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1. 发明授权

US08867217B2 Tear-proof circuit 有权
标题翻译：防撕裂电路
公开(公告)号：US08867217B2
公开(公告)日：2014-10-21
申请号：US12696829
申请日：2010-01-29
申请人： Francis Steffen , Gilbert Assaud
发明人： Francis Steffen , Gilbert Assaud
IPC分类号： H05K1/00 , B41J2/175 , G06K19/073 , G06K19/077
CPC分类号： H05K1/028 , B41J2/1753 , B41J2/17546 , B41J2/17559 , G06K19/0739 , G06K19/07798 , H05K1/0283 , H05K1/0313 , H05K1/118 , H05K1/181 , H05K3/20 , H05K3/30 , H05K2201/10007 , Y10T29/49128 , Y10T29/4913
摘要： A circuit including a flexible substrate and at least one electric element attached to the substrate, the substrate including at least one cavity arranged near the electric element and helping to break or distort the electric element in response to a flexion or stretching of the substrate. Application in particular is to the manufacture of tear-proof electronic micromodules.
摘要翻译：一种电路，包括柔性基板和至少一个附着到基板的电气元件，所述基板包括布置在所述电气元件附近的至少一个空腔，并且有助于响应于所述基板的弯曲或拉伸来破坏或变形所述电气元件。尤其适用于制造防撕裂电子微型模块。

2. 发明申请

US20100194645A1 TEAR-PROOF CIRCUIT 有权
标题翻译：防伪电路
公开(公告)号：US20100194645A1
公开(公告)日：2010-08-05
申请号：US12696829
申请日：2010-01-29
申请人： Francis Steffen , Gilbert Assaud
发明人： Francis Steffen , Gilbert Assaud
IPC分类号： H05K1/00 , H01Q9/04 , H05K3/30
CPC分类号： H05K1/028 , B41J2/1753 , B41J2/17546 , B41J2/17559 , G06K19/0739 , G06K19/07798 , H05K1/0283 , H05K1/0313 , H05K1/118 , H05K1/181 , H05K3/20 , H05K3/30 , H05K2201/10007 , Y10T29/49128 , Y10T29/4913
摘要： A circuit including a flexible substrate and at least one electric element attached to the substrate, the substrate including at least one cavity arranged near the electric element and helping to break or distort the electric element in response to a flexion or stretching of the substrate. Application in particular is to the manufacture of tear-proof electronic micromodules.
摘要翻译：一种电路，包括柔性基板和至少一个附着到基板的电气元件，所述基板包括布置在所述电气元件附近的至少一个空腔，并且有助于响应于所述基板的弯曲或拉伸来破坏或变形所述电气元件。尤其适用于制造防撕裂电子微型模块。

3. 发明申请

US20060270110A1 Method for connecting a semiconductor chip onto an interconnection support 审中-公开
标题翻译：将半导体芯片连接到互连支架上的方法
公开(公告)号：US20060270110A1
公开(公告)日：2006-11-30
申请号：US11431135
申请日：2006-05-09
申请人： Francis Steffen
发明人： Francis Steffen
IPC分类号： H01L21/58
CPC分类号： H01L24/81 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/10253 , H01L2924/12036 , H01L2924/14 , H01L2924/19042 , H01L2924/00
摘要： A method electrically connects a semiconductor chip, having contact pads, with an interconnection support, having a substrate and reception pads. The method comprises a step of growing a first metal layer on the contact pads of the chip and a step of growing a second metal layer on the reception pads of the interconnection support, by metal electrodeposition, until the first and the second metal layers meet and form an electrical contact linking the contact pads of the chip and the reception pads of the interconnection support. The method can be applied to the manufacture of electronic cards and electronic modules.
摘要翻译：一种将具有接触焊盘的半导体芯片与具有衬底和接收焊盘的互连支架电连接的方法。该方法包括在芯片的接触焊盘上生长第一金属层的步骤和通过金属电沉积在互连支架的接收焊盘上生长第二金属层直到第一和第二金属层相交的步骤，以及形成连接芯片的接触焊盘和互连支撑件的接收垫的电触点。该方法可应用于电子卡和电子模块的制造。

4. 发明授权

US5041395A Method of encapsulating an integrated circuit using a punched metal grid attached to a perforated dielectric strip 失效
标题翻译：使用连接到穿孔介质条的穿孔金属网格来封装集成电路的方法
公开(公告)号：US5041395A
公开(公告)日：1991-08-20
申请号：US504961
申请日：1990-04-05
申请人： Francis Steffen
发明人： Francis Steffen
IPC分类号： B42D15/10 , G06K19/077 , H01L21/56 , H01L21/60 , H01L23/24 , H01L23/498 , H01L23/50 , H01L23/60
CPC分类号： H01L23/24 , H01L23/49855 , H01L23/60 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48245 , H01L2224/48247 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01057 , H01L2924/01058 , H01L2924/01079 , H01L2924/14 , H01L2924/181 , Y10T29/49121
摘要： The disclosure concerns the encapsulation of integrated circuit chips, notably with a view to their being incorporated in a chip card. The encapsulation method comprises the formation of a pre-punched metallic conductive grid, the formation of a strip of pre-perforated plastic material, the transfer of a strip to the grid, the positioning of an integrated circuit chip in a perforation of the strip, and the formation of electrical connections between the chip and zones of the grid located in perforations of the strip. The perforations of the strip and the punched slots of the grid are arranged so that the strip covers and blocks all the interstices between conductors of the grid in the useful region corresponding to a module to be made. When a protecting resin is laid, it is confined and does not leak through the interstices of the grid. A plastic or metal ring defines the heightwise dimension of the micromodule.
摘要翻译：本公开涉及集成电路芯片的封装，特别是考虑到它们被并入芯片卡。封装方法包括形成预先冲压的金属导电栅格，形成预穿孔塑料材料条，将带材转移到栅格，将集成电路芯片定位在条带的穿孔中，以及在所述芯片和位于所述带的穿孔中的所述网格的区域之间形成电连接。带材的穿孔和网格的冲孔被布置成使得带材覆盖并阻挡在与要制造的模块相对应的有用区域中的格栅的导体之间的所有间隙。当保护树脂铺设时，它被限制并且不会通过电网的间隙泄漏。塑料或金属环限定微型组件的高度尺寸。

5. 发明授权

US5898216A Micromodule with protection barriers and a method for manufacturing the same 失效
标题翻译：具有保护屏障的微型模块及其制造方法
公开(公告)号：US5898216A
公开(公告)日：1999-04-27
申请号：US897352
申请日：1997-07-21
申请人： Francis Steffen
发明人： Francis Steffen
IPC分类号： G06K19/077 , H01L21/56 , H01L23/495 , H01L23/498 , H01L23/02
CPC分类号： G06K19/07747 , G06K19/07743 , H01L21/565 , H01L23/49551 , H01L23/49855 , H01L2224/48091 , H01L2224/48247 , H01L24/48 , H01L2924/00014 , H01L2924/01079 , H01L2924/14 , H01L2924/181
摘要： A method for the manufacture of a micromodule with surface flush connector, the metallic regions of the connector being formed on a support grid, comprises the formation of protection barriers between the regions of the connector so as to form a closed contour demarcating a molding zone around the chip, outside a standardized space reserved for the physical connections between the connector of the micromodule and an external system, to make a molding of thermohardening or thermoplastic material around the chip in this demarcated molding zone.
摘要翻译：一种用于制造具有表面齐平连接器的微型模块的方法，连接器的金属区域形成在支撑格栅上，包括在连接器的区域之间形成保护屏障，以形成围绕模制区域的闭合轮廓该芯片在保留用于微型组件的连接器与外部系统之间的物理连接的标准化空间之外，以在该分界模制区域内的芯片周围形成热硬化或热塑性材料。

6. 发明授权

US5574270A Chip card system provided with an offset electronic circuit 失效
标题翻译：芯片卡系统配有偏移电子电路
公开(公告)号：US5574270A
公开(公告)日：1996-11-12
申请号：US74989
申请日：1993-06-10
申请人： Francis Steffen
发明人： Francis Steffen
IPC分类号： G06K7/00 , H05K1/14 , H05K7/02
CPC分类号： G06K7/0008 , H05K1/14
摘要： A chip card system provided with an offset portable electronic circuit includes a module that integrates one or more electronic components, a reader 4 of this module, an intermediate means 3 directly linked with the reader 4 and a conveyance means 2 to provide for the transmission of information between the module 1 and the intermediate means 3, and vice versa. The intermediate means is a chip card that enables access to standard readers. The module can be used to set up a complex application without any problem as regards available surface areas. Moreover, the reliability obtained is that of the mounting of electronic components. It is far greater than that obtained in the technology of mounting a chip in a chip card.
摘要翻译：提供有偏移便携式电子电路的芯片卡系统包括集成一个或多个电子部件的模块，该模块的读取器4，与读取器4直接连接的中间装置3和输送装置2，模块1和中间装置3之间的信息，反之亦然。中间装置是能够访问标准读卡器的芯片卡。该模块可用于设置复杂的应用程序，而无需关于可用表面积的任何问题。此外，获得的可靠性是电子部件的安装的可靠性。它远远大于在芯片卡中安装芯片的技术中获得的结果。

7. 发明授权

US5147982A Encapsulation of electronic modules 失效
标题翻译：电子模块的封装
公开(公告)号：US5147982A
公开(公告)日：1992-09-15
申请号：US683071
申请日：1991-04-10
申请人： Francis Steffen
发明人： Francis Steffen
IPC分类号： B42D15/10 , G06K19/077 , H01L21/56 , H01L21/60 , H01L23/24 , H01L23/498 , H01L23/50 , H01L23/60
CPC分类号： H01L23/24 , H01L23/49855 , H01L23/60 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48245 , H01L2224/48247 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01057 , H01L2924/01058 , H01L2924/01079 , H01L2924/14 , H01L2924/181 , Y10T29/49121
摘要： The disclosure concerns the encapsulation of integrated circuit chips, notably with a view to their being incorporated in a chip card. The encapsulation method comprises the formation of a pre-punched metallic conductive grid, the formation of a strip of pre-perforated plastic material, the transfer of a strip to the grid, the positioning of an integrated circuit chip in a perforation of the strip, and the formation of electrical connections between the chip and zones of the grid located in perforations of the strip. The perforations of the strip and the punched slots of the grid are arranged so that the strip covers and blocks all the interstices between conductors of the grid in the useful region corresponding to a module to be made. When a protecting resin is laid, it is confined and does not leak through the interstices of the grid. A plastic or metal ring defines the heightwise dimension of the micromodule.

8. 发明授权

US6071758A Process for manufacturing a chip card micromodule with protection barriers 失效
标题翻译：具有保护屏障的芯片卡微型模块的制造工艺
公开(公告)号：US6071758A
公开(公告)日：2000-06-06
申请号：US748343
申请日：1996-11-13
申请人： Francis Steffen
发明人： Francis Steffen
IPC分类号： G06K19/077 , H01L21/56 , H01L23/495 , H01L23/498 , H01L21/50 , B29C13/00
CPC分类号： G06K19/07747 , G06K19/07743 , H01L21/565 , H01L23/49551 , H01L23/49855 , H01L2224/48091 , H01L2224/48247 , H01L24/48 , H01L2924/00014 , H01L2924/01079 , H01L2924/14 , H01L2924/181
摘要： A method for the manufacture of a micromodule with surface flush connector, the metallic regions of the connector being formed on a support grid, comprises the formation of protection barriers between the regions of the connector so as to form a closed contour demarcating a molding zone around the chip, outside a standardized space reserved for the physical connections between the connector of the micromodule and an external system, to make a molding of thermohardening or thermoplastic material around the chip in this demarcated molding zone.
摘要翻译：一种用于制造具有表面齐平连接器的微型模块的方法，连接器的金属区域形成在支撑格栅上，包括在连接器的区域之间形成保护屏障，以形成围绕模制区域的闭合轮廓该芯片在保留用于微型组件的连接器与外部系统之间的物理连接的标准化空间之外，以在该分界模制区域内的芯片周围形成热硬化或热塑性材料。

9. 发明申请

US20060261456A1 Micromodule, particularly for chip card 审中-公开
标题翻译： Micromodule，特别是芯片卡
公开(公告)号：US20060261456A1
公开(公告)日：2006-11-23
申请号：US11431149
申请日：2006-05-09
申请人： Francis Steffen
发明人： Francis Steffen
IPC分类号： H01L23/02
CPC分类号： G06K19/07747 , G06K19/077 , G06K19/07745 , G06K19/07749 , G06K19/07752 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/16 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48472 , H01L2924/00014 , H01L2924/01046 , H01L2924/01079 , H01L2924/01322 , H01L2924/10253 , H01L2924/14 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An electronic micromodule, particularly for smart card, comprises an electrically insulating substrate, at least one conductive sheet in an electrically conductive material, which rear face is attached to a front face of the substrate, and a semi-conductor chip. The substrate comprises an opening forming a window of access to the rear face of the conductive sheet, the chip is arranged within the opening and is fixed onto the rear face of the conductive sheet, and at least one contact of the chip is electrically connected to the rear face of the conductive sheet by means of an electrically conductive connecting material. The electronic micromodule may embody chip cards, electronic badges and electronic tags.
摘要翻译：一种特别用于智能卡的电子微型模块包括电绝缘衬底，导电材料中的至少一个导电片，该后表面附着在衬底的正面，以及半导体芯片。基板包括形成进入导电片的后表面的窗口的开口，芯片布置在开口内并且被固定到导电片的背面上，并且芯片的至少一个触点电连接到导电片的背面通过导电连接材料。电子微型模块可以包括芯片卡，电子徽章和电子标签。

10. 发明授权

US06259022B1 Chip card micromodule as a surface-mount device 有权
标题翻译：芯片卡微型模块作为表面贴装器件
公开(公告)号：US06259022B1
公开(公告)日：2001-07-10
申请号：US09174755
申请日：1998-10-19
申请人： Francis Steffen
发明人： Francis Steffen
IPC分类号： H01L23043
CPC分类号： H05K3/3436 , G06K19/07745 , H01L23/24 , H01L23/3121 , H01L23/49855 , H01L24/48 , H01L24/97 , H01L2224/48091 , H01L2224/97 , H01L2924/00014 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01058 , H01L2924/01063 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/01094 , H01L2924/12041 , H01L2924/14 , H01L2924/181 , H05K3/3426 , H05K2201/10818 , H05K2201/2081 , Y02P70/613 , H01L2224/85 , H01L2224/45099 , H01L2924/00012
摘要： A micromodule is used as a surface-mounted package on a substrate of interconnections. In one embodiment of the invention, barriers to the expansion of solder are formed between contact zones of the micromodule and corresponding contact pads of the substrate. A mechanical stopping device is planned to keep the thickness of the interface of solder. In another embodiment of the invention, contact zones are extended by tongues. A cambering operation enables the formation of the surface-mounting pins.
摘要翻译：微型组件用作互连衬底上的表面安装封装。在本发明的一个实施例中，在微型组件的接触区域和衬底的相应接触焊盘之间形成焊料膨胀的障碍。计划一种机械停止装置来保持焊料界面的厚度。在本发明的另一个实施例中，接触区域用舌头延伸。弯曲操作使得能够形成表面安装销。

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