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1. 发明申请

US20190310160A1 TESTING METHOD AND TESTING DEVICE 审中-公开
公开(公告)号：US20190310160A1
公开(公告)日：2019-10-10
申请号：US16361690
申请日：2019-03-22
申请人： FUJITSU COMPONENT LIMITED
发明人： Satoshi MORIYAMA , Osamu Daikuhara
IPC分类号： G01M11/00 , G02B6/30
摘要： A testing method for testing a jointed condition of a first ferrule holding an edge of an optical waveguide and a second ferrule holding an edge of an optical fiber, includes: dipping the first ferrule and the second ferrule that are jointed to each other into coolant so that the optical waveguide and the optical fiber are optically connected; heating the coolant; cooling the coolant after the heating; inputting a light to one of the optical waveguide and the optical fiber after cooling the coolant, and detecting a light output from the other.

2. 发明申请

US20160012996A1 ELECTROMAGNETIC RELAY 审中-公开
公开(公告)号：US20160012996A1
公开(公告)日：2016-01-14
申请号：US14858951
申请日：2015-09-18
申请人： FUJITSU COMPONENT LIMITED
发明人： Satoshi MORIYAMA , Ryuji SASAKI , Katsuyuki TAKAHASHI
IPC分类号： H01H50/56 , H01H50/02
CPC分类号： H01H50/56 , H01H50/02 , H01H50/026 , H01H50/642
摘要： An electromagnetic relay includes a contact including a movable spring having a base end fixed to a bottom of a housing and a tip end provided with a movable contact, and a fixed spring having a base end fixed to the bottom of the housing and a tip end provided with a fixed contact. The movable contact is provided opposite to the fixed contact so as to come in contact with the fixed contact or move away therefrom. The housing has a protrusion protruding toward a side of the fixed contact opposite to a side facing the movable contact.

3. 发明申请

US20150331208A1 OPTICAL MODULE 有权
标题翻译：光学模块
公开(公告)号：US20150331208A1
公开(公告)日：2015-11-19
申请号：US14330159
申请日：2014-07-14
申请人： FUJITSU COMPONENT LIMITED
发明人： Satoshi MORIYAMA , Osamu Daikuhara , Takuya Uchiyama
IPC分类号： G02B6/42
CPC分类号： G02B6/4269 , G02B6/3814 , G02B6/3885 , G02B6/4201 , G02B6/4246 , G02B6/4257 , G02B6/4267 , G02B6/4268 , G02B6/428 , G02B6/4292 , G02B6/4295 , G02B6/4436 , H01L31/0232 , H01S5/022
摘要： An optical module includes a housing including an upper cover and a lower cover, a first circuit board having a wiring pattern for transmitting an electric signal, a second circuit board on which a photonic device is bonded, the photonic device converting the electric signal into light or converting the light into the electric signal, an optical waveguide that is provided on the first circuit board, and guides the light output from the photonic device or the light to be incident on the photonic device, and a first thermal conducting member having plasticity, wherein, the optical waveguide, the second circuit board, and the first thermal conducting member are layered on the first circuit board, a first protrusion formed on the upper cover is adhered to a top surface of the first thermal conducting member, and the first thermal conducting member is adhered to a top surface of the photonic device.
摘要翻译：光学模块包括：壳体，包括上盖和下盖;第一电路板，具有用于传输电信号的布线图案;第二电路板，光子器件接合在其上;光子器件将电信号转换为光或将光转换成电信号，设置在第一电路板上并引导从光子器件输出的光或入射到光子器件上的光的光波导和具有可塑性的第一导热构件，其中，所述光波导，所述第二电路板和所述第一导热构件层叠在所述第一电路板上，形成在所述上盖上的第一突起粘附到所述第一导热构件的顶表面，并且所述第一热导电构件粘附到光子器件的顶表面。

4. 发明申请

US20150023636A1 OPTICAL CONNECTOR 有权
标题翻译：光学连接器
公开(公告)号：US20150023636A1
公开(公告)日：2015-01-22
申请号：US14331919
申请日：2014-07-15
申请人： FUJITSU COMPONENT LIMITED
发明人： Satoshi MORIYAMA , Ayumu AKABANE , Osamu DAIKUHARA
IPC分类号： G02B6/38
CPC分类号： G02B6/428 , G02B6/10 , G02B6/325 , G02B6/3846 , G02B6/3853 , G02B6/3861 , G02B6/3885 , G02B6/4284
摘要： An optical connector has an optical waveguide slit and a pass-through hole. The optical waveguide slit is a hole that extends from an insertion surface of a connector body into the connector body. The optical waveguide slit accommodates a sheet-like optical waveguide whose tip abuts against a slit bottom. The pass-through hole is provided near the slit bottom, and passes through the top surface of the connector body and the top surface of the optical waveguide slit.
摘要翻译：光连接器具有光波导狭缝和通孔。光波导狭缝是从连接器主体的插入表面延伸到连接器主体中的孔。光波导狭缝容纳其尖端与狭缝底部抵接的片状光波导。通孔设置在狭缝底部附近，并且穿过连接器主体的顶表面和光波导狭缝的顶表面。

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