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1. 发明授权

US09857735B1 Endless belt, image forming apparatus, and endless belt unit 有权
公开(公告)号：US09857735B1
公开(公告)日：2018-01-02
申请号：US15346180
申请日：2016-11-08
申请人： FUJI XEROX CO., LTD.
发明人： Wataru Yamada , Tsuyoshi Miyamoto , Tomoya Sasaki , Kana Miyazaki
IPC分类号： G03G15/20 , G03G15/16
CPC分类号： G03G15/162 , G03G15/2057 , G03G2215/1623 , G03G2215/2016 , G03G2215/2032
摘要： An endless belt includes a polyimide resin layer in which a content of at least one solvent selected from a solvent group A consisting of a urea solvent, an alkoxy group-containing amide solvent, and an ester group-containing amide solvent is from 50 ppm to 2,000 ppm.

2. 发明授权

US10526486B2 Resin composition and resin molded article 有权
公开(公告)号：US10526486B2
公开(公告)日：2020-01-07
申请号：US15683874
申请日：2017-08-23
申请人： FUJI XEROX CO., LTD.
发明人： Tsuyoshi Miyamoto , Daisuke Nakayama , Masayuki Okoshi , Hiroyuki Moriya
IPC分类号： C08L77/08 , B32B27/34 , B32B27/32 , C08L77/02
摘要： A resin composition includes a thermoplastic resin, a carbon fiber, a resin containing at least one of an amide bond and an imide bond that includes a first resin containing at least one of an amide bond and an imide bond and having such a melting temperature that a difference in melting temperature between the first resin and the thermoplastic resin is from 0° C. to 90° C. and a second resin containing at least one of an amide bond and an imide bond and having a melting temperature which is higher than that of the thermoplastic resin and that of the first resin, and a compatibilizer.

3. 发明授权

US10442913B2 Resin composition and resin molded article 有权
公开(公告)号：US10442913B2
公开(公告)日：2019-10-15
申请号：US15784490
申请日：2017-10-16
申请人： FUJI XEROX CO., LTD.
发明人： Daisuke Nakayama , Tsuyoshi Miyamoto , Masayuki Okoshi , Hiroyuki Moriya
IPC分类号： C08L77/04 , C08K7/02 , C08K3/04 , C08L23/12 , C08L77/06 , C08G69/08
摘要： A resin composition includes a thermoplastic resin, a carbon fiber, a polyamide having at least one of a carboxy group and an amino group at a terminal thereof, in which a presence ratio of the carboxy group present on the terminal is higher than a presence ratio of the amino group present on the terminal, and a compatibilizer.

4. 发明授权

US10385195B2 Resin composition for resin molding, and resin molding 有权
公开(公告)号：US10385195B2
公开(公告)日：2019-08-20
申请号：US15663994
申请日：2017-07-31
申请人： FUJI XEROX CO., LTD.
发明人： Tsuyoshi Miyamoto , Hiroyuki Moriya , Masayuki Okoshi
IPC分类号： C08J5/04 , C08K7/02 , C08K7/06 , C08L23/06 , C08L23/08 , C08L23/12 , C08L51/06 , C08L77/00
摘要： A resin composition for resin moldings comprises: a first resin composition containing a first polyolefin, a polyamide, carbon fibers having an average fiber length of 0.1 mm to 1 mm and a carboxylic anhydride-modified polyolefin as a compatibilizer; and a second resin composition containing a second polyolefin and organic fibers having an average fiber length of 1 mm to 20 mm, wherein, taking the total contents of the first polyolefin and the second polyolefin as 100 parts by mass, a content of the polyamide accounts for 1 part by mass to 50 parts by mass, a content of the carbon fiber accounts for 1 part by mass to 50 parts by mass, a content of the organic fibers accounts for 1 part by mass to 20 part by mass, and a content of the compatibilizer accounts for 1 part by mass to 10 parts by mass.

5. 发明授权

US10301461B2 Resin composition and resin molded article 有权
公开(公告)号：US10301461B2
公开(公告)日：2019-05-28
申请号：US15641775
申请日：2017-07-05
申请人： FUJI XEROX CO., LTD.
发明人： Tsuyoshi Miyamoto , Daisuke Nakayama , Hiroyuki Moriya , Masayuki Okoshi
IPC分类号： C08L23/12 , C08L77/06 , C08L23/06 , C08L79/08
摘要： Provided is a resin composition including: a thermoplastic resin; a carbon fiber; and a terminal modified resin including a main chain having at least one terminal modified with a long chain alkyl group having 8 or more carbon atoms, the main chain containing at least one of an amide bond and an imide bond.

6. 发明授权

US10597493B2 Polyimide precursor composition and method of preparing polyimide molded article 有权
公开(公告)号：US10597493B2
公开(公告)日：2020-03-24
申请号：US15727264
申请日：2017-10-06
申请人： FUJI XEROX CO., LTD.
发明人： Kana Miyazaki , Tsuyoshi Miyamoto , Tomoya Sasaki
IPC分类号： C08G73/10 , C09D179/08 , B29C41/46 , B29C41/00 , C08K5/17 , B29K79/00
摘要： A polyimide precursor composition includes a solvent including water and a polyimide precursor including a group having a triple bond at a terminal thereof, which is dissolved in the solvent.

7. 发明授权

US10195794B2 Method for producing porous polyimide film, and porous polyimide film 有权
公开(公告)号：US10195794B2
公开(公告)日：2019-02-05
申请号：US15613549
申请日：2017-06-05
申请人： FUJI XEROX CO., LTD.
发明人： Katsumi Nukada , Tsuyoshi Miyamoto , Tomoya Sasaki , Kana Miyazaki
IPC分类号： B29C67/20 , C08J5/18 , C09D179/08 , C08J7/04 , B29C71/02 , B29K105/00 , B29K103/00 , B29L7/00 , B29K79/00
摘要： There is provided a method for producing a porous polyimide film, including a first step of forming a coating film containing a polyimide precursor solution where a polyimide precursor and an organic amine compound are dissolved in an aqueous solvent, and a resin particle incapable of dissolving in the polyimide precursor solution, followed by drying of the coating film to form a coat containing the polyimide precursor and the resin particle, and a second step of heating the coat to imidize the polyimide precursor and form a polyimide film, the second step including a treatment for removing the resin particle.

8. 发明授权

US09562154B1 Resin composition, resin molded article, and method of preparing resin composition 有权
标题翻译：树脂组合物，树脂成形品，树脂组合物的制造方法
公开(公告)号：US09562154B1
公开(公告)日：2017-02-07
申请号：US14996771
申请日：2016-01-15
申请人： FUJI XEROX CO., LTD.
发明人： Masayuki Okoshi , Daisuke Nakayama , Tsuyoshi Miyamoto , Hiroyuki Moriya , Yuko Iwadate
IPC分类号： C08K3/40 , C08L77/00 , C08L79/08 , C08L23/12 , C08L25/00 , C08L27/02 , C08L81/06 , C08L23/26 , C08L59/02 , C08L67/02 , C08L69/00 , C08L23/02 , C08L55/02
CPC分类号： C08L23/12 , C08K3/40 , C08K7/14 , C08L23/02 , C08L23/26 , C08L25/00 , C08L27/02 , C08L51/06 , C08L55/02 , C08L59/02 , C08L67/02 , C08L69/00 , C08L77/00 , C08L77/02 , C08L77/06 , C08L79/08 , C08L81/06 , C08L2205/025 , C08L2205/03 , C08L2205/08 , C08L2207/04
摘要： A resin composition including a thermoplastic resin, a glass fiber, a resin which is different from the thermoplastic resin and contains at least one of an amide bond and an imide bond, and a compatibilizer, wherein a part of the resin which is different from the thermoplastic resin and contains at least one of an amide bond and an imide bond forms a domain having a diameter of from 5 μm to 10 μm in a matrix of the thermoplastic resin.
摘要翻译：包含热塑性树脂，玻璃纤维，不同于热塑性树脂并且含有酰胺键和酰亚胺键中的至少一种的树脂的树脂组合物和增容剂，其中一部分不同于热塑性树脂并且含有酰胺键和酰亚胺键中的至少一种在热塑性树脂的基质中形成直径为5μm至10μm的畴。

9. 发明授权

US09505886B2 Polyimide precursor composition, method for preparing polyimide precursor, polyimide molded article, and method for preparing polyimide molded article 有权
标题翻译：聚酰亚胺前体组合物，聚酰亚胺前体的制备方法，聚酰亚胺模塑制品以及制备聚酰亚胺模制品的方法
公开(公告)号：US09505886B2
公开(公告)日：2016-11-29
申请号：US14607727
申请日：2015-01-28
申请人： FUJI XEROX CO., LTD.
发明人： Tsuyoshi Miyamoto , Kana Miyazaki , Tomoya Sasaki , Katsumi Nukada
IPC分类号： C08G73/10
CPC分类号： C08G73/1071
摘要： A polyimide precursor composition includes a polyimide precursor including a condensation polymer of a tetracarboxylic dianhydride containing a first tetracarboxylic dianhydride having a benzene ring to which two carboxylic anhydride groups are bonded, and a second tetracarboxylic dianhydride other than the first tetracarboxylic dianhydride, and a diamine compound; and a first aqueous solvent containing water and at least one water-soluble organic solvent selected from the group consisting of a water-soluble ether solvent, a water-soluble ketone solvent, and a water-soluble alcohol solvent, or a second aqueous solvent containing a water-soluble alcohol solvent and at least one water-soluble organic solvent selected from the group consisting of a water-soluble ether solvent and a water-soluble ketone solvent, wherein the polyimide precursor is dissolved in the first aqueous solvent or the second aqueous solvent.
摘要翻译：聚酰亚胺前体组合物包括聚酰亚胺前体，其包含四羧酸二酐的缩合物，所述四羧酸二酐包含具有两个羧酸酐基团的苯环的第一四羧酸二酐和除第一四羧酸二酐以外的第二四羧酸二酐，以及二胺化合物 ; 和含有水和至少一种选自水溶性醚溶剂，水溶性酮溶剂和水溶性醇溶剂的水溶性有机溶剂的第一含水溶剂或含有水溶性醇溶剂和至少一种选自水溶性醚溶剂和水溶性酮溶剂的水溶性有机溶剂，其中聚酰亚胺前体溶解在第一水溶剂或第二水溶液溶剂。

10. 发明授权

US10647881B2 Polyimide precursor composition, method of preparing polyimide precursor composition, and method of preparing polyimide molded article 有权
公开(公告)号：US10647881B2
公开(公告)日：2020-05-12
申请号：US15051115
申请日：2016-02-23
申请人： FUJI XEROX CO., LTD.
发明人： Tomoya Sasaki , Tsuyoshi Miyamoto , Kana Miyazaki , Katsumi Nukada
IPC分类号： C09D179/08 , B29C41/00 , B29C41/46 , B29K79/00 , B29K105/00
摘要： A polyimide precursor composition in which a resin and an organic amine compound are dispersed in an aqueous solvent, wherein the aqueous solvent contains 50% by weight or more of water and at least one organic solvent selected from a solvent group A consisting of a urea solvent, an amide solvent containing an alkoxy group, and an amide solvent containing an ester group in an amount of 5% by weight or more with respect to the total amount of the aqueous solvent, and the resin has a repeating unit represented by the following formula (I): wherein A indicates a tetravalent organic group, and B indicates a bivalent organic group.

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