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1. 发明授权

US07773224B2 Spectrum verification imaging system and method 有权
标题翻译：频谱验证成像系统及方法
公开(公告)号：US07773224B2
公开(公告)日：2010-08-10
申请号：US11863424
申请日：2007-09-28
申请人： Fan He , Shumin Cheng , Michael Frenzer , Bin Jiang , Vahid Goudarzi
发明人： Fan He , Shumin Cheng , Michael Frenzer , Bin Jiang , Vahid Goudarzi
IPC分类号： G01J3/51
CPC分类号： G01J1/124 , G01J2003/466
摘要： A system (200) and method (800) for determining whether a sample object (203) has a color that is within a predetermined range is provided. The system (200) includes a light source (201) capable of projecting lights having different light wavelength spectrum upon the sample object (203). A controller (222) causes the light source (201) to project a first light wavelength spectrum upon the sample object (203), then another, then another, and so forth. While each light is projecting upon the object, a monochromatic image capture device (202) captures an image having luminous intensity information. The luminous intensity information, or a subset thereof selected by an image selection tool (232) is then compared to the statistical range, which is derived from a plurality of images taken of a reference object (403).
摘要翻译：提供了一种用于确定样本对象（203）是否具有在预定范围内的颜色的系统（200）和方法（800）。系统（200）包括能够将具有不同光波长光谱的光投射到样本物体（203）上的光源（201）。控制器（222）使得光源（201）将样品（203）上的第一光波长谱投影到另一个，另一个则另一个等等。当每个光投射在物体上时，单色图像捕获装置（202）捕获具有发光强度信息的图像。然后将由图像选择工具（232）选择的发光强度信息或其子集与从参考对象（403）拍摄的多个图像导出的统计范围进行比较。

2. 发明申请

US20090086192A1 Spectrum Verification Imaging System and Method 有权
标题翻译：频谱验证成像系统和方法
公开(公告)号：US20090086192A1
公开(公告)日：2009-04-02
申请号：US11863424
申请日：2007-09-28
申请人： Fan He , Shumin Cheng , Michael Frenzer , Bin Jiang , Vahid Goudarzi
发明人： Fan He , Shumin Cheng , Michael Frenzer , Bin Jiang , Vahid Goudarzi
IPC分类号： G01N21/00 , G01J3/46 , G01N21/25
CPC分类号： G01J1/124 , G01J2003/466
摘要： A system (200) and method (800) for determining whether a sample object (203) has a color that is within a predetermined range is provided. The system (200) includes a light source (201) capable of projecting lights having different light wavelength spectrum upon the sample object (203). A controller (222) causes the light source (201) to project a first light wavelength spectrum upon the sample object (203), then another, then another, and so forth. While each light is projecting upon the object, a monochromatic image capture device (202) captures an image having luminous intensity information. The luminous intensity information, or a subset thereof selected by an image selection tool (232) is then compared to the statistical range, which is derived from a plurality of images taken of a reference object (403).
摘要翻译：提供了一种用于确定样本对象（203）是否具有在预定范围内的颜色的系统（200）和方法（800）。系统（200）包括能够将具有不同光波长光谱的光投射到样本物体（203）上的光源（201）。控制器（222）使得光源（201）将样品（203）上的第一光波长谱投影到另一个，另一个则另一个等等。当每个光投射在物体上时，单色图像捕获装置（202）捕获具有发光强度信息的图像。然后将由图像选择工具（232）选择的发光强度信息或其子集与从参考对象（403）拍摄的多个图像导出的统计范围进行比较。

3. 发明授权

US07413110B2 Method for reducing stress between substrates of differing materials 有权
标题翻译：减少不同材料的基材之间应力的方法
公开(公告)号：US07413110B2
公开(公告)日：2008-08-19
申请号：US11059596
申请日：2005-02-16
申请人： Vahid Goudarzi , Julio A. Abdala , Gulten Goudarzi
发明人： Vahid Goudarzi , Julio A. Abdala , Gulten Goudarzi
IPC分类号： B23K31/02
CPC分类号： H05K3/3436 , B23K1/0016 , B23K1/008 , B23K1/203 , B23K2101/42 , H05K3/3463 , H05K3/3484 , H05K2201/068 , H05K2203/043 , H05K2203/0485 , Y02P70/613
摘要： A method (80) of reducing stress between substrates of differing materials includes the steps of applying (82) solder (16) on a first substrate (14), reflowing (84) the solder on the first substrate to form a cladded substrate (30), applying (85) a medium such as flux or solder on a second substrate (42) having a substantially different coefficient of thermal expansion than the first substrate, placing (86) the cladded substrate on the second substrate, and reflowing (88) the cladded substrate and the second substrate such that thermal stress caused by the substantially different coefficient of thermal expansion between the first and second substrates is limited to when a temperature approximately reaches below a solidus temperature of the solder on the first substrate.
摘要翻译：减少不同材料的衬底之间的应力的方法（80）包括以下步骤：在第一衬底（14）上施加（82）焊料（16），在第一衬底上回流（84）焊料以形成包覆衬底（30）将具有基本上不同于第一基板的热膨胀系数的第二基板（42）施加（85）诸如焊剂或焊料的介质，将包覆的基板放置在第二基板上，并且回流（88）包覆基板和第二基板使得由第一和第二基板之间的基本上不同的热膨胀系数引起的热应力被限制在当温度近似低于第一基板上的焊料的固相线温度时。

4. 发明申请

US20070023203A1 Method and system for customized radio frequency shielding using solder bumps 审中-公开
标题翻译：使用焊料凸点定制射频屏蔽的方法和系统
公开(公告)号：US20070023203A1
公开(公告)日：2007-02-01
申请号：US11189250
申请日：2005-07-26
申请人： Gustavo Leizerovich , Vahid Goudarzi
发明人： Gustavo Leizerovich , Vahid Goudarzi
IPC分类号： H05K9/00
CPC分类号： H05K9/0022 , H01L23/552 , H01L23/66 , H01L24/48 , H01L25/105 , H01L2224/136 , H01L2224/48091 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/3025 , H05K1/0218 , H05K1/144 , H05K3/3436 , H05K2201/09354 , H05K2201/09972 , H01L2924/014 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An RF shield arrangement (30) includes a first substrate (12) having a first or top ground plane (41), a second substrate (22) having a second or bottom ground plane (42), and a plurality of solder bumped areas (14) coupled between the top ground plane and the bottom ground plane forming at least one radio frequency shielded compartment. The top and bottom ground planes can be placed on or within the respective substrate so long as they serve to form the RF shielding in accordance with the embodiments herein.
摘要翻译： RF屏蔽装置（30）包括具有第一或顶部接地平面（41）的第一衬底（12），具有第二或底部接地平面（42）的第二衬底（22）和多个焊料凸起区域 14），其耦合在顶部接地平面和底部接地平面之间，形成至少一个射频屏蔽隔间。顶部和底部接地平面可以放置在相应基板上或内部，只要它们用于形成根据本文实施例的RF屏蔽层。

5. 发明授权

US07167375B2 Populated printed wiring board and method of manufacture 有权
标题翻译：填充印刷线路板及其制造方法
公开(公告)号：US07167375B2
公开(公告)日：2007-01-23
申请号：US10758822
申请日：2004-01-16
申请人： Vahid Goudarzi
发明人： Vahid Goudarzi
IPC分类号： H05K7/16 , B23P19/00
CPC分类号： H05K3/341 , H05K3/282 , H05K3/3463 , H05K3/3484 , H05K2201/10189 , H05K2201/10371 , H05K2201/10674 , Y02P70/613 , Y10T29/5313
摘要： A populated printed wiring board (PWB) (100) and method of manufacturing the populated PWB are taught. The populated PWB is manufactured by fabricating a PWB (102, 402) with exposed copper pads (302), coating the copper pads with an organic solderability preservative (OSP) (404), depositing a solder paste that includes lead-free solder on the OSP covered copper pads (406), placing components (408) and heating the PWB above a liquidous temperature of the lead-free solder in an air atmosphere (410). The process allows very close spacing of components and component leads while forming reliable solder joints to components that are mechanically stressed and components that have non-negligible planarity or coplanarity tolerances.
摘要翻译：教导了一种填充印刷电路板（PWB）（100）和制造该PWB的方法。通过用暴露的铜焊盘（302）制造PWB（102,402），用有机可焊性防腐剂（OSP）（404）涂覆铜焊盘来制造填充的PWB，将包含无铅焊料的焊膏沉积在 OSP覆盖的铜焊盘（406），放置部件（408）并将PWB加热到空气气氛中的无铅焊料的液态温度（410）。该过程允许部件和部件引线的非常紧密的间隔，同时对机械应力的部件形成可靠的焊点，并且具有不可忽视的平面度或共面性公差的部件。

6. 发明申请

US20080111786A1 MIXED-MODE ENCAPSULATED ELECTROPHORETIC DISPLAY FOR ELECTRONIC DEVICE 有权
标题翻译：用于电子设备的混合模式封装电泳显示器
公开(公告)号：US20080111786A1
公开(公告)日：2008-05-15
申请号：US11672091
申请日：2007-02-07
申请人： Vahid Goudarzi
发明人： Vahid Goudarzi
IPC分类号： G09G3/34 , H01J9/26
CPC分类号： G02F1/167 , G02F2001/133391 , H04M1/0266
摘要： A substrate (104) has a region of conductor segments (110) and a matrix display driver (106) mounted on it. The matrix display driver is used for creating pixilated images or symbols, while the conductor segments are used for turning on or off iconic elements. An encapsulated electrophoretic display laminate (108) is mounted over both the matrix display driver and the region of conductor segments to form the mixed mode display.
摘要翻译：衬底（104）具有安装在其上的导体段（110）和阵列显示驱动器（106）的区域。矩阵显示驱动器用于创建像素化图像或符号，而导体段用于打开或关闭图标元素。封装的电泳显示层压板（108）安装在矩阵显示驱动器和导体段的区域上以形成混合模式显示。

7. 发明申请

US20050212102A1 Method for attaching shields on substrates 有权
标题翻译：在屏幕上安装屏蔽的方法
公开(公告)号：US20050212102A1
公开(公告)日：2005-09-29
申请号：US10806644
申请日：2004-03-23
申请人： Vahid Goudarzi
发明人： Vahid Goudarzi
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50 , H01L21/60 , H01L23/495 , H01L23/498 , H01L23/552 , H05K3/34
CPC分类号： H01L23/552 , H01L21/4817 , H01L21/50 , H01L23/49811 , H01L24/81 , H01L2224/16 , H01L2224/81801 , H01L2924/01033 , H01L2924/014 , H01L2924/16152 , H01L2924/166 , H01L2924/19041 , H01L2924/19105 , H01L2924/3025 , H05K3/341 , H05K3/3484 , H05K3/3489 , H05K2201/10371 , H05K2203/043 , H05K2203/0485 , H05K2203/1476 , Y02P70/613
摘要： A method (100) of attaching a shield (52 or 82) to a substrate (40) can include the steps of circumscribing a predetermined area on the substrate with a metallized trace pattern (26), applying (101) solder to the metallized trace pattern, and optionally placing (103) components (22 and 27) on portions of the metallized trace pattern. The method can further include the steps of reflowing (104) the solder to form a selective cladded trace pattern (32 or 62) on a portion of the metallized trace pattern reserved for the shield, placing (108) the shield on the cladded trace pattern, and reflowing (109) the substrate.
摘要翻译：将屏蔽（52或82）附接到基板（40）的方法（100）可以包括以金属化迹线图案（26）围绕基板上的预定区域的步骤，将（101）焊料施加到金属化迹线并且可选地将（103）部件（22和27）放置在金属化迹线图案的部分上。该方法还可以包括以下步骤：回流（104）焊料以在为屏蔽保留的金属化迹线图案的一部分上形成选择性包覆的迹线图案（32或62），将屏蔽物（108）放置在包覆的迹线图案并回流（109）基板。

8. 发明申请

US20050157476A1 Populated printed wiring board and method of manufacture 有权
标题翻译：填充印刷线路板及其制造方法
公开(公告)号：US20050157476A1
公开(公告)日：2005-07-21
申请号：US10758822
申请日：2004-01-16
申请人： Vahid Goudarzi
发明人： Vahid Goudarzi
IPC分类号： H05K3/28 , H05K3/34 , H05K7/06
CPC分类号： H05K3/341 , H05K3/282 , H05K3/3463 , H05K3/3484 , H05K2201/10189 , H05K2201/10371 , H05K2201/10674 , Y02P70/613 , Y10T29/5313
摘要： A populated printed wiring board (PWB) (100) and method of manufacturing the populated PWB are taught. The populated PWB is manufactured by fabricating a PWB (102, 402) with exposed copper pads (302), coating the copper pads with an organic solderability preservative (OSP) (404), depositing a solder paste that includes lead-free solder on the OSP covered copper pads (406), placing components (408) and heating the PWB above a liquidous temperature of the lead-free solder in an air atmosphere (410). The process allows very close spacing of components and component leads while forming reliable solder joints to components that are mechanically stressed and components that have non-negligible planarity or coplanarity tolerances.
摘要翻译：教导了一种填充印刷电路板（PWB）（100）和制造该PWB的方法。通过用暴露的铜焊盘（302）制造PWB（102,402），用有机可焊性防腐剂（OSP）（404）涂覆铜焊盘来制造填充的PWB，将包含无铅焊料的焊膏沉积在 OSP覆盖的铜焊盘（406），放置部件（408）并将PWB加热到空气气氛中的无铅焊料的液态温度（410）。该过程允许部件和部件引线的非常紧密的间隔，同时对机械应力的部件形成可靠的焊点，并且具有不可忽视的平面度或共面性公差的部件。

9. 发明授权

US07903083B2 Mixed-mode encapsulated electrophoretic display for electronic device 有权
标题翻译：电子设备的混合模式封装电泳显示器
公开(公告)号：US07903083B2
公开(公告)日：2011-03-08
申请号：US11672091
申请日：2007-02-07
申请人： Vahid Goudarzi
发明人： Vahid Goudarzi
IPC分类号： G09G3/34
CPC分类号： G02F1/167 , G02F2001/133391 , H04M1/0266
摘要： A substrate (104) has a region of conductor segments (110) and a matrix display driver (106) mounted on it. The matrix display driver is used for creating pixilated images or symbols, while the conductor segments are used for turning on or off iconic elements. An encapsulated electrophoretic display laminate (108) is mounted over both the matrix display driver and the region of conductor segments to form the mixed mode display.
摘要翻译：衬底（104）具有安装在其上的导体段（110）和阵列显示驱动器（106）的区域。矩阵显示驱动器用于创建像素化图像或符号，而导体段用于打开或关闭图标元素。封装的电泳显示层压板（108）安装在矩阵显示驱动器和导体段的区域上以形成混合模式显示。

10. 发明授权

US07132745B2 Method for attaching shields on substrates 有权
标题翻译：在屏幕上安装屏蔽的方法
公开(公告)号：US07132745B2
公开(公告)日：2006-11-07
申请号：US10806644
申请日：2004-03-23
申请人： Vahid Goudarzi
发明人： Vahid Goudarzi
IPC分类号： H01L23/10
CPC分类号： H01L23/552 , H01L21/4817 , H01L21/50 , H01L23/49811 , H01L24/81 , H01L2224/16 , H01L2224/81801 , H01L2924/01033 , H01L2924/014 , H01L2924/16152 , H01L2924/166 , H01L2924/19041 , H01L2924/19105 , H01L2924/3025 , H05K3/341 , H05K3/3484 , H05K3/3489 , H05K2201/10371 , H05K2203/043 , H05K2203/0485 , H05K2203/1476 , Y02P70/613
摘要： A method (100) of attaching a shield (52 or 82) to a substrate (40) can include the steps of circumscribing a predetermined area on the substrate with a metallized trace pattern (26), applying (101) solder to the metallized trace pattern, and optionally placing (103) components (22 and 27) on portions of the metallized trace pattern. The method can further include the steps of reflowing (104) the solder to form a selective cladded trace pattern (32 or 62) on a portion of the metallized trace pattern reserved for the shield, placing (108) the shield on the cladded trace pattern, and reflowing (109) the substrate.
摘要翻译：将屏蔽（52或82）附接到基板（40）的方法（100）可以包括以金属化迹线图案（26）围绕基板上的预定区域的步骤，将（101）焊料施加到金属化迹线并且可选地将（103）部件（22和27）放置在金属化迹线图案的部分上。该方法还可以包括以下步骤：回流（104）焊料以在为屏蔽保留的金属化迹线图案的一部分上形成选择性包覆的迹线图案（32或62），将屏蔽物（108）放置在包覆的迹线图案并回流（109）基板。

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