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1. 发明申请

US20090016020A1 HEAT-DISSIPATING MODULE AND ELECTRONIC APPARATUS 失效
标题翻译：散热模块和电子设备
公开(公告)号：US20090016020A1
公开(公告)日：2009-01-15
申请号：US11850500
申请日：2007-09-05
申请人： Feng-Ku Wang , Yi-Lun Cheng , Chun-Lung Lin , Chih-Kai Yang , Cheng-Shi Liu
发明人： Feng-Ku Wang , Yi-Lun Cheng , Chun-Lung Lin , Chih-Kai Yang , Cheng-Shi Liu
IPC分类号： H05K7/20
CPC分类号： G06F1/203
摘要： A heat-dissipating module suitable for dissipating heat generated by a heat-generating element is provided. The heat-dissipating module includes a first heat-conducting plate, a first heat-dissipating tube, and a fan. The first heat-conducting plate is thermally coupled to the heat-generating element. The first heat-dissipating tube has a first opening and a second opening opposite to the first opening. The first heat-conducting plate is connected to the first heat-dissipating tube and located at an outside of the first heat-dissipating tube. The fan is disposed adjacent to the first opening and corresponding to first opening. The fan is adapted for generating an air current flowing in the first heat-dissipating tube. The heat-dissipating module can transfer the heat generated by the heat-generating element during operation to an external environment.
摘要翻译：提供了一种适用于散热由发热元件产生的热量的散热模块。散热模块包括第一导热板，第一散热管和风扇。第一导热板热耦合到发热元件。第一散热管具有与第一开口相对的第一开口和第二开口。第一导热板与第一散热管连接，位于第一散热管的外侧。风扇与第一开口相邻并且对应于第一开口。风扇适于产生在第一散热管中流动的气流。散热模块可以在运行期间将由发热元件产生的热量传递到外部环境。

2. 发明授权

US07558062B2 Heat-dissipating module and electronic apparatus 失效
标题翻译：散热模块和电子设备
公开(公告)号：US07558062B2
公开(公告)日：2009-07-07
申请号：US11850500
申请日：2007-09-05
申请人： Feng-Ku Wang , Yi-Lun Cheng , Chun-Lung Lin , Chih-Kai Yang , Cheng-Shi Liu
发明人： Feng-Ku Wang , Yi-Lun Cheng , Chun-Lung Lin , Chih-Kai Yang , Cheng-Shi Liu
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： G06F1/203
摘要： A heat-dissipating module suitable for dissipating heat generated by a heat-generating element is provided. The heat-dissipating module includes a first heat-conducting plate, a first heat-dissipating tube, and a fan. The first heat-conducting plate is thermally coupled to the heat-generating element. The first heat-dissipating tube has a first opening and a second opening opposite to the first opening. The first heat-conducting plate is connected to the first heat-dissipating tube and located at an outside of the first heat-dissipating tube. The fan is disposed adjacent to the first opening and corresponding to first opening. The fan is adapted for generating an air current flowing in the first heat-dissipating tube. The heat-dissipating module can transfer the heat generated by the heat-generating element during operation to an external environment.
摘要翻译：提供了一种适用于散热由发热元件产生的热量的散热模块。散热模块包括第一导热板，第一散热管和风扇。第一导热板热耦合到发热元件。第一散热管具有与第一开口相对的第一开口和第二开口。第一导热板与第一散热管连接，位于第一散热管的外侧。风扇与第一开口相邻并且对应于第一开口。风扇适于产生在第一散热管中流动的气流。散热模块可以在运行期间将由发热元件产生的热量传递到外部环境。

3. 发明授权

US07589969B2 Folding protective cover for heat-conductive medium 失效
标题翻译：导热介质折叠保护罩
公开(公告)号：US07589969B2
公开(公告)日：2009-09-15
申请号：US11401875
申请日：2006-04-12
申请人： Feng-Ku Wang , Yi-Lun Cheng , Chun-Yi Chang , Jui-Chan Fan , Chun-Lung Lin , Chih-Kai Yang
发明人： Feng-Ku Wang , Yi-Lun Cheng , Chun-Yi Chang , Jui-Chan Fan , Chun-Lung Lin , Chih-Kai Yang
IPC分类号： H05K7/20
CPC分类号： H01L23/34 , H01L2924/0002 , Y10T428/13 , Y10T428/24215 , Y10T428/24273 , Y10T428/28 , H01L2924/00
摘要： A folding protective cover structure is used to cover and protect a heat-conductive medium disposed on the bottom surface of a heat sink device. An unfoldable plate body is employed and has a hollow portion, a folding portion, and an adhesive area; wherein the hollow portion is used for surrounding the heat-conductive medium with a frame-fixing plate extending from its edge, which is folded towards an opposite direction of the heat-conductive medium, so as to keep an upright state; the folding portion is folded towards the hollow portion, so that the frame-fixing plate passes through the folding portion to clip and fix the folding portion, thus forming an accommodating space for protecting the heat-conductive medium; and the adhesive area is located at the edge of the hollow portion, facing the surface of the heat sink device, for adhering and securing the plate body to the heat sink device.
摘要翻译：折叠保护盖结构用于覆盖和保护设置在散热装置的底表面上的导热介质。使用可展开的板体，并具有中空部分，折叠部分和粘合区域; 其中所述中空部分用于围绕所述导热介质，其具有从其边缘延伸的框架固定板，所述框架固定板朝向所述导热介质的相反方向折叠，以保持直立状态; 折叠部分朝向中空部分折叠，使得框架固定板穿过折叠部分以夹紧和固定折叠部分，从而形成用于保护导热介质的容纳空间; 并且粘合剂区域位于中空部分的面对散热装置的表面的边缘，用于将板体粘附并固定到散热装置。

4. 发明申请

US20070235177A1 Heat conducting medium protection device 审中-公开
标题翻译：导热介质保护装置
公开(公告)号：US20070235177A1
公开(公告)日：2007-10-11
申请号：US11399454
申请日：2006-04-07
申请人： Feng-Ku Wang , Yi-Lun Cheng , Jui-Chan Fan , Chun-Yi Chang , Chun-Lung Lin , Chih-Kai Yang
发明人： Feng-Ku Wang , Yi-Lun Cheng , Jui-Chan Fan , Chun-Yi Chang , Chun-Lung Lin , Chih-Kai Yang
IPC分类号： H05K7/20
CPC分类号： H01L23/42 , F28F2265/00 , H01L2924/0002 , H01L2924/00
摘要： A heat conducting medium protection device is provided. At least one cutout is formed in a sheet, and the sheet is bent to closely engage the cutouts so as to transform the sheet into a three-dimensional shape and form an accommodating space. When the heat conducting medium protection device is covered on a heat sink coated with a heat conducting medium, the accommodating space accommodates the heat conducting medium for holding the heat conducting medium, thereby making it easy to transmit the heat sink coated with a heat conducting medium.
摘要翻译：提供导热介质保护装置。至少一个切口形成在片材中，并且片材被弯曲以紧密地接合切口，以便将片材变形为三维形状并形成容纳空间。当导热介质保护装置覆盖在涂有导热介质的散热片上时，容纳空间容纳用于保持导热介质的导热介质，从而容易地传输涂有导热介质的散热片。

5. 发明授权

US07436673B2 Heat sink fixing assembly 有权
标题翻译：散热片固定组件
公开(公告)号：US07436673B2
公开(公告)日：2008-10-14
申请号：US11606001
申请日：2006-11-30
申请人： Feng-Ku Wang , Yi-Lun Cheng , Jui-Chan Fan , Chun-Yi Chang , Chun-Lung Lin , Chih-Kai Yang
发明人： Feng-Ku Wang , Yi-Lun Cheng , Jui-Chan Fan , Chun-Yi Chang , Chun-Lung Lin , Chih-Kai Yang
IPC分类号： H05K7/20 , F28F7/00 , H01L23/34
CPC分类号： G06F1/20 , H01L23/4006 , H01L23/427 , H01L2023/4056 , H01L2023/4062 , H01L2023/4081 , H01L2924/0002 , H01L2924/00
摘要： A fixing structure of heat conduction pad is used to uniformly press two heat conduction pads on the two heat generating electronic components on a circuit board respectively. The fixing structure includes a fixing member and an elastic member. The two ends of the elastic member are a fastening portion and a fixing portion respectively. The middle part of the elastic member is a pressing portion. In addition, a suspension arm is extended from the fixing portion. When the fastening portion is to be fasten on the circuit board and the fixing portion is to be fixed on the circuit board by the fixing member, the pressing portion presses one of the heat conduction pad on one of the heat generating electronic component, and the suspension arm presses the other heat conduction pad on the other heat generating electronic component.
摘要翻译：热传导垫的固定结构分别用于均匀地按压电路板上的两个发热电子元件上的两个导热垫。固定结构包括固定构件和弹性构件。弹性构件的两端分别是紧固部和固定部。弹性构件的中部是按压部。此外，悬架臂从固定部分延伸。当紧固部分紧固在电路板上并且固定部分通过固定部件固定在电路板上时，按压部分按压发热电子部件之一的导热焊盘中的一个，悬挂臂按压另一个发热电子部件上的另一个导热垫。

6. 发明申请

US20070243345A1 Folding protective cover for heat-conductive medium 失效
标题翻译：导热介质折叠保护罩
公开(公告)号：US20070243345A1
公开(公告)日：2007-10-18
申请号：US11401875
申请日：2006-04-12
申请人： Feng-Ku Wang , Yi-Lun Cheng , Chun-Yi Chang , Jui-Chan Fan , Chun-Lung Lin , Chih-Kai Yang
发明人： Feng-Ku Wang , Yi-Lun Cheng , Chun-Yi Chang , Jui-Chan Fan , Chun-Lung Lin , Chih-Kai Yang
IPC分类号： B32B3/04 , B31B45/00 , B32B7/12 , B32B3/10
CPC分类号： H01L23/34 , H01L2924/0002 , Y10T428/13 , Y10T428/24215 , Y10T428/24273 , Y10T428/28 , H01L2924/00
摘要： A folding protective cover structure is used to cover and protect a heat-conductive medium disposed on the bottom surface of a heat sink device. An unfoldable plate body is employed and has a hollow portion, a folding portion, and an adhesive area; wherein the hollow portion is used for surrounding the heat-conductive medium with a frame-fixing plate extending from its edge, which is folded towards an opposite direction of the heat-conductive medium, so as to keep an upright state; the folding portion is folded towards the hollow portion, so that the frame-fixing plate passes through the folding portion to clip and fix the folding portion, thus forming an accommodating space for protecting the heat-conductive medium; and the adhesive area is located at the edge of the hollow portion, facing the surface of the heat sink device, for adhering and securing the plate body to the heat sink device.
摘要翻译：折叠保护盖结构用于覆盖和保护设置在散热装置的底表面上的导热介质。使用可展开的板体，并具有中空部分，折叠部分和粘合区域; 其中所述中空部分用于围绕所述导热介质，其具有从其边缘延伸的框架固定板，所述框架固定板朝向所述导热介质的相反方向折叠，以保持直立状态; 折叠部分朝向中空部分折叠，使得框架固定板穿过折叠部分以夹紧和固定折叠部分，从而形成用于保护导热介质的容纳空间; 并且粘合剂区域位于中空部分的面对散热装置的表面的边缘，用于将板体粘附并固定到散热装置。

7. 发明申请

US20080130240A1 Fixing structure of heat conduction pad 有权
标题翻译：导热垫固定结构
公开(公告)号：US20080130240A1
公开(公告)日：2008-06-05
申请号：US11606001
申请日：2006-11-30
申请人： Feng-Ku Wang , Yi-Lun Cheng , Jui-Chan Fan , Chun-Yi Chang , Chun-Lung Lin , Chih-Kai Yang
发明人： Feng-Ku Wang , Yi-Lun Cheng , Jui-Chan Fan , Chun-Yi Chang , Chun-Lung Lin , Chih-Kai Yang
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , H01L23/4006 , H01L23/427 , H01L2023/4056 , H01L2023/4062 , H01L2023/4081 , H01L2924/0002 , H01L2924/00
摘要： A fixing structure of heat conduction pad is used to uniformly press two heat conduction pads on the two heat generating electronic components on a circuit board respectively. The fixing structure includes a fixing member and an elastic member. The two ends of the elastic member are a fastening portion and a fixing portion respectively. The middle part of the elastic member is a pressing portion. In addition, a suspension arm is extended from the fixing portion. When the fastening portion is to be fasten on the circuit board and the fixing portion is to be fixed on the circuit board by the fixing member, the pressing portion presses one of the heat conduction pad on one of the heat generating electronic component, and the suspension arm presses the other heat conduction pad on the other heat generating electronic component.
摘要翻译：热传导垫的固定结构分别用于均匀地按压电路板上的两个发热电子元件上的两个导热垫。固定结构包括固定构件和弹性构件。弹性构件的两端分别是紧固部和固定部。弹性构件的中部是按压部。此外，悬架臂从固定部分延伸。当紧固部分紧固在电路板上并且固定部分通过固定部件固定在电路板上时，按压部分按压发热电子部件之一的导热焊盘中的一个，悬挂臂按压另一个发热电子部件上的另一个导热垫。

8. 发明申请

US20070137565A1 Automatic coating device 失效
标题翻译：自动涂装装置
公开(公告)号：US20070137565A1
公开(公告)日：2007-06-21
申请号：US11639162
申请日：2006-12-15
申请人： Yi-Lun Cheng , Feng-Ku Wang , Chun-Lung Lin , Chih-Kai Yang
发明人： Yi-Lun Cheng , Feng-Ku Wang , Chun-Lung Lin , Chih-Kai Yang
IPC分类号： B05C5/00 , B05C11/11 , B05B13/02
CPC分类号： B05C5/0216 , B05C5/022 , B05C5/0254 , B05C11/028
摘要： An automatic coating device uses a driving motor and a conveyer to form a cyclically rotating module. An injector filled with a coating material is disposed on one side of the conveyer. When an object to be coated is disposed on the other side of the moving conveyer, the coating material is then applied onto the object by the injector. This can increase the coating speed and quality.
摘要翻译：自动涂布装置使用驱动电机和输送机来形成循环旋转模块。填充有涂料的注射器设置在输送机的一侧。当待涂覆的物体设置在移动输送机的另一侧时，涂料随后通过喷射器施加到物体上。这可以提高涂层的速度和质量。

9. 发明授权

US07757627B2 Automatic coating device 失效
标题翻译：自动涂装装置
公开(公告)号：US07757627B2
公开(公告)日：2010-07-20
申请号：US11639162
申请日：2006-12-15
申请人： Yi-Lun Cheng , Feng-Ku Wang , Chun-Lung Lin , Chih-Kai Yang
发明人： Yi-Lun Cheng , Feng-Ku Wang , Chun-Lung Lin , Chih-Kai Yang
IPC分类号： B05C17/06
CPC分类号： B05C5/0216 , B05C5/022 , B05C5/0254 , B05C11/028
摘要： An automatic coating device uses a driving motor and a conveyer to form a cyclically rotating module. An injector filled with a coating material is disposed on one side of the conveyer. When an object to be coated is disposed on the other side of the moving conveyer, the coating material is then applied onto the object by the injector. This can increase the coating speed and quality.
摘要翻译：自动涂布装置使用驱动电机和输送机来形成循环旋转模块。填充有涂料的注射器设置在输送机的一侧。当待涂覆的物体设置在移动输送机的另一侧时，涂料随后通过喷射器施加到物体上。这可以提高涂层的速度和质量。

10. 发明申请

US20070242436A1 Heat sink module for dissipating heat from a heat source on a motherboard 有权
标题翻译：散热模块，用于从主板上的热源散热
公开(公告)号：US20070242436A1
公开(公告)日：2007-10-18
申请号：US11403948
申请日：2006-04-14
申请人： Yi-Lun Cheng , Chun-Lung Lin , Feng-Ku Wang
发明人： Yi-Lun Cheng , Chun-Lung Lin , Feng-Ku Wang
IPC分类号： H05K7/20
CPC分类号： G06F1/203 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat sink module includes a fan set and a heat sink plate. The fan set is integrated as a whole, reducing manufacture time, and the material of the fan set is plastic, thus reducing the weight as well. Due to the hook design of the fan set and the ear design of the heat sink plate, the number of screws is reduced. Furthermore, the screws pass through the first lug of the heat sink plate and the second lug of the fan set, so that the heat sink plate and the fan set are fixed on the motherboard, and thereby the number of the parts to be fixed by screws is reduced. Heat from the heat source on the motherboard is conducted to the fan set to be dispersed through the heat sink plate extending to the heat source and covering the fan set.
摘要翻译：散热器模块包括风扇组和散热板。风扇组整体整合，减少制造时间，风扇组的材质为塑料，减轻重量。由于风扇组的钩设计和散热板的耳设计，螺丝数量减少。此外，螺丝穿过散热板的第一凸耳和风扇组的第二凸耳，使得散热板和风扇组固定在主板上，由此固定的部件的数量由螺丝减少。将来自主板上的热源的热量传导到风扇组，通过延伸到热源的散热板分散并覆盖风扇组。

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