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1. 发明授权

US09070669B2 Wettable lead ends on a flat-pack no-lead microelectronic package 有权
标题翻译：可湿式引线端接在扁平封装的无铅微电子封装上
公开(公告)号：US09070669B2
公开(公告)日：2015-06-30
申请号：US13673212
申请日：2012-11-09
申请人： Freescale Semiconductor, Inc.
发明人： Dwight L. Daniels , Alan J. Magnus , Pamela A. O'Brien
IPC分类号： H01L21/48 , H01L23/495 , H01L23/00
CPC分类号： H01L21/4821 , H01L23/49582 , H01L24/97 , H01L2924/181 , H01L2924/00
摘要： Methods of manufacturing a flat-pack no-lead microelectronic package (2100) coat exposed base metal at a cut end of a lead frame of the package with solder (1001). One method coats the exposed base metal with solder when the package is in a strip (200, 300). Another method coats the exposed base metal with solder after the package is singulated. As a result, all portions of leads of the package that may receive solder during mounting of the package to a printed circuit board are solder wettable. A solder wettable lead end (504) on the package facilitates formation of a solder fillet during mounting of the package.
摘要翻译：制造扁平封装无引线微电子封装（2100）的方法在封装的引线框架的切割端处用焊料（1001）涂覆暴露的基底金属。当包装在条带（200,300）中时，一种方法用暴露的贱金属涂覆焊料。在封装被分割后，另一种方法是用焊料涂覆暴露的基底金属。结果，在将封装安装到印刷电路板期间可以接收焊料的封装的引线的所有部分都是可焊接的。封装上的焊料可润湿的引线端（504）有助于在安装封装期间形成焊料圆角。

2. 发明授权

US09598280B2 Environmental sensor structure 有权
公开(公告)号：US09598280B2
公开(公告)日：2017-03-21
申请号：US14537529
申请日：2014-11-10
申请人： Freescale Semiconductor, Inc.
发明人： Akhilesh K. Singh , Dwight L. Daniels , Darrel R. Frear , Stephen R. Hooper
IPC分类号： H01L23/29 , H01L23/31 , H01L23/26 , B81C1/00
CPC分类号： B81C1/00309 , B81B2201/0264 , B81B2207/012 , H01L23/26 , H01L23/29 , H01L23/3135 , H01L2224/48091 , H01L2224/48137 , H01L2224/49109 , H01L2924/00014
摘要： A device in which an electronic circuit positioned within a cavity of a package housing is encased by a bubble restrictor material, with a media resistant material overlaying the bubble restrictor material. The bubble restrictor material functions to inhibit the formation and growth of moisture-related bubbles within the material, including at the interfaces of the material and surfaces within the package housing. The media resistant material is resistant to physical and chemical alterations by media within an external environment to which the device is exposed. The media resistant material and bubble resistant material function to transfer a sensed characteristic of the media to the electronic circuit.

3. 发明授权

US09455216B2 Semiconductor device package and method of manufacture 有权
标题翻译：半导体器件封装及其制造方法
公开(公告)号：US09455216B2
公开(公告)日：2016-09-27
申请号：US14696917
申请日：2015-04-27
申请人： Freescale Semiconductor, Inc.
发明人： Dwight L. Daniels , Stephen R. Hooper , Alan J. Magnus , Justin E. Poarch
IPC分类号： H01L23/495 , H01L23/00 , H01L21/48 , H01L23/31
CPC分类号： H01L23/49537 , H01L21/4842 , H01L23/3107 , H01L23/3114 , H01L23/49541 , H01L23/49548 , H01L23/49558 , H01L23/49586 , H01L24/97 , H01L2924/181 , Y10T29/49121 , H01L2924/00
摘要： A structure to improve saw singulation quality and wettability of integrated circuit packages (140) is assembled with lead frames (112) having half-etched recesses (134) in leads. In one embodiment, the structure is a lead frame strip (110) having a plurality of lead frames. Each of the lead frames includes a depression (130) that is at least partially filled with a material (400) prior to singulating the lead frame strip. In another embodiment, the structure is a semiconductor device package (140) that includes a semiconductor device encapsulated in a package body (142) having a plurality of leads (120). Each lead has an exposed portion external to the package. There is recess (134) at a corner of each lead. Each recess has a generally concave configuration. Each recess is filled with a removable material (300).
摘要翻译：用于提高集成电路封装（140）的锯切质量和润湿性的结构与在引线中具有半蚀刻凹槽（134）的引线框架（112）组装在一起。在一个实施例中，该结构是具有多个引线框架的引线框架条（110）。每个引线框架包括在分割引线框架条之前至少部分地填充有材料（400）的凹陷（130）。在另一个实施例中，该结构是半导体器件封装（140），其包括封装在具有多个引线（120）的封装主体（142）中的半导体器件。每个引线在封装外部具有暴露部分。在每个引线的拐角处有凹槽（134）。每个凹部具有大致凹形的构造。每个凹部填充有可移除材料（300）。

4. 发明授权

US09443782B1 Method of bond pad protection during wafer processing 有权
标题翻译：晶圆加工过程中焊盘保护的方法
公开(公告)号：US09443782B1
公开(公告)日：2016-09-13
申请号：US14823069
申请日：2015-08-11
申请人： FREESCALE SEMICONDUCTOR, INC.
发明人： Robert F. Steimle , Dwight L. Daniels , Veera M. Gunturu
IPC分类号： H01L21/00 , H01L23/31 , H01L21/02 , H01L21/82 , H01L21/56 , H01L23/00
CPC分类号： H01L23/3157 , H01L21/02013 , H01L21/50 , H01L21/561 , H01L21/6835 , H01L21/78 , H01L21/82 , H01L23/04 , H01L23/10 , H01L23/564 , H01L2221/68377
摘要： A method for protecting terminal elements on a wafer during wafer level fabrication processes entails applying a protective coating to the terminal elements prior to further processing operations. These processing operations may include back side grinding of the wafer and/or saw-to-reveal operations to expose the terminal elements from a cap wafer of a wafer structure. The protective coating can protect the terminal elements from potentially damaging contaminants, such as debris from the grinding or saw-to-reveal operations. Furthermore, the protective coating can protect the bond pads from coming into contact with a rapidly oxidizing environment when exposed to water. The protective coating may be a hot-water soluble thermoplastic material the melts from a solid form to a liquid form at a relatively low temperature to enable application of the protective coating in liquid form onto the terminal elements and clean removal of the protective coating from the terminal elements.
摘要翻译：在晶片级制造过程中保护晶片上的端子元件的方法需要在进一步处理操作之前对端子元件施加保护涂层。这些处理操作可以包括晶片的背面研磨和/或锯到显示操作，以从晶片结构的盖晶片露出端子元件。保护涂层可以保护端子元件免受潜在的破坏性污染物，例如磨削或锯切操作中的碎屑。此外，当暴露于水时，保护涂层可以保护接合垫不与快速氧化环境接触。保护性涂层可以是热水可溶的热塑性材料，其在相对较低的温度下从固体形式熔化成液体形式，以使得能够将液体形式的保护涂层施加到端子元件上，并将保护涂层从终端元素。

5. 发明授权

US09093436B2 Semiconductor device package and method of manufacture 有权
标题翻译：半导体器件封装及其制造方法
公开(公告)号：US09093436B2
公开(公告)日：2015-07-28
申请号：US14453902
申请日：2014-08-07
申请人： Freescale Semiconductor, Inc.
发明人： Dwight L. Daniels , Stephen R. Hooper , Alan J. Magnus , Justin E. Poarch
IPC分类号： H01L23/495 , H01L23/00 , H01L21/48 , H01L23/31
CPC分类号： H01L23/49537 , H01L21/4842 , H01L23/3107 , H01L23/3114 , H01L23/49541 , H01L23/49548 , H01L23/49558 , H01L23/49586 , H01L24/97 , H01L2924/181 , Y10T29/49121 , H01L2924/00
摘要： A structure and method to improve saw singulation quality and wettability of integrated circuit packages (140) assembled with lead frames (112) having half-etched recesses (134) in leads. A method of manufacturing lead frames includes providing a lead frame strip (110) having a plurality of lead frames. Each of the lead frames includes a depression (130) that is at least partially filled with a material (400) prior to singulating the lead frame strip.
摘要翻译：一种用于提高组装在引线框架（112）中的集成电路封装（140）的锯切质量和润湿性的结构和方法，所述引线框架（112）在引线中具有半蚀刻凹槽（134）。制造引线框架的方法包括提供具有多个引线框架的引线框条（110）。每个引线框架包括在分割引线框架条之前至少部分地填充有材料（400）的凹陷（130）。

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