMasumi SuzukiMichimasa Aoki
    • H05K7/20G06F1/20
    • G06F1/20H01L2924/0002H05K7/20727H05K7/20736H05K7/20772H01L2924/00
    • An electronic apparatus includes a fan, a circuit board which is positioned downstream in an airflow to which the fan generates, at least one processer mounted on the circuit board, a radiator which is positioned downstream in the airflow which the fan generates, the radiator cooling a liquid coolant, a pipe unit which includes a heat receiving member in which the coolant flows and coolant piping, the heat receiving member being mounted on the processer, and the coolant piping circulating the liquid coolant between the radiator and the heat receiving member, and at least one memory board on which memory package is mounted, the memory board being mounted on the circuit board, and the memory board and the pipe unit being arranged along a direction perpendicular to a direction to which the fan blows the airflow.
    • 电子设备包括风扇,位于风扇产生的气流下游的电路板,安装在电路板上的至少一个处理器,位于风扇产生的气流下游的散热器,散热器冷却 液体冷却剂,管单元,其包括其中冷却剂流动的受热构件和冷却剂管道,所述热接收构件安装在所述处理器上,以及所述冷却剂管道使所述液体冷却剂在所述散热器和所述受热构件之间循环, 其上安装有存储器封装的至少一个存储器板,所述存储器板安装在所述电路板上,并且所述存储器板和所述管单元沿着垂直于所述风扇吹扫所述气流的方向的方向布置。