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    • 5. 发明授权
    • Projection exposure method and apparatus
    • 投影曝光方法及装置
    • US5636004A
    • 1997-06-03
    • US515583
    • 1995-08-16
    • Akihiro OotakaYoshio KawaiTadahito Matsuda
    • Akihiro OotakaYoshio KawaiTadahito Matsuda
    • G03F7/20G03B27/32H01L21/30
    • G03F7/70058G03F7/70333G03F7/70475G03F7/70883
    • In a projection exposure method of irradiating illumination light from an illumination light source onto a photomask made of a transparent substrate with a periodic mask pattern, and projecting the resultant transmitted light from the photomask on a wafer through a projection system, thereby forming an optical image of the mask pattern on the wafer, projection/exposure with respect to the wafer is performed by a main exposure operation and a sub-exposure operation to be performed after the main exposure operation. The main exposure operation is performed by irradiating the photomask with the illumination light whose coherency becomes 0.3 or less when a period L of the mask pattern on the image plane of the optical system is not more than a value obtained by doubling an exposure wavelength .lambda. of the illumination light source, and dividing the resultant value by a numerical aperture of the projection system. The sub-exposure operation is performed by irradiating the photomask with the illumination light having a coherency of 0.3 or less at at least one of positions separated from a position in the main exposure operation in the optical axis direction by .DELTA.=.lambda./[2{1-(1-.lambda..sup.2 /L.sup.2).sup.1/2 }], thereby forming a periodic pattern having a period 1/2 the period L on the wafer.
    • 在将照明光源的照明光照射到由周期性掩模图案的透明基板构成的光掩模上的投影曝光方法中,通过投影系统将来自光掩模的透过光投射到晶片上,由此形成光学图像 通过在主曝光操作之后进行的主曝光操作和副曝光操作来进行相对于晶片的投影/曝光。 主曝光操作是通过在光学系统的像面上的掩模图案的周期L不大于通过使光学系统的像面上的曝光波长λ倍增获得的值的情况下照射具有相干性为0.3以下的照明光的光掩模来进行的 照明光源,并将得到的值除以投影系统的数值孔径。 副曝光操作是通过在与主曝光操作中在光轴方向上的位置分开的至少一个位置处具有0.3或更小的相干性的照明光照射光掩模来执行的,即DELTA =λ/ [2 { 1-(1-lambda 2 / L2)+ E,fra 1/2 + EE}],从而形成具有周期+ E,fra 1/2 + EE的晶片周期L的周期性图案。
    • 10. 发明授权
    • Negative working resist material, method for the production of the same
and process of forming resist patterns using the same
    • 负性抗蚀剂材料,其制造方法以及使用其形成抗蚀剂图案的工艺
    • US5457003A
    • 1995-10-10
    • US99398
    • 1993-07-30
    • Akinobu TanakaHiroshi BanJiro NakamuraTakao KimuraYoshio Kawai
    • Akinobu TanakaHiroshi BanJiro NakamuraTakao KimuraYoshio Kawai
    • G03F7/075
    • G03F7/0757Y10S430/122Y10S430/123
    • A resist material comprises a polysiloxane obtained by hydrolysis and condensation with dehydration of one or more alkoxysilanes having an oxirane ring, or of a mixture of the alkoxysilane(s) having an oxirane ring and one or more alkoxysilanes having no oxirane ring, and an acid generator. The resist material may contain one or more of a spectral sensitizer, an organic polymer having a hydroxyl group or an epoxy compound. Resist patterns are formed by coating an organic polymer on a substrate and then the resist material on the film of the organic polymer to form a two layer resist having a bottom layer of the organic polymer and top layer of the resist material, prebaking, imagewise exposing high radiation, postbaking, and developing the resist with alkaline solutions to remove an unexposed portion of the top layer, and dry etching the bottom layer using the relic of the resist material as a mask. the temperature of the post baking is preferably lower than that of the prebaking.
    • 抗蚀剂材料包括通过水解和缩合得到的聚硅氧烷,所述聚硅氧烷通过脱水一个或多个具有环氧乙烷环的烷氧基硅烷,或具有环氧乙烷环的烷氧基硅烷和一个或多个不具有环氧乙烷环的烷氧基硅烷的混合物和酸 发电机。 抗蚀剂材料可以含有一种或多种光谱增感剂,具有羟基的有机聚合物或环氧化合物。 通过在有机聚合物的膜上涂覆有机聚合物,然后在有机聚合物的膜上涂覆抗蚀剂材料形成具有有机聚合物的底层和抗蚀剂材料的顶层的双层抗蚀剂,预烘烤,成像曝光 高辐射,后烘烤,并用碱性溶液显影抗蚀剂以除去顶层的未曝光部分,并使用抗蚀剂材料的遗物作为掩模干蚀刻底层。 后烘烤的温度优选低于预烘烤的温度。