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    • 2. 发明申请
    • IC card and method of operating the same
    • IC卡及其操作方法
    • US20030169574A1
    • 2003-09-11
    • US10361587
    • 2003-02-11
    • FUJITSU LIMITED
    • Kenji MaruyamaMineharu Tsukada
    • H05K007/02H05K007/06H05K007/08H05K007/10
    • G06K19/0716G06K19/0701G06K19/07345G06K19/077G06K19/07703
    • The present invention aims to provide an IC card, requiring no special additional devices, not causing a liquid leakage of an aqueous electrolyte, requiring no battery, and capable of displaying information easily and cheaply by internally generated electric power and remaining the information even after the voltage is stopped applying. An IC card of the present invention has an electric power generator capable of generating electric power by an external stimulus and a display driven by the generated electric power so as to display information. The IC card of the present invention preferably have aspects of that the electric power generator is a piezoelectric transducer, a nonvolatile memory for storing information displayed on the display is provide, the nonvolatile memory is a ferroelectric memory, the display is formed by an electrochromic display device, and the electrochromic display device is an all solid-state electrochromic display device.
    • 本发明的目的在于提供一种IC卡,不需要特殊的附加装置,不会引起电解液的液体泄漏,不需要电池,并且能够通过内部产生的电力容易且廉价地显示信息,并且即使在 电压停止施加。 本发明的IC卡具有能够通过外部刺激产生电力的电力发生器和由所产生的电力驱动的显示器以显示信息。 本发明的IC卡优选地具有发电机是压电换能器的方面,提供用于存储显示在显示器上的信息的非易失性存储器,非易失性存储器是铁电存储器,显示器由电致变色显示器 电致变色显示装置是全固态电致变色显示装置。
    • 4. 发明申请
    • Semiconductor device and method of fabricating the same
    • 半导体装置及其制造方法
    • US20040033672A1
    • 2004-02-19
    • US10635648
    • 2003-08-07
    • FUJITSU LIMITED
    • Osamu MatsuuraKenji Maruyama
    • H01L021/20
    • H01L27/11502H01L27/11507H01L28/56
    • After a MOS transistor is formed on a semiconductor substrate, an Ir film, LT film, PZT film, and IrO2 film are formed in this order on the entire surface. Although the LT film itself is not a ferroelectric film, a ferroelectric film is formed by a stacked film of the LT film and PZT film. In a ferroelectric capacitor having this ferroelectric film, the LT film does not contain Pb, so the alignment can be readily controlled during the film formation. This raises the alignment of the LT film. The crystal structure of the LT film is a perovskite structure similar to that of the PZT film. Since the PZT film is formed on this LT film, the alignment of the LT film is taken over when the PZT film is grown. This raises the alignment of the PZT film.
    • 在半导体衬底上形成MOS晶体管之后,在整个表面上依次形成Ir膜,LT膜,PZT膜和IrO 2膜。 虽然LT膜本身不是铁电体膜,但是由LT膜和PZT膜的叠层膜形成铁电体膜。 在具有这种铁电体膜的铁电电容器中,LT膜不含有Pb,因此可以容易地在成膜时控制取向。 这提高了LT膜的对准。 LT膜的晶体结构是类似于PZT膜的钙钛矿结构。 由于在该LT膜上形成PZT膜,所以当PZT膜生长时,LT膜被取向。 这提高了PZT膜的对准。
    • 5. 发明申请
    • Method of manufacturing a semiconductor device and method of forming a film
    • 制造半导体器件的方法和形成膜的方法
    • US20030171002A1
    • 2003-09-11
    • US10364379
    • 2003-02-12
    • FUJITSU LIMITED
    • Shigeyoshi UmemiyaKenji Maruyama
    • H01L021/31
    • C23C16/54
    • A semiconductor device manufacturing method includes the steps of (a) introducing a first substrate into a first CVD chamber; (b) raising the first substrate temperature to a predetermined value; (c) growing a film on the first substrate by supplying vapor phase material in a material line to the first chamber; (d) introducing a second substrate into a second CVD chamber; (e) raising the second substrate temperature to the predetermined value; and (f) growing a film on the second substrate by supplying the vapor phase material to the second chamber. Steps (c) and (f) supply the vapor phase material selectively to the first and second chambers, respectively. In step (f) after step (c), the chamber to which the vapor phase material is supplied is switched from the first chamber to the second chamber so that the pressure of the vapor phase material in the material line is kept substantially constant.
    • 半导体器件制造方法包括以下步骤:(a)将第一衬底引入第一CVD室; (b)将第一衬底温度升高到预定值; (c)通过将材料线中的气相材料供应到第一室,在第一基板上生长膜; (d)将第二衬底引入第二CVD室; (e)将所述第二基板温度升高到所述预定值; 和(f)通过将气相材料供应到第二室而在第二基板上生长膜。 步骤(c)和(f)分别将气相材料选择性地供应到第一和第二室。 在步骤(f)之后的步骤(f)中,将供应气相材料的室从第一室切换到第二室,使得材料管线中气相材料的压力基本上保持不变。
    • 6. 发明申请
    • Authentication circuit, semiconductor device, process for operating the same, IC card, and process for operating the same
    • 认证电路,半导体器件,操作过程,IC卡及其操作过程
    • US20030146287A1
    • 2003-08-07
    • US10294711
    • 2002-11-15
    • Fujitsu Limited
    • Kenji Maruyama
    • G06K019/06
    • G06K19/07372G06K19/073
    • An authentication circuit containing at least two types of ferroelectrics having different Curie temperatures and properties of retaining charges by residual polarization. An authentication signal stored in one of the ferroelectrics is erased when the ferroelectrics are held in a Curie temperature or more of the one of the ferroelectrics and below a Curie temperature of the ferroelectrics 2. In an authentication circuit, preferably one of the ferroelectrics outputs a primary authentication signal and, when the ferroelectric 2 receives the primary authentication signal, the ferroelectric 2 outputs a secondary authentication signal, and a plurality of ferroelectrics are formed of two or more types of elements and have different element compositions, the two or more elements are selected from Na, K, Ba, Cd, Hf, O, Pb, Zr, Ti, La, Ca, Sr, Tl, Bi, a rare earth element, Nb, Ta, W, Mo, Fe, Co, and Cr.
    • 包含至少两种具有不同居里温度的铁电体和通过残余极化保持电荷的性质的认证电路。 当铁电体保持在一个铁电体的居里温度以上且低于铁电体2的居​​里温度时,存储在铁电体之一中的认证信号被擦除。在认证电路中,优选地,铁电体中的一个输出 初级认证信号,当铁电体2接收到初始认证信号时,铁电体2输出二次认证信号,多个铁电体由两种以上的元件形成,具有不同的元件组成, 选自Na,K,Ba,Cd,Hf,O,Pb,Zr,Ti,La,Ca,Sr,Tl,Bi,稀土元素,Nb,Ta,W,Mo,Fe,Co和Cr。
    • 9. 发明申请
    • Ferroelectric capacitor, process for production thereof and semiconductor device using the same
    • 铁电电容器,其制造方法和使用其的半导体器件
    • US20040135183A1
    • 2004-07-15
    • US10743814
    • 2003-12-24
    • FUJITSU LIMITED
    • Osamu MatsuuraKenji MaruyamaKazuaki Takai
    • H01L029/76
    • H01L27/11502H01L27/11507H01L28/56
    • A ferroelectric capacitor includes a pair of electrodes, and at least one ferroelectric held between the pair of electrodes, in which the ferroelectric includes a first ferroelectric layer having a surface roughness (RMS) determined with an atomic force microscope of 10 nm or more; and a second ferroelectric layer being arranged adjacent to the first ferroelectric layer and having an RMS of 5 nm or less. A process produces such a ferroelectric capacitor by forming a first ferroelectric layer on or above one of a pair of electrodes at a temperature equal to or higher than a crystallization temperature at which the first ferroelectric layer takes on a ferroelectric crystalline structure, and forming a second ferroelectric layer on the first ferroelectric layer at a temperature lower than a crystallization temperature at which the second ferroelectric layer takes on a ferroelectric crystalline structure.
    • 铁电电容器包括一对电极,并且至少一个铁电体保持在该对电极之间,其中铁电体包括由原子力显微镜确定的表面粗糙度(RMS)为10nm以上的第一铁电层; 并且第二铁电层被布置为与第一铁电层相邻并且具有5nm或更小的RMS。 一种工艺通过在等于或高于第一铁电层承受铁电晶体结构的结晶温度的温度下,在一对电极中的一个或其上方形成第一铁电层来制造这种铁电电容器,并且形成第二铁电层 铁电层在第一铁电体层上的温度低于第二铁电层呈铁电晶体结构的结晶温度。