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1. 发明申请

US20020160702A1 Abrasive machine 有权
标题翻译：磨料机
公开(公告)号：US20020160702A1
公开(公告)日：2002-10-31
申请号：US10136578
申请日：2002-04-25
申请人： Fujikoshi Machinery Corp.
发明人： Hiromi Kishida , Yoshio Nakamura , Susumu Onishi
IPC分类号： B24B005/00 , B24B029/00
CPC分类号： B24B45/00 , B24B7/228
摘要： The abrasive machine of the present invention is capable of controlling a shape of an abrasive face of a small abrasive plate. The abrasive machine comprises: a plate holder holding an abrasive plate; a fixed engaging member being fixed to the plate holder and engaging with the abrasive plate; a first O-ring being provided between the fixed engaging member and the abrasive plate; a second O-ring being provided between the plate holder and the abrasive plate; and a fluid supply-discharge mechanism for supplying a fluid to and discharging the same from a zone enclosed by the abrasive plate, the plate holder and the second O-ring. An outer circumferential face of the abrasive plate is separated from an inner circumferential face of the fixed engaging member.
摘要翻译：本发明的研磨机能够控制小型研磨板的研磨面的形状。研磨机包括：保持研磨板的板夹; 固定的接合构件固定到所述板保持器并与所述研磨板接合; 第一O形环设置在固定接合构件和研磨板之间; 第二O形环设置在板支架和研磨板之间; 以及流体供给 - 排出机构，用于从由研磨板，板保持器和第二O形环包围的区域提供流体并将其排出。研磨板的外周面与固定接合构件的内周面分离。

2. 发明申请

US20020119735A1 Wafer abrasive machine 有权
标题翻译：晶圆磨机
公开(公告)号：US20020119735A1
公开(公告)日：2002-08-29
申请号：US10081493
申请日：2002-02-22
申请人： Fujikoshi Machinery Corp.
发明人： Yoshio Nakamura , Tsuyoshi Hasegawa , Susumu Onishi
IPC分类号： B24B001/00 , B24B005/00
CPC分类号： B24B37/30
摘要： In the wafer abrasive machine of the present invention, a gravity center and a rotational axis of a wafer can be corresponded while abrading the wafer and a holding plate can be smoothly moved in a head member. The abrasive machine comprises: the head member including a concave section, in which the holding plate is accommodated; an elastic sheet member suspending the holding plate and being reinforced by a cloth-formed reinforcing member; a space for storing pressure fluid which pushes the holding plate toward the abrasive plate, the space being formed between the elastic sheet member and the concave section; and a plurality of spherical bodies being provided between an outer circumferential face of the holding plate and an inner circumferential face of the concave section, the spherical bodies simultaneously point-contact the both circumferential faces.
摘要翻译：在本发明的晶片研磨机中，在研磨晶片的同时可以使晶片的重心和旋转轴对应，并且保持板能够平滑地移动到头部构件中。所述研磨机包括：所述头部构件包括凹部，所述保持板容纳在所述凹部中; 弹性片构件，其将所述保持板悬挂并由布形加强构件加强; 用于存储将所述保持板向研磨板推动的压力流体的空间，所述空间形成在所述弹性片构件和所述凹部之间; 并且在所述保持板的外周面与所述凹部的内周面之间设置有多个球状体，所述球状体同时与所述两个圆周面进行点接触。

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