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    • 4. 发明申请
    • METHOD AND DEVICE FOR WAFER SCALE PACKAGING OF OPTICAL DEVICES USING A SCRIBE AND BREAK PROCESS
    • 使用筛选和断开过程的光学设备的波长定型包装的方法和装置
    • US20080191221A1
    • 2008-08-14
    • US12029899
    • 2008-02-12
    • Xiao Charles YangDongmin ChenPhilip Chen
    • Xiao Charles YangDongmin ChenPhilip Chen
    • H01L33/00
    • B81C1/00873B81B2201/047H01L24/05H01L33/483H01L2224/04042H01L2224/48463H01L2924/0002H01L2924/14H01L2924/1461H01L2924/00
    • A multilayered integrated optical and circuit device. The device has a first substrate comprising at least one integrated circuit chip thereon, which has a cell region and a peripheral region. Preferably, the peripheral region has a bonding pad region, which has one or more bonding pads and an antistiction region surrounding each of the one or more bonding pads. The device has a second substrate with at least one or more deflection devices thereon coupled to the first substrate. At least one or more bonding pads are exposed on the first substrate. The device has a transparent member overlying the second substrate while forming a cavity region to allow the one or more deflection devices to move within a portion of the cavity region to form a sandwich structure including at least a portion of the first substrate, a portion of the second substrate, and a portion of the transparent member. The one or more bonding pads and the antistiction region are exposed while the one or more deflection devices is maintained within the portion of the cavity region.
    • 一种多层集成光电路装置。 该器件具有包括其上的至少一个集成电路芯片的第一衬底,其具有单元区域和外围区域。 优选地,外围区域具有接合焊盘区域,其具有一个或多个接合焊盘和围绕一个或多个接合焊盘的每一个的抗静电区域。 该装置具有第二基板,其上具有至少一个或多个偏转装置,其上连接到第一基板。 至少一个或多个接合焊盘暴露在第一衬底上。 该装置具有覆盖第二基板的透明构件,同时形成空腔区域以允许一个或多个偏转装置在空腔区域的一部分内移动以形成夹层结构,该夹层结构包括第一基板的至少一部分, 第二基板和透明部件的一部分。 一个或多个接合焊盘和抗静电区域被暴露,同时一个或多个偏转装置保持在空腔区域的部分内。