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    • 2. 发明授权
    • Clock signal alignment for system-in-package (SIP) devices
    • 系统级封装(SIP)器件的时钟信号对齐
    • US09372503B1
    • 2016-06-21
    • US14719549
    • 2015-05-22
    • FREESCALE SEMICONDUCTOR, INC.
    • Gary L. MillerJames G. GayGilford E. LubbersGeng Zhong
    • G06F1/12G06F1/10G06F13/16G06F17/50H03K19/177H03K5/135
    • G06F1/12G06F1/10G06F13/1689G06F17/5077H03K5/135H03K19/17736
    • A method embodiment of the present disclosure includes receiving a delay value associated with an interconnect delay that is measured across interconnect circuitry communicatively coupling a host semiconductor device with a semiconductor device. The method also includes delaying a local clock signal by an amount of delay indicated by the delay value to produce a delayed local clock signal. The method also includes receiving a delayed source clock signal, where the delayed source clock signal is received from the host semiconductor device via the interconnect circuitry. The method also includes outputting a master clock signal based on a comparison of the delayed source clock signal and the delayed local clock signal, where the master clock signal is utilized to generate one or more aligned clock signals on the semiconductor device that are aligned with a source clock signal generated on the host semiconductor device.
    • 本公开的方法实施例包括接收与跨主机半导体器件与半导体器件通信耦合的互连电路测量的互连延迟相关联的延迟值。 该方法还包括将本地时钟信号延迟由延迟值指示的延迟量,以产生延迟的本地时钟信号。 该方法还包括接收延迟的源时钟信号,其中经由互连电路从主机半导体器件接收延迟的源时钟信号。 该方法还包括基于延迟的源时钟信号和延迟的本地时钟信号的比较来输出主时钟信号,其中主时钟信号被用于在半导体器件上产生一个或多个对准的时钟信号,该时钟信号与 在主机半导体器件上产生的源时钟信号。