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1. 发明授权

US09105292B2 Magnetic recording medium and method of manufacturing same 有权
标题翻译：磁记录介质及其制造方法
公开(公告)号：US09105292B2
公开(公告)日：2015-08-11
申请号：US13859467
申请日：2013-04-09
申请人： FUJI ELECTRIC CO., LTD.
发明人： Yuko Nakamata
IPC分类号： G11B5/66 , G11B5/72 , G11B5/84
CPC分类号： G11B5/722 , G11B5/72 , G11B5/8408
摘要： A magnetic recording medium and related method of manufacturing a magnetic recording medium that has a protective layer for the magnetic recording medium and that exhibits excellent corrosion resistance in the protective layer. The magnetic recording medium includes on a nonmagnetic substrate a magnetic layer and a protective layer formed on the magnetic layer. The protective layer is formed of a lower layer in contact with the magnetic layer and an upper layer formed on the lower layer. The material used in the lower layer is a metal having a standard electrode potential of −0.8 to 0.3 V.
摘要翻译：一种磁记录介质和制造具有用于磁记录介质的保护层并且在保护层中表现出优异的耐腐蚀性的磁记录介质的相关方法。磁记录介质在非磁性基板上包括形成在磁性层上的磁性层和保护层。保护层由与磁性层接触的下层和形成在下层上的上层形成。用于下层的材料是标准电极电位为-0.8至0.3V的金属。

2. 发明授权

US11462450B2 Semiconductor device 有权
公开(公告)号：US11462450B2
公开(公告)日：2022-10-04
申请号：US17158194
申请日：2021-01-26
申请人： FUJI ELECTRIC CO., LTD.
发明人： Yuko Nakamata
IPC分类号： H01L23/29 , H01L23/31 , H01L23/42
摘要： A semiconductor device in which a semiconductor element mounted on a laminate substrate and an electrically conductive connection member are sealed with a sealing material, includes: a primer layer in an interface between the sealing material and sealed members including the laminate substrate, the semiconductor element, and the electrically conductive connection member, in which the sealing material includes a first sealing layer which is provided in contact with the primer layer; and a second sealing layer which covers the first sealing layer, the semiconductor device satisfies αp≥α1>α2 in which αp, α1, and α2 represent coefficients of linear thermal expansion of the primer layer, the first sealing layer, and the second sealing layer, respectively, αc≥15×10−6/° C. in which αc represents a composite coefficient of linear thermal expansion of the sealing layers, and Ec≥5 GPa or more in which Ec represents a composite Young's modulus of the sealing layers.

3. 发明授权

US09355943B2 Manufacturing and evaluation method of a semiconductor device 有权
标题翻译：半导体器件的制造和评估方法
公开(公告)号：US09355943B2
公开(公告)日：2016-05-31
申请号：US14154788
申请日：2014-01-14
申请人： FUJI ELECTRIC CO., LTD.
发明人： Yuko Nakamata , Yuji Ichimura , Kei Yamaguchi
IPC分类号： H01L21/00 , H01L23/495 , H01L23/00 , H01L23/29 , H01L23/31
CPC分类号： H01L23/49531 , H01L21/4825 , H01L22/12 , H01L23/296 , H01L23/3114 , H01L23/3121 , H01L23/4952 , H01L23/49582 , H01L23/49586 , H01L24/48 , H01L24/49 , H01L2224/48137 , H01L2224/48139 , H01L2224/4903 , H01L2924/00014 , H01L2924/1305 , H01L2924/13055 , H01L2924/15787 , H01L2924/181 , H01L2924/00 , H01L2224/45099 , H01L2924/00012
摘要： Provided is a method of manufacturing a semiconductor device which includes a semiconductor chip, an insulating board mounted with the semiconductor chip and having a wiring pattern, and a leadframe connected to the wiring pattern, the semiconductor chip, the wiring pattern and the leadframe being partially sealed with a sealing resin, wherein: an epoxy resin composition formed by adding 0.3 to 0.7 mass % of epoxysilane as a silane coupling agent to an epoxy resin is used as the sealing resin; and a copper member made of copper or a copper alloy and having an oxide film formed in the surface with a film thickness in a color indicated by an L* value in the range of 48 to 51, an a* value in the range of 40 to 49 and a b* value in the range of 24 to 40 is used as the leadframe and the wiring pattern.
摘要翻译：提供一种制造半导体器件的方法，该半导体器件包括半导体芯片，安装有半导体芯片并具有布线图案的绝缘板，以及连接到布线图案的引线框架，半导体芯片，布线图案和引线框架部分地用密封树脂密封，其中：作为密封树脂使用通过将0.3〜0.7质量％的环氧硅烷作为硅烷偶联剂添加到环氧树脂中而形成的环氧树脂组合物; 铜或铜合金构成的铜构件，其表面形成氧化膜，膜厚为L *值，范围为48〜51，a *值为40 至49和ab *值在24至40的范围内用作引线框架和布线图案。

4. 发明授权

US10106683B2 Resin composite, semiconductor device, and method of manufacturing the semiconductor device 有权
公开(公告)号：US10106683B2
公开(公告)日：2018-10-23
申请号：US15397648
申请日：2017-01-03
申请人： FUJI ELECTRIC CO., LTD.
发明人： Yuko Nakamata , Yuji Ichimura
IPC分类号： H01L23/48 , C08L79/08 , C08L63/00 , H01L21/56 , H01L23/29 , H01L23/31
摘要： A resin composite includes a maleimide resin powder and a resin having a glass transition point that is lower that the glass transition point of the maleimide resin. The resin having a glass transition point that is lower than that of the maleimide resin may be an epoxy resin. Then, the resin composite may be cured at the curing temperature of the epoxy resin. The maleimide resin powder is mixed in an amount ranging from 50 weight % to 80 weight % with respect to the epoxy resin.

5. 发明授权

US10077385B2 Resin composition and electronic component 有权
公开(公告)号：US10077385B2
公开(公告)日：2018-09-18
申请号：US15411687
申请日：2017-01-20
申请人： Fuji Electric Co., Ltd.
发明人： Kotomi Suzuki , Yuji Ichimura , Yuko Nakamata
IPC分类号： C08L63/00 , C09J163/00 , C08L79/08 , C09J179/08 , C08L79/04 , C09J179/04 , C09J11/04 , H01L23/29 , H01L23/00
CPC分类号： C09J163/00 , C08L63/00 , C08L79/04 , C08L79/08 , C09J11/04 , C09J179/04 , C09J179/08 , H01L23/293 , H01L23/295 , H01L24/33 , H01L2224/3224 , H01L2924/186 , C08K3/36
摘要： A resin composition has a high glass transition temperature and is highly adhesive to a member made of metal, ceramics, or the like. The resin composition includes a thermosetting base resin, a thermoplastic resin powder, a curing agent, and an inorganic filler, a cured resin product formed by curing the resin composition, and an electrical member.

6. 发明授权

US10685903B2 Semiconductor device 有权
公开(公告)号：US10685903B2
公开(公告)日：2020-06-16
申请号：US16296078
申请日：2019-03-07
申请人： Fuji Electric Co., Ltd.
发明人： Yuko Nakamata
IPC分类号： H01L23/433 , H01L23/367 , H01L23/31
摘要： A semiconductor device, including: a semiconductor module including a layered substrate on which a semiconductor element is mounted, and a sealing material; and a cooler provided on the semiconductor module via a thermal compound. The thermal compound includes a base oil, microfillers having a ceramic as a main component, and nanofillers having a resin as a main component.

7. 发明授权

US10597526B2 Resin composition 有权
公开(公告)号：US10597526B2
公开(公告)日：2020-03-24
申请号：US15445385
申请日：2017-02-28
申请人： Fuji Electric Co., Ltd.
发明人： Yuko Nakamata , Yuji Ichimura
IPC分类号： C08L63/00 , H01L23/29 , C08G59/22 , C08G59/42 , H01L23/31 , H01L23/00 , H01L29/16 , H01L29/20 , H01L23/24
摘要： A resin composition is disclosed that includes a thermosetting base resin; a curing agent; an inorganic filler; and at least one fluorine resin powder selected from polyvinylidene fluoride, polychlorotrifluoroethylene, and a tetrafluoroethylene/perfluoro(alkyl vinyl ether)/chlorotrifluoroethylene copolymer, and a semiconductor device which is fabricated by being sealed using a sealant formed of the resin composition.

8. 发明申请

US20170275453A1 RESIN COMPOSITION 审中-公开
公开(公告)号：US20170275453A1
公开(公告)日：2017-09-28
申请号：US15445385
申请日：2017-02-28
申请人： Fuji Electric Co., Ltd.
发明人： Yuko Nakamata , Yuji Ichimura
IPC分类号： C08L63/00 , H01L29/20 , H01L23/00 , H01L29/16 , H01L23/29 , H01L23/31
摘要： A resin composition is disclosed that includes a thermosetting base resin; a curing agent; an inorganic filler; and at least one fluorine resin powder selected from polyvinylidene fluoride, polychlorotetrafluoroethylene, and a tetrafluoroethylene/perfluoro(alkyl vinyl ether)/chlorotrifluoroethylene copolymer, and a semiconductor device which is fabricated by being sealed using a sealant formed of the resin composition.

9. 发明申请

US20170233620A1 RESIN COMPOSITION AND ELECTRONIC COMPONENT 审中-公开
公开(公告)号：US20170233620A1
公开(公告)日：2017-08-17
申请号：US15411687
申请日：2017-01-20
申请人： Fuji Electric Co., Ltd.
发明人： Kotomi Suzuki , Yuji Ichimura , Yuko Nakamata
IPC分类号： C09J163/00 , C08L79/08 , C09J179/08 , H01L23/00 , C09J179/04 , C09J11/04 , H01L23/29 , C08L63/00 , C08L79/04
CPC分类号： C09J163/00 , C08L63/00 , C08L79/04 , C08L79/08 , C09J11/04 , C09J179/04 , C09J179/08 , H01L23/293 , H01L23/295 , H01L24/33 , H01L2224/3224 , H01L2924/186
摘要： A resin composition has a high glass transition temperature and is highly adhesive to a member made of metal, ceramics, or the like. The resin composition includes a thermosetting base resin, a thermoplastic resin powder, a curing agent, and an inorganic filler, a cured resin product formed by curing the resin composition, and an electrical member.

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