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1. 发明申请

US20160380162A1 Light Emitting Device And Manufacturing Method Thereof 审中-公开
标题翻译：发光装置及其制造方法
公开(公告)号：US20160380162A1
公开(公告)日：2016-12-29
申请号：US15190214
申请日：2016-06-23
申请人： Everlight Electronics Co., Ltd.
发明人： Chih-Min Lin , Tsung-Lin Lu , Jen-Hsiung Lai , Robert Yeh , I-Chun Hung , Wei-Tyng Yu , Kuang-Mao Lu , Ru-Shi Liu
IPC分类号： H01L33/50 , H01L33/62 , H01L33/32 , H01L33/60
CPC分类号： H01L33/504 , H01L33/32 , H01L33/505 , H01L33/60 , H01L33/62 , H01L2224/16245 , H01L2224/48091 , H01L2224/8592 , H01L2924/181 , H01L2933/0033 , H01L2924/00014 , H01L2924/00012
摘要： A light emitting device includes a substrate; an LED chip, disposed on the substrate; and a fluorescent layer. The fluorescent layer is at least partially and conformally coated on the LED chip and the substrate.
摘要翻译：发光装置包括：基板; 设置在基板上的LED芯片; 和荧光层。荧光层至少部分地并保形地涂覆在LED芯片和基板上。

2. 发明申请

US20130334553A1 Light Emitting Diode Package Structure And Manufacturing Method Thereof 有权
标题翻译：发光二极管封装结构及其制造方法
公开(公告)号：US20130334553A1
公开(公告)日：2013-12-19
申请号：US13913833
申请日：2013-06-10
申请人： Everlight Electronics Co., Ltd.
发明人： Robert Yeh , Ke-Hao Pan
IPC分类号： H01L33/50
CPC分类号： H01L33/507 , H01L33/50 , H01L2224/48091 , H01L2933/0041 , H01L2924/00014
摘要： Various examples of a light emitting diode (LED) package structure and a manufacturing method thereof are described. In one aspect, a LED package structure includes a carrier, a LED chip, a first annular barricade, a second annular barricade and a fluorescent encapsulant. The LED chip is electrically connected to the carrier. The first annular barricade and the second annular barricade are disposed around the LED chip, with the second annular barricade disposed between the LED chip and the first annular barricade. The fluorescent encapsulant is disposed on the carrier and at least covers the LED chip and the second annular barricade. The fluorescent encapsulant includes at least a type of phosphor and at least a type of gel with the phosphor distributed over a surface of the LED chip.
摘要翻译：描述了发光二极管（LED）封装结构的各种示例及其制造方法。一方面，LED封装结构包括载体，LED芯片，第一环形路障，第二环形路障和荧光密封剂。 LED芯片电连接到载体。第一环形路障和第二环形路障设置在LED芯片周围，第二环形路障设置在LED芯片和第一环形路障之间。荧光密封剂设置在载体上并且至少覆盖LED芯片和第二环形路障。荧光密封剂包括至少一种类型的荧光体和至少一种类型的凝胶，其中磷光体分布在LED芯片的表面上。

3. 发明授权

US09263647B2 Light emitting diode package structure and manufacturing method thereof 有权
标题翻译：发光二极管封装结构及其制造方法
公开(公告)号：US09263647B2
公开(公告)日：2016-02-16
申请号：US13913833
申请日：2013-06-10
申请人： Everlight Electronics Co., Ltd.
发明人： Robert Yeh , Ke-Hao Pan
IPC分类号： H01L33/50
CPC分类号： H01L33/507 , H01L33/50 , H01L2224/48091 , H01L2933/0041 , H01L2924/00014
摘要： Various examples of a light emitting diode (LED) package structure and a manufacturing method thereof are described. In one aspect, a LED package structure includes a carrier, a LED chip, a first annular barricade, a second annular barricade and a fluorescent encapsulant. The LED chip is electrically connected to the carrier. The first annular barricade and the second annular barricade are disposed around the LED chip, with the second annular barricade disposed between the LED chip and the first annular barricade. The fluorescent encapsulant is disposed on the carrier and at least covers the LED chip and the second annular barricade. The fluorescent encapsulant includes at least a type of phosphor and at least a type of gel with the phosphor distributed over a surface of the LED chip.
摘要翻译：描述了发光二极管（LED）封装结构的各种示例及其制造方法。一方面，LED封装结构包括载体，LED芯片，第一环形路障，第二环形路障和荧光密封剂。 LED芯片电连接到载体。第一环形路障和第二环形路障设置在LED芯片周围，第二环形路障设置在LED芯片和第一环形路障之间。荧光密封剂设置在载体上并且至少覆盖LED芯片和第二环形路障。荧光密封剂包括至少一种类型的荧光体和至少一种类型的凝胶，其中磷光体分布在LED芯片的表面上。

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