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1. 发明授权

US07554177B2 Attachment system incorporating a recess in a structure 有权
标题翻译：在结构中结合有凹部的附接系统
公开(公告)号：US07554177B2
公开(公告)日：2009-06-30
申请号：US11243569
申请日：2005-10-05
申请人： Frank S. Geefay , David T. Dutton , Qing Bai
发明人： Frank S. Geefay , David T. Dutton , Qing Bai
IPC分类号： H01L29/06 , H05K1/11 , H01L21/00
CPC分类号： B81C1/00269 , B81C2203/019 , H01L23/10 , H01L23/3142 , H01L24/29 , H01L24/32 , H01L24/94 , H01L25/0657 , H01L25/50 , H01L2224/29 , H01L2224/29101 , H01L2224/29298 , H01L2224/83365 , H01L2224/83385 , H01L2225/06575 , H01L2924/00011 , H01L2924/00013 , H01L2924/01006 , H01L2924/01011 , H01L2924/01023 , H01L2924/01033 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12044 , H01L2924/14 , H01L2924/00 , H01L2924/01031 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： An attachment system. The attachment system includes a first structure and a second structure. The first structure has a surface and a recess in the surface. The second structure is molded into the recess and extends above the surface. The second structure adheres to the first structure at a boundary of the recess.
摘要翻译：附件系统。附件系统包括第一结构和第二结构。第一结构在表面具有表面和凹部。第二结构被模制成凹槽并在表面上方延伸。第二结构在凹槽的边界附着于第一结构。

2. 发明申请

US20060094206A1 Packaging and manufacturing of an integrated circuit 有权
标题翻译：集成电路的封装和制造
公开(公告)号：US20060094206A1
公开(公告)日：2006-05-04
申请号：US10976750
申请日：2004-10-29
申请人： Ken Nishimura , Qing Bai , Tracy Verhoeven
发明人： Ken Nishimura , Qing Bai , Tracy Verhoeven
IPC分类号： H01L21/30
CPC分类号： H01L25/18 , H01L25/0657 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2225/06513 , H01L2924/00014 , H01L2924/1305 , H01L2924/13062 , H01L2924/3011 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： Apparatus, packaging, and methods of manufacture of an integrated circuit are provided. The integrated circuit includes a component of a first type fabricated on a first substrate containing a first material, and a component of a second type fabricated on a second substrate containing a second material. The first material has better compatibility than the second material with fabrication and/or performance of the component of the first type, while the second material has better compatibility than the first material with fabrication and/or performance of the component of the second type. Also described, is a method of making the above-mentioned integrated circuit, the method including, among other steps, the step of disposing the first and second substrates opposite one another, and the step of establishing an electrical connection between the components.
摘要翻译：提供了集成电路的装置，封装和制造方法。该集成电路包括在包含第一材料的第一基板上制造的第一类型的部件和在包含第二材料的第二基板上制造的第二类型的部件。第一种材料具有比具有第一类型的部件的制造和/或性能的第二材料更好的相容性，而第二种材料具有比具有第二类型的部件的制造和/或性能的第一材料更好的兼容性。还描述了制造上述集成电路的方法，该方法还包括将第一和第二基板相对地布置的步骤以及在部件之间建立电连接的步骤。

3. 发明授权

US07274050B2 Packaging and manufacturing of an integrated circuit 有权
标题翻译：集成电路的封装和制造
公开(公告)号：US07274050B2
公开(公告)日：2007-09-25
申请号：US10976750
申请日：2004-10-29
申请人： Ken Nishimura , Qing Bai , Tracy Bell Verhoeven
发明人： Ken Nishimura , Qing Bai , Tracy Bell Verhoeven
IPC分类号： H01L23/58
CPC分类号： H01L25/18 , H01L25/0657 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2225/06513 , H01L2924/00014 , H01L2924/1305 , H01L2924/13062 , H01L2924/3011 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： Apparatus, packaging, and methods of manufacture of an integrated circuit are provided. The integrated circuit includes a component of a first type fabricated on a first substrate containing a first material, and a component of a second type fabricated on a second substrate containing a second material. The first material has better compatibility than the second material with fabrication and/or performance of the component of the first type, while the second material has better compatibility than the first material with fabrication and/or performance of the component of the second type. Also described, is a method of making the above-mentioned integrated circuit, the method including, among other steps, the step of disposing the first and second substrates opposite one another, and the step of establishing an electrical connection between the components.
摘要翻译：提供了集成电路的装置，封装和制造方法。该集成电路包括在包含第一材料的第一基板上制造的第一类型的部件和在包含第二材料的第二基板上制造的第二类型的部件。第一种材料具有比具有第一类型的部件的制造和/或性能的第二材料更好的相容性，而第二种材料具有比具有第二类型的部件的制造和/或性能的第一材料更好的兼容性。还描述了制造上述集成电路的方法，该方法还包括将第一和第二基板相对地布置的步骤以及在部件之间建立电连接的步骤。

4. 发明申请

US20050109455A1 Device having a complaint element pressed between substrates 失效
标题翻译：在基板之间施加有投诉元件的装置
公开(公告)号：US20050109455A1
公开(公告)日：2005-05-26
申请号：US10723095
申请日：2003-11-26
申请人： Qing Bai
发明人： Qing Bai
IPC分类号： H01L21/50 , H01L21/60 , H01L23/10 , H01L23/485 , B32B31/00
CPC分类号： H01L24/81 , H01L21/50 , H01L23/10 , H01L24/11 , H01L24/13 , H01L2224/05568 , H01L2224/05573 , H01L2224/05611 , H01L2224/13099 , H01L2224/16 , H01L2224/81801 , H01L2924/0001 , H01L2924/01004 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/3025 , H01L2924/00014
摘要： A device comprises a first substrate, a second substrate and a compliant element. The compliant element is composed of a first, compliant material between the first substrate and the second substrate and has a side surface coated at least in part with a layer of a second material. The compliant element exhibits deformation consistent with the first substrate and a second side having been pressed together. In some embodiments, the second material is electrically conductive such that the compliant element provides a reliable electrical connection between the substrates. In other embodiments, the second material increases the hermeticity of the compliant element such that the compliant element provides a better hermetic seal between the substrates.
摘要翻译：一种装置包括第一基板，第二基板和顺应元件。柔性元件由第一基底和第二基底之间的第一顺应性材料组成，并且具有至少部分地涂覆有第二材料层的侧表面。柔顺元件表现出与第一基板一致的变形，并且第二侧被压在一起。在一些实施例中，第二材料是导电的，使得柔性元件在基板之间提供可靠的电连接。在其它实施例中，第二材料增加柔顺元件的气密性，使得柔性元件在基底之间提供更好的气密密封。

5. 发明授权

US08985522B2 Method for improving operation density of rail vehicles and preventing head-on collision and rear-ending collision 有权
标题翻译：提高轨道车辆运行密度，防止碰撞和后端碰撞的方法
公开(公告)号：US08985522B2
公开(公告)日：2015-03-24
申请号：US13825262
申请日：2011-08-09
申请人： Wei Bai , Jing Bai , Qing Bai , Baolong Feng
发明人： Wei Bai , Jing Bai , Qing Bai , Baolong Feng
IPC分类号： B61L21/00 , B61L23/26 , B61L21/10 , B61L23/14 , B61L23/18
CPC分类号： B61L23/26 , B61L21/10 , B61L23/14 , B61L23/18 , B61L23/30
摘要： The present invention provides a method for improving operation density of rail vehicles and for preventing head-on collision and rear-ending collision. Said method divides a rail line into equidistant electronic zones, the length of a zone being greater than the shortest safe distance between two running vehicles. Said method installs a locomotive passing detection alarm device in each zone, when a locomotive travels at high speed on the rail, the locomotive passing detection alarm device corresponding to the zone occupied by the locomotive itself will simultaneously access adjacent front and back zones, and determine whether the two adjacent zones are simultaneously occupied by locomotives. If the two adjacent. zones are simultaneously occupied by locomotives, the locomotive passing alarm device will send an alarm signal to the locomotives to warn or otherwise take measures. The aforesaid method can avoid locomotive head-on collision and rear-end collision and increase transportation density according to the vehicle speed and distance at the same time, thus improving the transportation efficiency.
摘要翻译：本发明提供了一种提高轨道车辆的运行密度和防止碰撞和后端碰撞的方法。所述方法将铁路线划分成等距离的电子区域，区域的长度大于两辆运行车辆之间的最短安全距离。所述方法在每个区域安装机车通过检测报警装置，当机车在轨道上高速行驶时，对应于机车本身占据的区域的机车通过检测报警装置将同时访问相邻的前后区域，并确定两个相邻区域是否同时被机车占据。如果两个相邻。机车同时占用机车，机车通过报警装置将向机车发出报警信号，以警告或采取措施。上述方法可以避免机车前后碰撞和后端碰撞，同时根据车速和距离增加运输密度，从而提高运输效率。

6. 发明申请

US20130001145A1 Micro-Machined Frit and Flow Distributor Devices for Liquid Chromatography 审中-公开
标题翻译：用于液相色谱的微加工玻璃料和流量分配器
公开(公告)号：US20130001145A1
公开(公告)日：2013-01-03
申请号：US13172034
申请日：2011-06-29
申请人： Hongfeng Yin , Qing Bai , Reid A. Brennen
发明人： Hongfeng Yin , Qing Bai , Reid A. Brennen
IPC分类号： B01D15/08 , B32B17/00 , B01D15/18 , B32B3/10
CPC分类号： G01N30/603 , B01D15/22 , G01N30/6017 , G01N30/6095 , G01N2030/027 , Y10T428/24273 , Y10T428/24314 , Y10T428/24322
摘要： A micro-machined frit is provided for use in a chromatography column, having a substrate with a thickness, and holes extending through the thickness and providing fluid communication through the substrate. A micro-machined flow distributor is provided for use in a chromatography column having a substrate, holes extending through the substrate, and channels in fluid communication with the holes. A micro-machined integrated frit and flow distributor device is also provided having a substrate with a thickness, holes extending through the thickness and providing fluid communication therethrough, and channels in fluid communication with at least one of the holes. A chromatography column is provided having a tube, an extraction medium contained therein, and a micro-machined frit positioned proximate an end of the tube. The column can include a micro-machined flow distributor positioned between the frit and the end of the tube.
摘要翻译：提供微加工玻璃料用于色谱柱，其具有厚度的基材和延伸穿过该厚度并提供通过基材的流体连通的孔。提供微加工流量分配器用于具有基板，延伸穿过基板的孔和与孔流体连通的通道的色谱柱。还提供了一种微加工的集成玻璃料和流量分配器装置，其具有厚度的衬底，延伸穿过该厚度的孔，并且提供流体连通，以及与至少一个孔流体连通的通道。提供了一种色谱柱，其具有管，其中包含的萃取介质和靠近管的端部定位的微加工玻璃料。该柱可以包括位于玻璃料和管的端部之间的微加工流量分配器。

7. 发明授权

US07294919B2 Device having a complaint element pressed between substrates 失效
标题翻译：具有在基板之间按压的柔顺元件的装置
公开(公告)号：US07294919B2
公开(公告)日：2007-11-13
申请号：US10723095
申请日：2003-11-26
申请人： Qing Bai
发明人： Qing Bai
IPC分类号： H01L23/48 , H01R25/00
CPC分类号： H01L24/81 , H01L21/50 , H01L23/10 , H01L24/11 , H01L24/13 , H01L2224/05568 , H01L2224/05573 , H01L2224/05611 , H01L2224/13099 , H01L2224/16 , H01L2224/81801 , H01L2924/0001 , H01L2924/01004 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/3025 , H01L2924/00014
摘要： A device comprises a first substrate, a second substrate and a compliant element. The compliant element is composed of a first, compliant material between the first substrate and the second substrate and has a side surface coated at least in part with a layer of a second material. The compliant element exhibits deformation consistent with the first substrate and a second side having been pressed together. In some embodiments, the second material is electrically conductive such that the compliant element provides a reliable electrical connection between the substrates. In other embodiments, the second material increases the hermeticity of the compliant element such that the compliant element provides a better hermetic seal between the substrates.
摘要翻译：一种装置包括第一基板，第二基板和顺应元件。柔性元件由第一基底和第二基底之间的第一顺应性材料组成，并且具有至少部分地涂覆有第二材料层的侧表面。柔顺元件表现出与第一基板一致的变形，并且第二侧被压在一起。在一些实施例中，第二材料是导电的，使得柔性元件在基板之间提供可靠的电连接。在其它实施例中，第二材料增加柔顺元件的气密性，使得柔性元件在基底之间提供更好的气密密封。

8. 发明申请

US20060012021A1 Film bulk acoustic resonator package and method of fabricating same 有权
公开(公告)号：US20060012021A1
公开(公告)日：2006-01-19
申请号：US10890343
申请日：2004-07-13
申请人： John Larson, , Qing Bai , Farid Matta , Tracy Verhoeven
发明人： John Larson, , Qing Bai , Farid Matta , Tracy Verhoeven
IPC分类号： H01L21/48 , H01L23/52
CPC分类号： H03H9/105 , H03B5/326 , H03H3/02 , H03H9/0547 , H03H9/706
摘要： A microfabricated device has a first substrate, a second substrate, a film bulk acoustic resonator (FBAR) device, and a circuit. The second substrate is bonded to the first substrate to define a chamber. The FBAR device is located on a surface of the first substrate and inside the chamber. The circuit is located on a surface of the second substrate and inside the chamber. An electrical connection connects the circuit and the FBAR device.

9. 发明授权

US09283972B2 Networking operation dispatch system based on electronic zones for rail vehicle 有权
公开(公告)号：US09283972B2
公开(公告)日：2016-03-15
申请号：US14360624
申请日：2012-12-31
申请人： Wei Bai , Jing Bai , Qing Bai , Xianbing Bai , Baolong Feng
发明人： Wei Bai , Jing Bai , Qing Bai , Xianbing Bai , Baolong Feng
IPC分类号： B61L23/26 , B61L15/00 , B61L23/30 , B61L27/00
CPC分类号： B61L23/26 , B61L3/225 , B61L15/0027 , B61L23/041 , B61L23/048 , B61L23/28 , B61L23/30 , B61L27/0038
摘要： A networking operation dispatch system based on electronic zones for rail vehicle comprises: a zone-end relay computer, a communication ranging antenna along rail, a locomotive-mounted response computer and a road networking computer, wherein: the zone-end relay computer is installed on an end of each electronic zone; the communication ranging antenna along rail has an equivalent length to the electronic zone, a first end of the communication ranging antenna along rail is connected with the zone-end relay computer and a second thereof is disposed in the air; the locomotive-mounted response computer is installed on each locomotive and communicates with the zone-end relay computer in the electronic zone occupied by the locomotive via the communication ranging antenna; and the road networking computer connects each zone-end relay computer to form a network. A rail security detecting sensor is provided in the electronic zone.

10. 发明申请

US20150191184A1 Networking operation dispatch system based on electronic zones for rail vehicle 审中-公开
标题翻译：基于铁路车辆电子区域的网络运行调度系统
公开(公告)号：US20150191184A1
公开(公告)日：2015-07-09
申请号：US14360624
申请日：2012-12-31
申请人： Wei Bai , Jing Bai , Qing Bai , Xianbing Bai , Baolong Feng
发明人： Wei Bai , Jing Bai , Qing Bai , Xianbing Bai , Baolong Feng
IPC分类号： B61L23/26
CPC分类号： B61L23/26 , B61L3/225 , B61L15/0027 , B61L23/041 , B61L23/048 , B61L23/28 , B61L23/30 , B61L27/0038
摘要： A networking operation dispatch system based on electronic zones for rail vehicle comprises: a zone-end relay computer, a communication ranging antenna along rail, a locomotive-mounted response computer and a road networking computer, wherein: the zone-end relay computer is installed on an end of each electronic zone; the communication ranging antenna along rail has an equivalent length to the electronic zone, a first end of the communication ranging antenna along rail is connected with the zone-end relay computer and a second thereof is disposed in the air; the locomotive-mounted response computer is installed on each locomotive and communicates with the zone-end relay computer in the electronic zone occupied by the locomotive via the communication ranging antenna; and the road networking computer connects each zone-end relay computer to form a network. A rail security detecting sensor is provided in the electronic zone.
摘要翻译：一种基于铁路车辆电子区域的组网操作调度系统，包括：区域终端中继计算机，沿着轨道的通信测距天线，机车安装响应计算机和道路网络计算机，其中：安装区域中继计算机在每个电子区域的末尾; 沿着轨道的通信测距天线具有与电子区域等效的长度，沿着轨道的通信测距天线的第一端与区域中继计算机连接，其中第二端设置在空中; 机车安装的响应计算机安装在每个机车上，并且经由通信测距天线与由机车占据的电子区域中的区域中继计算机进行通信; 并且道路网络计算机连接每个区段中继计算机以形成网络。轨道安全检测传感器设置在电子区域中。

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