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1. 发明授权

US06462413B1 LDMOS transistor heatsink package assembly and manufacturing method 失效
标题翻译： LDMOS晶体管散热片封装组装及制造方法
公开(公告)号：US06462413B1
公开(公告)日：2002-10-08
申请号：US09620758
申请日：2000-07-21
申请人： Frank J. Polese , Stuart Weinshanker , Dana R. Graham
发明人： Frank J. Polese , Stuart Weinshanker , Dana R. Graham
IPC分类号： H01L2312
CPC分类号： H01L24/00 , H01L23/047 , H01L23/10 , H01L23/492 , H01L24/37 , H01L24/40 , H01L2224/37599 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/1305 , H01L2924/1306 , H01L2924/15787 , H01L2924/16152 , H01L2924/00 , H01L2224/37099
摘要： A heatsink assembly and method of fabrication and use for high power RF LDMOS transistors such as those used in mobile telephone basestation pre-antenna amplifiers wherein die attachment to the heatsink flange occurs prior to leadframe/spacer-to-flange bonding. Various bonding methods are disclosed which do not compromise the die-to-flange attachment bond. A unique leadframe/spacer/flange heatsink package is also disclosed which automatically properly orients attachment of the leadframe/spacer to the flange, and provides for a thickened spacer. A unique leadframe having contact projections also avoids later wire bonding. A unique leadframe/spacer/lid combination is disclosed which allows in one step the bonding of the leadframe to the flange, electrically contacting the die, and encapsulation.
摘要翻译：用于大功率RF LDMOS晶体管的散热器组件和制造方法，例如在用于移动电话基站前置天线放大器中的那些，其中在引线框/间隔件到法兰接合之前发生与散热器法兰的连接。公开了不损害模 - 法 - 凸缘附接接合的各种粘合方法。还公开了独特的引线框架/间隔件/法兰散热器封装，其自动适当地将引线框架/间隔件附接到凸缘，并提供增厚的间隔件。具有接触突起的独特的引线框架也避免了以后的引线接合。公开了独特的引线框架/间隔件/盖子组合，其允许在一个步骤中将引线框架结合到凸缘，电接触管芯和封装。

2. 发明授权

US5081327A Sealing system for hermetic microchip packages 失效
标题翻译：密封微型包装密封系统
公开(公告)号：US5081327A
公开(公告)日：1992-01-14
申请号：US500693
申请日：1990-03-28
申请人： Dana R. Graham , Kenneth L. Jones, II
发明人： Dana R. Graham , Kenneth L. Jones, II
IPC分类号： H01L23/02 , H01L21/50
CPC分类号： H01L21/50 , Y10T29/49002
摘要： A sealable hermetic microchip package includes a vent therein that permits gas to escape during the sealing operation, but then itself is sealed at the completion of the sealing operation to render the package hermetic. The venting of gas from the interior of the package avoids the buildup of internal pressure during the sealing operation that can introduce bubbles and other faults into the sealing material. The vent may be a channel in the sealing surface of the lid of the package that is initially open, and then fills with the seal material as it flows to effect the seal. The vent may also be a hole in the lid that is sealed by the flow of a bead of the seal material. An equivalent approach to venting provided that the lid be mounted on standoffs that flow during sealing to permit the lid to settle onto the base of the package.
摘要翻译：可密封的密封微芯片封装包括其中允许气体在密封操作期间逸出的通气孔，然后在密封操作完成时将其本身密封以使封装件成为密封的。从封装内部排出气体避免了在密封操作过程中积聚内部压力，从而可能导致气泡和其他故障进入密封材料。排气口可以是初始打开的包装的盖的密封表面中的通道，然后在密封材料流动时填充以实现密封。排气孔也可以是盖子中的孔，该孔由密封材料的珠粒的流动密封。一种等效的通风方法，只要将盖安装在密封期间流动的支座上，以使盖子能够沉降到包装的底部上。

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