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1. 发明申请

US20070265460A1 PROCESS FOR THE PRODUCTION OF (TRIMETHYLSILYLOXY)SILYLALKYLGLYCEROL METHACRYLATES 审中-公开
标题翻译：（三甲基硅氧烷）甲基丙烯酰氧基甲基丙烯酸酯的生产方法
公开(公告)号：US20070265460A1
公开(公告)日：2007-11-15
申请号：US11782727
申请日：2007-07-25
申请人： Shivkumar Mahadevan , Robert Ward , Shanger Wang , James Parakka , Yuan Tian , Frank Molock
发明人： Shivkumar Mahadevan , Robert Ward , Shanger Wang , James Parakka , Yuan Tian , Frank Molock
IPC分类号： C07F7/08
CPC分类号： C07F7/0879
摘要： The present invention relates to a process comprising the steps of reacting in the presence of a hydrosilylation catalyst, a first reaction mixture comprising a free radical reactive compound and a silicon containing compound to form a silicon substituted glyceryl (meth)acrylate.
摘要翻译：本发明涉及包括以下步骤的方法：在氢化硅烷化催化剂存在下，包含自由基反应性化合物和含硅化合物的第一反应混合物反应以形成硅取代的（甲基）丙烯酸甘油酯。

2. 发明申请

US20060047134A1 Process for the production of (trimethylsilyloxy)silylalkylglycerol methacrylates 审中-公开
标题翻译：（三甲基甲硅烷氧基）甲硅烷基烷基甘油甲基丙烯酸酯的制备方法
公开(公告)号：US20060047134A1
公开(公告)日：2006-03-02
申请号：US10926425
申请日：2004-08-25
申请人： Frank Molock , Shivkumar Mahadevan , Robert Ward , Shanger Wang , James Parakka , Yuan Tian
发明人： Frank Molock , Shivkumar Mahadevan , Robert Ward , Shanger Wang , James Parakka , Yuan Tian
IPC分类号： C07F7/04
CPC分类号： C07F7/0879
摘要： The present invention relates to a process comprising the steps of reacting in the presence of a hydrosilylation catalyst, a first reaction mixture comprising a free radical reactive compound and a silicon containing compound to form a silicon substituted glyceryl (meth)acrylate.
摘要翻译：本发明涉及包括以下步骤的方法：在氢化硅烷化催化剂存在下，包含自由基反应性化合物和含硅化合物的第一反应混合物反应，形成硅取代的（甲基）丙烯酸甘油酯。

3. 发明申请

US20050092680A1 Purification of silicone containing compounds by supercritical fluid extraction 失效
标题翻译：通过超临界流体萃取法纯化含硅化合物
公开(公告)号：US20050092680A1
公开(公告)日：2005-05-05
申请号：US10699417
申请日：2003-10-31
申请人： Shivkumar Mahadevan , Frank Molock , Robert Ward , Yuan Tian , Shanger Wang , James Serpilio
发明人： Shivkumar Mahadevan , Frank Molock , Robert Ward , Yuan Tian , Shanger Wang , James Serpilio
IPC分类号： C07F7/20 , C02F1/26
CPC分类号： C08G77/34 , C07F7/20 , Y02P20/544
摘要： The present invention relates to a process for the purification of silicone containing compounds via supercritical fluid extraction. Specifically, the present invention relates to a process comprising the steps of contacting at least one silicone containing compound with a supercritical fluid having a density of between about 0.2 and about 0.8 g/ml, decreasing said density so that two phases are formed a first phase comprising said at least one silicone containing compound and a second phase comprising at least one impurity and separating said second phase from said first phase.
摘要翻译：本发明涉及通过超临界流体萃取纯化含硅氧烷化合物的方法。具体地说，本发明涉及一种方法，该方法包括以下步骤：使至少一种含硅氧烷的化合物与密度为约0.2至约0.8g / ml的超临界流体接触，降低所述密度，使得两相形成第一相包括所述至少一种含硅氧烷化合物和包含至少一种杂质的第二相，并将所述第二相与所述第一相分离。

4. 发明授权

US07368589B2 Purification of silicone containing compounds by supercritical fluid extraction 失效
标题翻译：通过超临界流体萃取法纯化含硅化合物
公开(公告)号：US07368589B2
公开(公告)日：2008-05-06
申请号：US10699417
申请日：2003-10-31
申请人： Shivkumar Mahadevan , Frank Molock , Robert S. Ward , Yuan Tian , Shanger Wang , James M. Serpilio, Jr.
发明人： Shivkumar Mahadevan , Frank Molock , Robert S. Ward , Yuan Tian , Shanger Wang , James M. Serpilio, Jr.
IPC分类号： C07F7/00
CPC分类号： C08G77/34 , C07F7/20 , Y02P20/544
摘要： The present invention relates to a process for the purification of silicone containing compounds via supercritical fluid extraction. Specifically, the present invention relates to a process comprising the steps of contacting at least one silicone containing compound with a supercritical fluid having a density of between about 0.2 and about 0.8 g/ml, decreasing said density so that two phases are formed a first phase comprising said at least one silicone containing compound and a second phase comprising at least one impurity and separating said second phase from said first phase.
摘要翻译：本发明涉及通过超临界流体萃取纯化含硅氧烷化合物的方法。具体地说，本发明涉及一种方法，该方法包括以下步骤：使至少一种含硅氧烷的化合物与密度为约0.2至约0.8g / ml的超临界流体接触，降低所述密度，使得两相形成第一相包括所述至少一种含硅氧烷化合物和包含至少一种杂质的第二相，并将所述第二相与所述第一相分离。

5. 发明申请

US20110124772A1 ANTIMICROBIAL POLYMERS AND THEIR USES 审中-公开
标题翻译：抗微生物聚合物及其用途
公开(公告)号：US20110124772A1
公开(公告)日：2011-05-26
申请号：US12994836
申请日：2009-05-26
申请人： Shanger Wang , Robert S. Ward , Yuan Tian , Li Li , Keith Mccrea , James Parakka , Robert L. Jones, JR.
发明人： Shanger Wang , Robert S. Ward , Yuan Tian , Li Li , Keith Mccrea , James Parakka , Robert L. Jones, JR.
IPC分类号： C09D175/04 , C08G71/04
CPC分类号： A01N33/12 , A01N47/44 , A01N25/10 , A01N2300/00
摘要： Polymers with non-leaching antimicrobial activity and their use as surface coatings or bulk resins for medical devices. The antimicrobial polymers are prepared with antimicrobial moieties covalently bonded to a polymer chain end or to a polymer backbone at a side chain end. The antimicrobial moiety-containing endgroups include surface active (or surface assembling) moieties which promote enrichment of antimicrobial endgroups at the polymer surface and thus formation of an antimicrobially active surface. Polymers with built-in antimicrobial endgroups can be used as bulk resins, as antimicrobial additives, or as infection preventative coatings in the manufacture of medical devices (e.g., catheters, vascular access devices, peripheral lines, IV sites, drains, gastric feeding and tubes, and other implantable devices). Such materials can also be used as antimicrobial and antifouling coatings on structures in contact with microorganism in environments that require control of biofilm formation, such as marine products.
摘要翻译：具有非浸出抗菌活性的聚合物及其用作医疗器械的表面涂层或体积树脂。抗微生物聚合物通过共价键合到聚合物链末端的抗微生物部分或在侧链末端与聚合物主链一起制备。含抗微生物部分的端基包括表面活性（或表面组装）部分，其促进抗微生物端基在聚合物表面的富集，从而形成抗微生物活性表面。具有内置抗微生物端基的聚合物可用作散装树脂，作为抗微生物添加剂，或作为医疗器械制造中的感染预防性涂层（例如，导管，血管通路装置，外围线，IV部位，下水道，胃饲和管，和其他可植入装置）。在需要控制生物膜形成的环境中，例如海产品，这些材料也可用作与微生物接触的结构上的抗微生物和防污涂料。

6. 发明申请

US20090258048A1 Self-Assembling Monomers and Oligomers as Surface-Modifying Endgroups for Polymers 审中-公开
标题翻译：自组装单体和低聚物作为表面改性端基用于聚合物
公开(公告)号：US20090258048A1
公开(公告)日：2009-10-15
申请号：US12083927
申请日：2006-12-07
申请人： Robert S. Ward , Keith R. McCrea , Yuan Tian , James P. Parakka , Shanger Wang
发明人： Robert S. Ward , Keith R. McCrea , Yuan Tian , James P. Parakka , Shanger Wang
IPC分类号： A61F2/02 , C08G63/91 , C12M3/00 , B65D71/00
CPC分类号： A61K31/785 , C08G18/0895 , C08G18/2875 , C08G18/288 , C08G18/44 , C08G18/6266
摘要： Polymers having the formula R(LE)x wherein R is a polymeric core having a number average molecular weight of from 5000 to 7,000,000 daltons and having x endgroups, E is an endgroup covalently linked to polymeric core R by linkage L, L is a divalent oligomeric chain, having at least 5 identical repeat units, capable of self-assembly with L chains on adjacent molecules of the polymer, and the moieties (LE)x in the polymer may be the same as or different from one another. Design of monomers, oligomers, or other reactive structures otherwise analogous to known Self Assembled Monolayers but with at least one reactive chemical group capable of binding them to the terminus of a polymer, so that the thiol-free SAM analogue becomes the self-assembling surface modifying endgroup of that polymer. Use of the polymer to fabricate a configured article from the surface-modified polymer or a coating or topical treatment on an article made from another material.
摘要翻译：具有式R（LE）x的聚合物，其中R是数均分子量为5000-7,000,000道尔顿且具有x个端基的聚合物芯，E是通过连接L与聚合物核心R共价连接的端基，L是二价具有至少5个相同重复单元的低聚链，能够与聚合物的相邻分子上的L链自组装，并且聚合物中的部分（LE）x可以彼此相同或不同。单体，低聚物或其它类似于已知的自组装单层的单体，低聚物或其它反应性结构的设计，但具有至少一个能够将它们结合到聚合物末端的反应性化学基团，使得无硫醇的SAM类似物变成自组装表面修饰该聚合物的端基。使用聚合物从表面改性的聚合物制造配置的制品，或者对由另一种材料制成的制品进行包衣或局部处理。

7. 发明申请

US20110293522A1 SURFACE MODIFICATION OF POLYMERS VIA SURFACE ACTIVE AND REACTIVE END GROUPS 审中-公开
标题翻译：通过表面活性和反应性末端组合聚合物的表面改性
公开(公告)号：US20110293522A1
公开(公告)日：2011-12-01
申请号：US13129438
申请日：2009-11-16
申请人： Shanger Wang , Robert S. Ward , Yuan Tian , Xuwei Jiang , Keith Mccrea , Scott Curtin
发明人： Shanger Wang , Robert S. Ward , Yuan Tian , Xuwei Jiang , Keith Mccrea , Scott Curtin
IPC分类号： A61K49/00 , B29C45/00 , A61P31/00 , A61P7/02 , C08G18/83 , A61K31/785
CPC分类号： C08G18/837 , A61K2800/61 , C08G18/08 , C08J7/12 , C08J7/14
摘要： Polymer surface modification method comprising the steps of first forming a surface of primary reactive end groups tethered to the polymer chain ends during fabrication of an article, and then modifying the reactive surface with bio-active molecules, hydrophilic and hydrophobic monomers, oligomers, or polymers to attain specific surface properties. Alternatively, a multifunctional coupling agent can be used to couple the primary reactive group to a second reactive group capable of reacting with a functional group associated with bio-active molecules, hydrophilic and hydrophobic monomers, oligomers, and polymers to attain specific surface properties. The invention involves bringing reactive endgroups to the surface with surface active spacer attached to the polymer chain end. The surface active spacer allows the migration and enrichment of reactive end groups to the surface during fabrication. The invention provides medical devices having a bio-interface with anti-thrombogenic properties, lubricity, selective adsorption, and antimicrobial properties.
摘要翻译：聚合物表面改性方法包括以下步骤：在制品制造期间首先形成与聚合物链末端连接的主要反应性端基的表面，然后用生物活性分子，亲水和疏水单体，低聚物或聚合物改性活性表面以获得特定的表面性质。或者，多功能偶联剂可用于将主反应性基团与能够与与生物活性分子，亲水和疏水单体，低聚物和聚合物相关的官能团反应的第二反应性基团，以获得特定的表面性质。本发明涉及将表面活性隔离物连接到聚合物链末端的反应性端基引入表面。表面活性间隔物允许反应性端基在制造过程中迁移和富集到表面。本发明提供具有抗血栓形成性质，润滑性，选择性吸附和抗微生物性质的生物界面的医疗装置。

8. 发明申请

US20100179284A1 POLYMERS WITH BIO-FUNCTIONAL SELF ASSEMBLING MONOLAYER ENDGROUPS FOR THERAPEUTIC APPLICATIONS AND BLOOD FILTRATION 审中-公开
标题翻译：具有生物功能自组装单体终端用于治疗应用和血液过滤的聚合物
公开(公告)号：US20100179284A1
公开(公告)日：2010-07-15
申请号：US12601787
申请日：2008-05-28
申请人： Robert S. Ward , Keith McCrea , Yuan Tian , Shanger Wang , Larry Jones , Anfeng Wang , James P. Parakka
发明人： Robert S. Ward , Keith McCrea , Yuan Tian , Shanger Wang , Larry Jones , Anfeng Wang , James P. Parakka
IPC分类号： C08B37/10
CPC分类号： A61K31/785 , C08G18/3228 , C08G18/3271 , C08G18/44 , C08G18/5024
摘要： Medical device, prosthesis, or packaging assembly made up of polymer body comprising at least one polymer having the formula R(LE)x wherein R is a polymeric core having a number average molecular weight of from 5000 to 7,000,000 daltons, and having x endgroups, x is an integer≧1, E is an endgroup which is covalently linked to polymeric core R by linkage L, L is a divalent oligomeric chain which has at least 5 repeat units and which can self-assembly with L chains on adjacent molecules of the polymer, and moieties L and/or E in the polymer(s) may be the same as or different from one another in composition and/or molecular weight. The polymer body includes plural polymer molecules located internally within the body, at least some of which internal polymer molecules have endgroups that form a surface of the body. The surface endgroups include at least one self-assembling moiety.
摘要翻译：由包含至少一种具有式R（LE）x的聚合物的聚合物主体组成的医疗装置，假体或包装组件，其中R是数均分子量为5000至70000道尔顿的聚合物芯，并且具有x个端基， x是整数≥1，E是通过连接L与聚合物核心R共价连接的端基，L是具有至少5个重复单元的二价低聚链，并且可以与L链相邻的分子自组装聚合物和聚合物中的部分L和/或E可以在组成和/或分子量上彼此相同或不同。聚合物主体包括位于体内内部的多个聚合物分子，其中至少一些内部聚合物分子具有形成身体表面的端基。表面端基包括至少一个自组装部分。

9. 发明申请

US20140135408A1 SILICONE CONTAINING MONOMERS WITH HYDROPHILIC END GROUPS 审中-公开
标题翻译：含硅胶的单体含有疏水末端基团
公开(公告)号：US20140135408A1
公开(公告)日：2014-05-15
申请号：US13982713
申请日：2012-02-01
申请人： Shanger Wang , Xuwei Jiang , Yuan Tian
发明人： Shanger Wang , Xuwei Jiang , Yuan Tian
IPC分类号： G02B1/04
CPC分类号： G02B1/043 , C07F7/0838 , C07F7/1804 , C07F9/091 , C07F9/092 , C07F9/65742 , C08G77/045 , C08G77/12 , C08G77/16 , C08G77/20 , C08G77/38 , C08G77/388 , C08G77/392 , C08G77/395 , C08K5/5425 , C08L101/14 , C08L83/04 , C08F2230/085 , C08F220/20 , C08F220/54 , C08F2220/286
摘要： Silicone containing reactive monomers with hydrophilic end-groups of formula I useful in the manufacture of biocompatible medical devices are disclosed, wherein R1 is H or CH3, a is 0 or 1, p is an integer from 1 to 6, q is an integer from 1 to 3 and for each q, the end groups R51, R52, R53 are independently an alkyl, alkyl ether, trimethylsiloxy group, or a substituted or non-substituted aromatic group and at least one of them has a hydrophilic group attached, preferably to the terminal end of R51, R52, R53, X is O or NR54, where R54 is H or a monovalent alkyl group with 1 to 4 carbons, n is an integer from 1 to 100, R2 and R3 are independently an alkyl, alkyl ether, or a substituted or non-substituted aromatic group, preferred R2 and R3 include methyl, ethyl, and phenyl, L is a divalent linker comprising substituted and unsubstituted alkylene groups having 1-14 carbon atoms, which may be straight or branched, substituted and unsubstituted alkoxy groups having 2-12 carbons, polyethers, oxazolines, and substituted and unsubstituted heterocyclic groups. Suitable substituents include aryl, amine, ether, amide, hydroxyl groups, combinations thereof and the like. In another embodiment, L comprises a straight or branched alkylene group having 2 to 12 carbons. The reactive monomers combine oxygen permeable silicone components with hydrophilic terminal groups capable of reaching to the device-bio-logic interface thus providing bulk and surface characteristics useful in the manufacture of medical devices, particularly ophthalmic devices.
摘要翻译：公开了含有亲水性末端基团的含有有机硅的反应性单体，其可用于制造生物相容性医疗器械，其中R1为H或CH3，a为0或1，p为1至6的整数，q为 1至3，对于q，端基R 51，R 52，R 53独立地为烷基，烷基醚，三甲基甲硅烷氧基或取代或未取代的芳族基团，并且其中至少一个具有连接的亲水基团，优选至 R51，R52，R53，X的末端是O或NR54，其中R54是H或具有1至4个碳的一价烷基，n是1到100的整数，R2和R3独立地是烷基，烷基醚，或取代或未取代的芳族基团，优选的R 2和R 3包括甲基，乙基和苯基，L是包含具有1-14个碳原子的取代和未取代的亚烷基的二价连接基，其可以是直链或支链的，取代的和具有2-12个碳原子的未取代的烷氧基，聚醚，恶唑啉，以及取代和未取代的杂环基。合适的取代基包括芳基，胺，醚，酰胺，羟基，它们的组合等。在另一个实施方案中，L包含具有2至12个碳的直链或支链亚烷基。反应性单体将透氧硅氧烷组分与能够达到器件 - 生物逻辑界面的亲水端基组合，从而提供用于制造医疗装置，特别是眼用装置的体积和表面特性。

10. 发明授权

US06610559B2 Integrated void-free process for assembling a solder bumped chip 有权
标题翻译：用于组装焊料凸块的集成无空隙工艺
公开(公告)号：US06610559B2
公开(公告)日：2003-08-26
申请号：US10014129
申请日：2001-11-16
申请人： Shanger Wang , Wushing Yin , Ning-Cheng Lee
发明人： Shanger Wang , Wushing Yin , Ning-Cheng Lee
IPC分类号： H01L2144
CPC分类号： H01L24/81 , H01L21/563 , H01L24/29 , H01L24/83 , H01L2224/11822 , H01L2224/13111 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81011 , H01L2224/81801 , H01L2224/83102 , H01L2224/83192 , H01L2224/92125 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01049 , H01L2924/01058 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H05K3/3436 , H05K3/3489 , H01L2924/00 , H01L2924/3512
摘要： An integrated void-free process has been developed for attaching a solder bumped chip to a substrate. The chip is first dipped in a tacky thermosettable flux, and the chip is mounted on the substrate. An underfill is dispensed along the edge of the chip The device is then sent into the reflow furnace to complete the underfilling (which optionally can be completed before reflow), solder reflowing and underfill curing. The flux also acts as a physical barrier minimizing, if not eliminating, the interference of filler on solder wetting and resulting metallurgical joints formed between the solder and the bond pads. The process allows for the integration of a void free conventional capillary flow underfilling process and a pre-deposited fluxing underfilling process by using a tacky thermosettable flux, avoiding the problems associated with each of the individual processes and requiring less time for the overall process.
摘要翻译：已经开发了用于将焊料凸起的芯片附着到衬底的集成的无空隙工艺。该芯片首先浸入粘性可热固化的焊剂中，芯片安装在基板上。沿着芯片的边缘分配底部填料。然后将该装置送入回流炉以完成底部填充（其可选地可以在回流之前完成），焊料回流和底部填充固化。焊剂还充当物理屏障，尽可能减少填料对焊料润湿和焊料与焊盘之间形成的冶金接头的干扰。该方法允许通过使用粘性热固性助熔剂将无空隙的常规毛细管流动底部填充工艺和预沉积的助熔底部填充工艺整合，避免与每个单独工艺相关的问题并且需要更少的整个工艺的时间。

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