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1. 发明授权

US10537043B2 Electronic apparatus 有权
公开(公告)号：US10537043B2
公开(公告)日：2020-01-14
申请号：US16000949
申请日：2018-06-06
申请人： FUJITSU LIMITED
发明人： Michimasa Aoki , Yosuke Tsunoda , Keizou Takemura , Kenji Katsumata , Masumi Suzuki , Jie Wei
IPC分类号： H05K7/20 , G06F1/20 , H01L23/467 , H01L23/427 , G06F1/18
摘要： An electronic apparatus includes a case, an electronic part housed in the case, and a heat sink coupled to the electronic part and at least partially arranged outside a side wall of the case with a gap formed between an outer peripheral portion of the heat sink and the side wall of the case.

2. 发明申请

US20150195952A1 ELECTRONIC DEVICE 有权
标题翻译：电子设备
公开(公告)号：US20150195952A1
公开(公告)日：2015-07-09
申请号：US14559210
申请日：2014-12-03
申请人： FUJITSU LIMITED
发明人： Yosuke TSUNODA , Jie Wei , Masumi Suzuki
IPC分类号： H05K7/20
CPC分类号： G06F1/203 , H05K5/06 , H05K7/20163 , H05K7/20972
摘要： An electronic device includes: a heating element; a casing including a tightly sealed waterproof compartment where the heating element is disposed and a ventilation chamber being disposed adjacent to the waterproof compartment to allow outside air to flow; and a heat dissipation member provided at a side of the waterproof compartment of a partition wall partitioning the waterproof compartment and the ventilation chamber, wherein the heating element is disposed on the heat dissipation member and a thickness of the partition wall at a position where at least the heating element is disposed is thinner than that of other portions of the partition wall.
摘要翻译：电子设备包括：加热元件; 壳体，其包括密封的防水隔室，其中设置有加热元件，并且与所述防水室相邻设置通风室以允许外部空气流动; 以及散热构件，其设置在分隔所述防水室和所述通气室的分隔壁的防水室的一侧，其中所述加热元件设置在所述散热构件上，并且所述隔壁的厚度至少在至少所述加热元件设置得比所述分隔壁的其它部分薄。

3. 发明申请

US20190166720A1 COOLING JACKET AND ELECTRONIC APPARATUS 审中-公开
公开(公告)号：US20190166720A1
公开(公告)日：2019-05-30
申请号：US16171835
申请日：2018-10-26
申请人： FUJITSU LIMITED
发明人： Keizou Takemura , Jie Wei , Masumi Suzuki , Michimasa Aoki , Mitsutaka Yamada
IPC分类号： H05K7/20
摘要： A cooling jacket includes, a base having a portion that is in contact with a heat generating component, a plurality of grooves formed on a surface of the base, each of the plurality of grooves that is arranged in parallel each other, and a cover that is in contact with an upper end of each of fins formed by the plurality of grooves on the same plane as the surface of the base. Each of the plurality of grooves has curved bottom surfaces provided in both end portions thereof, and is shallower toward the end portions thereof. The cover is bonded to the base in a state of covering all of the plurality of grooves.

4. 发明授权

US10014239B2 Information processing device and cooling unit 有权
公开(公告)号：US10014239B2
公开(公告)日：2018-07-03
申请号：US15607851
申请日：2017-05-30
申请人： FUJITSU LIMITED
发明人： Keizou Takemura , Jie Wei , Mitsutaka Yamada , Michimasa Aoki , Masumi Suzuki
IPC分类号： H01L23/473 , H05K7/20 , H05K1/02 , G06F1/20
CPC分类号： H01L23/473 , G06F1/20 , G06F2200/201 , H01L23/40 , H01L23/4006 , H01L23/42 , H01L2023/4056 , H01L2023/4062 , H01L2023/4081 , H01L2224/16225 , H01L2224/73253 , H05K1/0203 , H05K7/20254 , H05K7/20272 , H05K7/20509 , H05K7/20772
摘要： An information processing device includes a substrate configured to include a mounting surface above which an electronic component is mounted; a flow passage configured to include a flow path through which a cooling medium flows and be arranged above the mounting surface; and a cooler configured to be detachably coupled with the flow passage and cool the electronic component.

5. 发明申请

US20150351283A1 HEATSINK AND BOARD UNIT 审中-公开
标题翻译：热电偶板组件
公开(公告)号：US20150351283A1
公开(公告)日：2015-12-03
申请号：US14717324
申请日：2015-05-20
申请人： FUJITSU LIMITED
发明人： Mitsutaka Yamada , Shinichirou Okamoto , Masumi Suzuki , Jie Wei
IPC分类号： H05K7/20 , F28F3/12 , F28F13/08 , F28F3/04
CPC分类号： F28F13/08 , H01L23/3672 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A heatsink includes, a fin base that receives heat from a heat generating part; a cover that cooperates with the fin base to form a flow path of coolant along which the coolant flows; a plurality of fins formed on the fin base and partitioning the flow path into a plurality of small flow paths; and an adjustment plate vertically disposed between the fin base and the cover, and perpendicularly disposed with respect to the plurality of fins, wherein the adjustment plate including different height potions.
摘要翻译：散热器包括：从发热部接收热量的散热片基座; 与翅片底座配合以形成冷却剂沿着冷却剂流动的流动路径的盖子; 形成在所述翅片基部上并将所述流路分隔成多个小流路的多个翅片; 以及垂直设置在所述翅片基部和所述盖之间并且相对于所述多个翅片垂直设置的调节板，其中所述调节板包括不同的高度部分。

6. 外观设计

USD742337S1 Radiator for electronic device 有权
标题翻译：电子设备散热器
公开(公告)号：USD742337S1
公开(公告)日：2015-11-03
申请号：US29481551
申请日：2014-02-06
申请人： FUJITSU LIMITED
设计人： Masayuki Watanabe , Hideki Kimura , Kenji Sasabe , Fumihiro Tawa , Takeshi Nishiyama , Jie Wei , Masumi Suzuki , Michimasa Aoki

7. 发明授权

US10499542B2 Cooling jacket and electronic apparatus 有权
公开(公告)号：US10499542B2
公开(公告)日：2019-12-03
申请号：US16171835
申请日：2018-10-26
申请人： FUJITSU LIMITED
发明人： Keizou Takemura , Jie Wei , Masumi Suzuki , Michimasa Aoki , Mitsutaka Yamada
IPC分类号： H05K7/00 , H05K7/20
CPC分类号： H05K7/20263 , H05K7/20254
摘要： A cooling jacket includes, a base having a portion that is in contact with a heat generating component, a plurality of grooves formed on a surface of the base, each of the plurality of grooves that is arranged in parallel each other, and a cover that is in contact with an upper end of each of fins formed by the plurality of grooves on the same plane as the surface of the base. Each of the plurality of grooves has curved bottom surfaces provided in both end portions thereof, and is shallower toward the end portions thereof. The cover is bonded to the base in a state of covering all of the plurality of grooves.

8. 发明授权

US09699886B2 Electronic device 有权
公开(公告)号：US09699886B2
公开(公告)日：2017-07-04
申请号：US14838488
申请日：2015-08-28
申请人： FUJITSU LIMITED
发明人： Yosuke Tsunoda , Jie Wei , Masumi Suzuki
IPC分类号： H05K7/20 , H01L23/367 , H05K1/02 , G06F1/20
CPC分类号： H05K1/0209 , G06F1/203 , H01L23/3672 , H05K2201/066 , H05K2201/10409
摘要： An electronic device includes: a casing; a board disposed inside the casing and having a heating element mounted thereon; an opposing member disposed inside the casing and having an opposing face opposed to a face of the board on which the heating element is mounted; a heat sink formed by alternately laminating thermal diffusion sheets and adhesive layers each having an opening at a location corresponding to the heating element on the opposing face of the opposing member; and a press member configured to press the heating element against a region of the heat sink corresponding to the opening of the adhesive layer, thus joining the thermal diffusion sheets together at the location of the opening.

9. 发明授权

US09661780B2 Heat-receiver, cooling unit and electronic device 有权
公开(公告)号：US09661780B2
公开(公告)日：2017-05-23
申请号：US14340739
申请日：2014-07-25
申请人： FUJITSU LIMITED
发明人： Michimasa Aoki , Masumi Suzuki , Jie Wei , Fumihiro Tawa , Kenji Sasabe
IPC分类号： H05K7/20 , H01L23/367 , H01L23/467 , H01L23/473
CPC分类号： H05K7/20 , H01L23/3675 , H01L23/467 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A heat-receiver includes: a first plate that receives heat at one face from a heat generating body; a second plate that is disposed facing another face of the first plate with a spacing therebetween, and that has a greater plate thickness than a plate thickness of the first plate; a first coupling portion that couples together the first plate and the second plate; and a second coupling portion that couples together the first plate and the second plate at a position that faces across the first plate toward the heat generating body, with a gap between the second coupling portion and the first coupling portion through which a coolant is capable of passing, and that has a width along the other face of the first plate that is greater than a width of the first coupling portion, as viewed along the coolant passing direction.

10. 发明授权

US09653380B2 Method for manufacturing component built-in substrate 有权
公开(公告)号：US09653380B2
公开(公告)日：2017-05-16
申请号：US15138329
申请日：2016-04-26
申请人： FUJITSU LIMITED
发明人： Makoto Suwada , Mitsutaka Yamada , Masumi Suzuki , Michimasa Aoki , Keizou Takemura , Shinichirou Okamoto , Kenji Katsumata , Jie Wei
IPC分类号： H01L23/34 , H01L23/473 , H01L23/367 , H01L23/427 , H01L23/00 , H01L25/065
CPC分类号： H01L23/473 , H01L23/3675 , H01L23/427 , H01L24/13 , H01L24/16 , H01L24/17 , H01L25/0657 , H01L2224/131 , H01L2224/16145 , H01L2224/16227 , H01L2224/17181 , H01L2225/06513 , H01L2225/06517 , H01L2225/06565 , H01L2225/06589 , H01L2924/15312 , H01L2924/014 , H01L2924/00014
摘要： A substrate is disclosed, which can remove heat from a stacked body of semiconductor elements through a phase change of a coolant. The substrate of the application includes: a stacked body of semiconductor elements; a first channel forming a path, receiving circulation of a first coolant, in a surface of the stacked body; and a second channel forming a path, receiving circulation of a second coolant having a boiling point higher than the boiling point of the first coolant, in an inter-layer portion of the stacked body.

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