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1. 发明授权

US5714404A Fabrication of polycrystalline thin films by pulsed laser processing 失效
标题翻译：通过脉冲激光加工制造多晶薄膜
公开(公告)号：US5714404A
公开(公告)日：1998-02-03
申请号：US154347
申请日：1993-11-18
申请人： Fred Mitlitsky , Joel B. Truher , James L. Kaschmitter , Nicholas J. Colella
发明人： Fred Mitlitsky , Joel B. Truher , James L. Kaschmitter , Nicholas J. Colella
IPC分类号： H01L31/18 , H01L31/04
CPC分类号： H01L31/182 , Y02E10/546 , Y02P70/521
摘要： A method for fabricating polycrystalline thin films on low-temperature (or high-temperature) substrates which uses processing temperatures that are low enough to avoid damage to the substrate, and then transiently heating select layers of the thin films with at least one pulse of a laser or other homogenized beam source. The pulse length is selected so that the layers of interest are transiently heated to a temperature which allows recrystallization and/or dopant activation while maintaining the substrate at a temperature which is sufficiently low to avoid damage to the substrate. This method is particularly applicable in the fabrication of solar cells.
摘要翻译：一种用于在低温（或高温）基板上制造多晶薄膜的方法，其使用足够低的处理温度以避免损坏基板，然后用至少一个脉冲进行瞬时加热薄膜的选择层激光或其他均质化光束源。选择脉冲长度，使得感兴趣的层被瞬时加热到允许重结晶和/或掺杂剂活化的温度，同时将衬底保持在足够低的温度以避免损坏衬底。该方法特别适用于制造太阳能电池。

2. 发明授权

US07855623B2 Low loss RF transmission lines having a reference conductor with a recess portion opposite a signal conductor 有权
标题翻译：具有具有与信号导体相对的凹部的参考导体的低损耗RF传输线
公开(公告)号：US07855623B2
公开(公告)日：2010-12-21
申请号：US11821540
申请日：2007-06-22
申请人： Ronald Green , Belgacem Haba , David William Wallis , Nicholas J. Colella
发明人： Ronald Green , Belgacem Haba , David William Wallis , Nicholas J. Colella
IPC分类号： H01P3/08
CPC分类号： H01P3/085 , H01P1/184 , H01P1/20372 , H01P5/16 , H01P11/00 , H05K1/0219 , H05K1/024 , H05K2201/0715 , H05K2201/09236 , Y10T29/4913
摘要： A transmission structure having high propagation velocity and a low effective dielectric loss. The structure comprises a dielectric, a first reference conductor disposed below the dielectric, a signal conductor disposed above the dielectric, and a second reference conductor disposed over the signal conductor. The second reference conductor has a recess portion facing the signal conductor, the recess portion defining a gap between the second reference conductor and the signal conductor. The gap may be filled with air which has a relative dielectric constant approximately equal to one (1). Because of the physical and dielectric constant characteristics of the gap, the structure concentrates an electric field in the gap resulting in an effective dielectric constant approximately (approaching) one (1) and an effective dielectric loss approximately equal to zero (0). Thus, the structure exhibits a propagation velocity approximately equal to the speed of light.
摘要翻译：具有高传播速度和低有效介电损耗的传输结构。该结构包括电介质，布置在电介质下方的第一参考导体，布置在电介质上方的信号导体和设置在信号导体上的第二参考导体。第二参考导体具有面向信号导体的凹部，凹部限定第二参考导体和信号导体之间的间隙。间隙可以填充有大约相当于1（1）的相对介电常数的空气。由于间隙的物理和介电常数特性，该结构集中在间隙中的电场，导致大约（接近）一（1）的有效介电常数和大约等于零（0）的有效介电损耗。因此，该结构表现出大致等于光速的传播速度。

3. 发明授权

US06264882B1 Process for fabricating composite material having high thermal conductivity 失效
标题翻译：具有高导热性的复合材料的制造方法
公开(公告)号：US06264882B1
公开(公告)日：2001-07-24
申请号：US08247090
申请日：1994-05-20
申请人： Nicholas J. Colella , Howard L. Davidson , John A. Kerns , Daniel M. Makowiecki
发明人： Nicholas J. Colella , Howard L. Davidson , John A. Kerns , Daniel M. Makowiecki
IPC分类号： B05D700
CPC分类号： C22C26/00 , Y10T428/12479 , Y10T428/12493 , Y10T428/12625 , Y10T428/12806 , Y10T428/1284 , Y10T428/12847 , Y10T428/12882 , Y10T428/12903 , Y10T428/24975 , Y10T428/249967 , Y10T428/24997 , Y10T428/249986 , Y10T428/249987 , Y10T428/24999 , Y10T428/25 , Y10T428/2991 , Y10T428/31678
摘要： A process for fabricating a composite material such as that having high thermal conductivity and having specific application as a heat sink or heat spreader for high density integrated circuits. The composite material produced by this process has a thermal conductivity between that of diamond and copper, and basically consists of coated diamond particles dispersed in a high conductivity metal, such as copper. The composite material can be fabricated in small or relatively large sizes using inexpensive materials. The process basically consists, for example, of sputter coating diamond powder with several elements, including a carbide forming element and a brazeable material, compacting them into a porous body, and infiltrating the porous body with a suitable braze material, such as copper-silver alloy, thereby producing a dense diamond-copper composite material with a thermal conductivity comparable to synthetic diamond films at a fraction of the cost.
摘要翻译：一种制造复合材料的方法，例如具有高导热性并具有特定应用的复合材料作为用于高密度集成电路的散热器或散热器。通过该方法生产的复合材料具有金刚石和铜之间的导热性，并且基本上由分散在诸如铜的高导电性金属中的涂覆的金刚石颗粒组成。复合材料可以使用廉价的材料制造成小尺寸或相对大的尺寸。该方法基本上包括例如溅射镀金刚石粉末，其中包括几种元素，包括碳化物形成元件和可钎焊材料，将其压实成多孔体，并用合适的钎焊材料如铜 - 银渗透多孔体合金，从而制造出具有与人造金刚石膜相当的热导率的致密金刚石 - 铜复合材料，成本仅为成本的一小部分。

4. 发明授权

US5017779A Real time Faraday spectrometer 失效
标题翻译：实时法拉第光谱仪
公开(公告)号：US5017779A
公开(公告)日：1991-05-21
申请号：US516402
申请日：1990-04-30
申请人： Tommy E. Smith, Jr. , Kenneth W. Struve , Nicholas J. Colella
发明人： Tommy E. Smith, Jr. , Kenneth W. Struve , Nicholas J. Colella
IPC分类号： H01J49/30
CPC分类号： H01J49/30
摘要： This invention uses a dipole magnet to bend the path of a charged particle beam. As the deflected particles exit the magnet, they are spatially dispersed in the bend-plane of the magnet according to their respective momenta and pass to a plurality of chambers having Faraday probes positioned therein. Both the current and energy distribution of the particles is then determined by the non-intersecting Faraday probes located along the chambers. The Faraday probes are magnetically isolated from each other by thin metal walls of the chambers, effectively providing real time current-versus-energy particle measurements.
摘要翻译：本发明使用偶极子磁体来弯曲带电粒子束的路径。当偏转的颗粒离开磁体时，它们根据它们各自的动量在空间上分散在磁体的弯曲平面中，并且传递到具有定位在其中的法拉第探头的多个室。然后，颗粒的电流和能量分布由沿着室的不相交的法拉第探头确定。法拉第探头通过室的薄金属壁彼此磁隔离，有效地提供实时电流对能量的粒子测量。

5. 发明申请

US20080315977A1 Low loss RF transmission lines 有权
标题翻译：低损耗RF传输线
公开(公告)号：US20080315977A1
公开(公告)日：2008-12-25
申请号：US11821540
申请日：2007-06-22
申请人： Ronald Green , Belgacem Haba , David William Wallis , Nicholas J. Colella
发明人： Ronald Green , Belgacem Haba , David William Wallis , Nicholas J. Colella
IPC分类号： H01P3/08 , H01P1/18 , H01P1/203 , H01P5/12 , H01P11/00
CPC分类号： H01P3/085 , H01P1/184 , H01P1/20372 , H01P5/16 , H01P11/00 , H05K1/0219 , H05K1/024 , H05K2201/0715 , H05K2201/09236 , Y10T29/4913
摘要： A transmission structure having high propagation velocity and a low effective dielectric loss. The structure comprises a dielectric, a first reference conductor disposed below the dielectric, a signal conductor disposed above the dielectric, and a second reference conductor disposed over the signal conductor. The second reference conductor has a recess portion facing the signal conductor, the recess portion defining a gap between the second reference conductor and the signal conductor. The gap may be filled with air which has a relative dielectric constant approximately equal to one (1). Because of the physical and dielectric constant characteristics of the gap, the structure concentrates an electric field in the gap resulting in an effective dielectric constant approximately (approaching) one (1) and an effective dielectric loss approximately equal to zero (0). Thus, the structure exhibits a propagation velocity approximately equal to the speed of light.
摘要翻译：具有高传播速度和低有效介电损耗的传输结构。该结构包括电介质，布置在电介质下方的第一参考导体，布置在电介质上方的信号导体和设置在信号导体上的第二参考导体。第二参考导体具有面向信号导体的凹部，凹部限定第二参考导体和信号导体之间的间隙。间隙可以填充有大约相当于1（1）的相对介电常数的空气。由于间隙的物理和介电常数特性，该结构集中在间隙中的电场，导致大约（接近）一（1）的有效介电常数和大约等于零（0）的有效介电损耗。因此，该结构表现出大致等于光速的传播速度。

6. 发明授权

US07157309B2 Manufacture of microelectronic fold packages 有权
标题翻译：微电子折叠包装的制造
公开(公告)号：US07157309B2
公开(公告)日：2007-01-02
申请号：US10950241
申请日：2004-09-27
申请人： Nicholas J. Colella , Giles Humpston
发明人： Nicholas J. Colella , Giles Humpston
IPC分类号： H01L21/44
CPC分类号： B65B49/04 , B65B9/06 , B65B15/04 , H01L23/4985 , H01L24/86 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/3025 , H01L2924/00
摘要： An elongated strip of a sheetlike substrate bearing microelectronic elements such as semiconductor chips is advanced in a downstream direction through one or more folding stations where successive portions of the substrate are folded so as to form a strip including a plurality of fold packages, each including confronting top and bottom runs and a fold region with one or more of the runs bearing one or more microelectronic elements. The strip incorporating the plural fold packages can be wound on a reel or otherwise handled, stored and shipped to a subsequent manufacturing operation, where individual fold packages can be severed from the strip.
摘要翻译：带有诸如半导体芯片的微电子元件的片状基片的细长带沿下游方向前进通过一个或多个折叠站，其中基底的连续部分被折叠以形成包括多个折叠包装的条带，每个折叠包装件包括面对顶部和底部运行以及具有一个或多个承载一个或多个微电子元件的运行的折叠区域。包含多个折叠包装的条带可以卷绕在卷轴上或以其他方式处理，存储和运输到随后的制造操作，其中可以从带切断各个折叠包装。

7. 发明授权

US06781968B1 Wireless communication system, apparatus and method using an atmospheric platform having a wideband trunkline 失效
标题翻译：使用具有宽带干线的大气平台的无线通信系统，装置和方法
公开(公告)号：US06781968B1
公开(公告)日：2004-08-24
申请号：US09493479
申请日：2000-01-28
申请人： Nicholas J. Colella , George G. Chadwick
发明人： Nicholas J. Colella , George G. Chadwick
IPC分类号： H04B7204
CPC分类号： H04B7/18504
摘要： A system, apparatus and method provide wireless communications to a geographical area. The system includes at least one atmospheric platform serving as a central relay or node using a star network topology for the geographic area. The atmospheric platform carries a payload that comprises communications equipment. The system further includes a plurality of user equipment units located within the geographic area and at least one ground station or gateway for providing an information pathway between the user equipment units. The gateway has network processing and switching equipment for routing the information between the users. A wireless trunkline carries signals between the gateway and the atmospheric platform. The apparatus and method comprise gateway and payload uplink portions and downlink portions. The downlink portions aggregates and de-aggregates user generated information from the platform to the gateway. The uplink portions de-aggregate and aggregate the information and route the information with the network switching equipment to intended user equipment units, from the gateway to the platform. The gateway may also provide information pathways from the platform to user equipment units outside of the geographic area through existing communications infrastructure. The system, apparatus and method utilize a wide, non-contiguous band of spectrum in point-to-point links to carry the combined signal traffic from a multitude of subscribers on the ground to the communications switches at the gateway and vice versa, via the airborne platform. The use of wireless trunklines enables all types of switching, including circuit, cell, packet, or frame, or any combination thereof, to be performed by standard equipment housed in facilities on the ground rather than by specially designed equipment located on the airborne platform.
摘要翻译：系统，装置和方法向地理区域提供无线通信。该系统包括至少一个大气平台，用作中央中继或节点，使用星形网络拓扑进行地理区域。大气平台载有包含通信设备的有效载荷。该系统还包括位于地理区域内的多个用户设备单元和用于在用户设备单元之间提供信息路径的至少一个地面站或网关。网关具有用于在用户之间路由信息的网络处理和交换设备。无线干线在网关和大气平台之间传送信号。该装置和方法包括网关和有效载荷上行链路部分和下行链路部分下行链路部分聚合并将用户生成的信息从平台聚合到网关。上行链路部分对信息进行聚合和聚合，并将网络交换设备的信息从网关到平台路由到预定的用户设备单元。网关还可以通过现有的通信基础设施提供从平台到地理区域之外的用户设备单元的信息路径。该系统，装置和方法利用点对点链路中宽的非相邻频带，将来自地面上的多个用户的组合信号业务从网关传送到通信交换机，反之亦然。机载平台使用无线干线使所有类型的交换（包括电路，信元，分组或帧或其任何组合）由位于地面设施中的标准设备而不是位于机载平台上的专门设计的设备来执行。

8. 发明授权

US5762660A Precision replenishable grinding tool and manufacturing process 失效
标题翻译：精密补充研磨工具及制造工艺
公开(公告)号：US5762660A
公开(公告)日：1998-06-09
申请号：US627166
申请日：1996-04-03
申请人： Daniel M. Makowiecki , John A. Kerns , Kenneth L. Blaedel , Nicholas J. Colella , Pete J. Davis , Robert S. Juntz
发明人： Daniel M. Makowiecki , John A. Kerns , Kenneth L. Blaedel , Nicholas J. Colella , Pete J. Davis , Robert S. Juntz
IPC分类号： B24B3/00 , B24D18/00 , B24D99/00 , B24D11/00
CPC分类号： B24D99/00 , B24B3/00 , B24D18/00
摘要： A reusable grinding tool consisting of a replaceable single layer of abrasive particles intimately bonded to a precisely configured tool substrate, and a process for manufacturing the grinding tool. The tool substrate may be ceramic or metal and the abrasive particles are preferably diamond, but may be cubic boron nitride. The manufacturing process involves: coating a configured tool substrate with layers of metals, such as titanium, copper and titanium, by physical vapor deposition (PVD); applying the abrasive particles to the coated surface by a slurry technique; and brazing the abrasive particles to the tool substrate by alloying the metal layers. The precision control of the composition and thickness of the metal layers enables the bonding of a single layer or several layers of micron size abrasive particles to the tool surface. By the incorporation of an easily dissolved metal layer in the composition such allows the removal and replacement of the abrasive particles, thereby providing a process for replenishing a precisely machined grinding tool with fine abrasive particles, thus greatly reducing costs as compared to replacing expensive grinding tools.
摘要翻译：可重复使用的研磨工具由紧密结合到精确配置的工具基底上的可更换单层研磨颗粒组成，以及用于制造研磨工具的方法。工具衬底可以是陶瓷或金属，并且磨料颗粒优选是金刚石，但是可以是立方氮化硼。制造过程包括：通过物理气相沉积（PVD）将配置有金属层（例如钛，铜和钛）的工具衬底涂覆; 通过浆料技术将磨料颗粒施加到涂覆表面; 并通过使金属层合金化将磨料颗粒钎焊到工具基底上。金属层的组成和厚度的精确控制使得能够将单层或几层微米级磨料颗粒结合到工具表面。通过在组合物中引入容易溶解的金属层可以使磨料颗粒的移除和更换，从而提供了用精细磨料颗粒补充精密加工的磨削工具的方法，从而与替代昂贵的磨具相比大大降低了成本。

9. 发明授权

US07566853B2 Image sensor employing a plurality of photodetector arrays and/or rear-illuminated architecture 有权
标题翻译：采用多个光电检测器阵列和/或背照式结构的图像传感器
公开(公告)号：US07566853B2
公开(公告)日：2009-07-28
申请号：US11317207
申请日：2005-12-23
申请人： David B. Tuckerman , Kenneth Allen Honer , Bruce M. McWilliams , Nicholas J. Colella , Charles Liam Goudge
发明人： David B. Tuckerman , Kenneth Allen Honer , Bruce M. McWilliams , Nicholas J. Colella , Charles Liam Goudge
IPC分类号： H01L27/00
CPC分类号： H04N5/2257 , H01L27/14618 , H01L27/14621 , H01L27/14632 , H01L2924/0002 , H04N5/3415 , H04N9/045 , H04N9/09 , H01L2924/00
摘要： Image sensors are provided having a plurality of photodetectors in a detector layer Optionally, an optically transparent substrate is provided for a rear-illuminated sensor architecture. The photodetectors may be arranged in three or more arrays. Typically, each array is contiguous and is associated with light of a different color and/or wavelength. In addition, the arrays may be coplanar, or, in the alternative, located at increasing distances from a light-receiving surface in an at least partially nonoverlapping manner. Also provided are image sensor packages.
摘要翻译：提供了在检测器层中具有多个光电检测器的图像传感器。可选地，为背照式传感器架构提供光学透明基板。光电检测器可以被布置成三个或更多个阵列。通常，每个阵列是连续的并且与不同颜色和/或波长的光相关联。此外，阵列可以是共面的，或者在替代方案中，以至少部分不重叠的方式位于与光接收表面增加的距离处。还提供了图像传感器封装。

10. 发明授权

US07521785B2 Packaged systems with MRAM 有权
标题翻译：包装系统与MRAM
公开(公告)号：US07521785B2
公开(公告)日：2009-04-21
申请号：US11018969
申请日：2004-12-21
申请人： Philip Damberg , Nicholas J. Colella
发明人： Philip Damberg , Nicholas J. Colella
IPC分类号： H01L23/02
CPC分类号： H01L25/0657 , H01L23/49816 , H01L24/48 , H01L25/105 , H01L2224/05001 , H01L2224/05008 , H01L2224/05023 , H01L2224/05024 , H01L2224/05026 , H01L2224/05568 , H01L2224/05571 , H01L2224/16145 , H01L2224/32145 , H01L2224/48145 , H01L2224/73253 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06565 , H01L2225/06568 , H01L2225/06572 , H01L2225/06589 , H01L2225/1023 , H01L2225/1058 , H01L2225/1094 , H01L2924/00014 , H01L2924/01322 , H01L2924/15311 , H01L2924/16152 , H01L2224/05599 , H01L2224/05099 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要： A semiconductor assembly includes plural chips stacked one above the other. One or more of the chips is a magnetic random access memory (MRAM). Use of MRAM alleviates problems caused by heat dissipation in the stack.
摘要翻译：半导体组件包括多个堆叠在一起的芯片。一个或多个芯片是磁性随机存取存储器（MRAM）。使用MRAM可减轻堆叠中散热引起的问题。

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