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    • 3. 发明授权
    • Cleaving process to fabricate multilayered substrates using low implantation doses
    • 使用低植入剂量制造多层底物的切割过程
    • US07378330B2
    • 2008-05-27
    • US11392452
    • 2006-03-28
    • Francois J. HenleyMichael A. BryanWilliam G. En
    • Francois J. HenleyMichael A. BryanWilliam G. En
    • H01L21/76H01L21/4763H01L29/00H01L23/44
    • H01L21/76251H01L21/26506H01L21/76254
    • A method of forming substrates, e.g., silicon on insulator, silicon on silicon. The method includes providing a donor substrate, e.g., silicon wafer. The method also includes forming a cleave layer on the donor substrate that contains the cleave plane, the plane of eventual separation. In a specific embodiment, the cleave layer comprising silicon germanium. The method also includes forming a device layer (e.g., epitaxial silicon) on the cleave layer. The method also includes introducing particles into the cleave layer to add stress in the cleave layer. The particles within the cleave layer are then redistributed to form a high concentration region of the particles in the vicinity of the cleave plane, where the redistribution of the particles is carried out in a manner substantially free from microbubble or microcavity formation of the particles in the cleave plane. That is, the particles are generally at a low dose, which is defined herein as a lack of microbubble or microcavity formation in the cleave plane. The method also includes providing selected energy to the donor substrate to cleave the device layer from the cleave layer at the cleave plane, whereupon the selected energy is applied to create a controlled cleaving action to remove the device layer from a portion of the cleave layer in a controlled manner.
    • 一种形成衬底的方法,例如绝缘体上的硅,硅上的硅。 该方法包括提供施主衬底,例如硅晶片。 该方法还包括在供体基底上形成含有切割平面的切割层,最终分离的平面。 在具体实施方案中,包含硅锗的切割层。 该方法还包括在切割层上形成器件层(例如外延硅)。 该方法还包括将颗粒引入裂解层以在切割层中增加应力。 然后将切割层内的颗粒重新分布以形成在解理面附近的颗粒的高浓度区域,其中颗粒的再分布以基本上不含微孔中的微泡或微腔形成的方式进行 劈平面 也就是说,颗粒通常为低剂量,其在本文中定义为在解理面中缺乏微泡或微腔形成。 该方法还包括向施主衬底提供所选择的能量以在解理面从裂解层切割器件层,由此施加所选择的能量以产生受控的切割作用,以将器件层从切割层的一部分去除 受控的方式。
    • 5. 发明授权
    • Technique for determining defect positions in three dimensions in a
transparent structure
    • 用于在透明结构中确定三维缺陷位置的技术
    • US5790247A
    • 1998-08-04
    • US721332
    • 1996-09-26
    • Francois J. HenleyMichael A. Bryan
    • Francois J. HenleyMichael A. Bryan
    • G01N21/958G01M11/00G01N21/88G01N21/17
    • G01N21/8806G01N21/958
    • A method (500) for inspecting anomalies, which are likely defects of several types, namely, particles on the surface, scratches into surface, and defects in bulk material, is provided. This inspection method involves two types of illumination, which can be used separately or together. These two types highlight anomalies sufficiently differently to enable the defect monitoring tool to distinguish between defect type and defect location along an inspection axis. The illumination methods are direct internal side illumination (114) where the plate is used as light pipe, and external front-side illumination (117). In direct internal side illumination, a fiber optic feed (115) with flared end arranged as a line source is abutted to an edge (123) of the plate (102). In external side illumination, the source is light directed at an acute angle, preferably a grazing angle, to one of the surfaces (121). Anomalies such as dust particles on the illuminated surface will scatter light much more efficiently with external front-side illumination, than direct internal side lighting, since particles on the surface would otherwise scatter light only through weak evanescent coupling via the internal side lighting.
    • 提供了用于检查异常的方法(500),其可能是几种类型的缺陷,即表面上的颗粒,划痕到表面和散装材料中的缺陷。 这种检查方法涉及两种类型的照明,可单独使用或一起使用。 这两种类型强调异常,使缺陷监测工具能够区分沿着检查轴的缺陷类型和缺陷位置。 照明方法是直接内侧照明(114),其中板用作光管和外部前侧照明(117)。 在直接内侧照明中,具有布置成线源的喇叭口端的光纤馈电(115)与板(102)的边缘(123)邻接。 在外侧照明中,光源以锐角(优选为掠角)指向一个表面(121)。 由于表面上的颗粒会通过内侧照明通过弱的渐逝耦合使表面上的颗粒散射光,所以像照明表面上的灰尘颗粒那样的异常将会比外部前侧照明更有效地散射光。
    • 6. 发明授权
    • Optical materials with selected index-of-refraction
    • 具有折射率折射率的光学材料
    • US07437047B2
    • 2008-10-14
    • US11796798
    • 2007-04-30
    • Michael A. BryanNobuyuki Kambe
    • Michael A. BryanNobuyuki Kambe
    • G02B6/10H01L21/00
    • G02B6/13G02B6/124G02B6/125Y10T428/25
    • Photosensitive optical materials are used for establishing more versatile approaches for optical device formation. In some embodiments, unpatterned light is used to shift the index-of-refraction of planar optical structures to shift the index-of-refraction of the photosensitive material to a desired value. This approach can be effective to produce cladding material with a selected index-of-refraction. In additional embodiments gradients in index-of-refraction are formed using photosensitive materials. In further embodiments, the photosensitive materials are patterned within the planar optical structure. Irradiation of the photosensitive material can selectively shift the index-of-refraction of the patterned photosensitive material. By patterning the light used to irradiate the patterned photosensitive material, different optical devices can be selectively activated within the optical structure.
    • 光敏光学材料用于建立用于光学器件形成的更通用的方法。 在一些实施例中,使用未图案的光来移动平面光学结构的折射率以将感光材料的折射率移动到期望值。 这种方法可以有效地生产具有选定的折射率的包层材料。 在另外的实施例中,使用光敏材料形成折射率折射率。 在另外的实施例中,感光材料在平面光学结构内图案化。 感光材料的照射可以选择性地移动图案化感光材料的折射率。 通过图案化用于照射图案化感光材料的光,可以在光学结构内选择性地激活不同的光学器件。
    • 7. 发明授权
    • Optical materials with selected index-of-refraction
    • 具有折射率折射率的光学材料
    • US07224882B2
    • 2007-05-29
    • US10620176
    • 2003-07-15
    • Michael A. BryanNobuyuki Kambe
    • Michael A. BryanNobuyuki Kambe
    • G02B6/00H01L21/00
    • G02B6/13G02B6/124G02B6/125Y10T428/25
    • Photosensitive optical materials are used for establishing more versatile approaches for optical device formation. In some embodiments, unpatterned light is used to shift the index-of-refraction of planar optical structures to shift the index-of-refraction of the photosensitive material to a desired value. This approach can be effective to produce cladding material with a selected index-of-refraction. In additional embodiments gradients in index-of-refraction are formed using, photosensitive materials. In further embodiments, the photosensitive materials are patterned within the planar optical structure. Irradiation of the photosensitive material can selectively shift the index-of-refraction of the patterned photosensitive material. By patterning the light used to irradiate the patterned photosensitive material, different optical devices can be selectively activated within the optical structure.
    • 光敏光学材料用于建立用于光学器件形成的更通用的方法。 在一些实施例中,使用未图案的光来移动平面光学结构的折射率以将感光材料的折射率移动到期望值。 这种方法可以有效地生产具有选定的折射率的包层材料。 在另外的实施例中,使用感光材料形成折射率折射率。 在另外的实施例中,感光材料在平面光学结构内图案化。 感光材料的照射可以选择性地移动图案化感光材料的折射率。 通过图案化用于照射图案化感光材料的光,可以在光学结构内选择性地激活不同的光学器件。
    • 8. 发明授权
    • Modulator manufacturing process and device
    • 调制器制造工艺及装置
    • US06211991B1
    • 2001-04-03
    • US09098192
    • 1998-06-16
    • Michael A. Bryan
    • Michael A. Bryan
    • G02F103
    • G02F1/1341G02F1/0305G02F1/061G02F1/133365G02F1/1334
    • An improved method and resulting device 10 for fabricating an electro-optical modulator material. The technique includes providing a substrate 509, which has a top surface. A first layer of electrode material 501 is defined overlying the top surface. The method also includes applying a transfer sheet 400, having an electro-optical material 405, to the first layer of electrode material 501, where the electro-optical material is affixed to the first layer of electrode material. A step of removing (e.g., peeling) 801 the transfer sheet from the electro-optical material is included. The removing step leaves a substantial portion of the electro-optical modulator material intact and affixed to the first layer of electrode material. This method generally uses less steps and provides a higher quality element than pre-existing techniques.
    • 一种用于制造电光调制器材料的改进方法和所得装置10。 该技术包括提供具有顶表面的基底509。 电极材料501的第一层被限定在顶表面上。 该方法还包括将具有电光材料405的转印片400施加到电极材料501的第一层上,其中电光材料固定在第一层电极材料上。 包括从电光材料去除(例如剥离)801转印片的步骤。 去除步骤使电光调制器材料的大部分完好无损地固定在第一层电极材料上。 该方法通常使用较少的步骤,并提供比先前存在的技术更高质量的元素。