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1. 发明申请

US20210313493A1 LIGHT-EMITTING DEVICE 有权
公开(公告)号：US20210313493A1
公开(公告)日：2021-10-07
申请号：US17101050
申请日：2020-11-23
申请人： Everlight Electronics Co., Ltd.
发明人： Hung-Hsiang YEH , Robert YEH , Tsung-Yuan CHEN , Bo-Yu CHEN
IPC分类号： H01L33/50 , H01L25/075 , H01L33/46 , H01L33/58 , H01L33/60 , H01L33/62
摘要： A light-emitting device, including a mount substrate, at least one light emitting element, a first light transparent member, a second light transparent member and a covering member, is disclosed. The at least one light emitting element is disposed on the mount substrate in a flip-chip manner. The first light transparent member is configured to receive the incident light emitting from the light emitting element, wherein the first light transparent member is formed of an inorganic substance and an inorganic phosphor, and includes a top surface and a first side surface contiguous to the top surface. The second light transparent member is disposed on the top surface of the first light transparent member and is formed of the inorganic substance and contains no the inorganic phosphor, and includes an externally exposed light emission surface and a second side surface contiguous to the externally exposed light emission surface. The covering member comprises a light reflective material and covers at least the first side surface of the first light transparent member and at least the second side surface of the second light transparent member.

2. 发明授权

US10352542B2 LED lamp and component, heat dissipating base and LED wireless dimming system thereof 有权
公开(公告)号：US10352542B2
公开(公告)日：2019-07-16
申请号：US15869022
申请日：2018-01-11
申请人： Everlight Electronics Co., Ltd.
发明人： Ming-Chieh Tsai , Hung-Yen Su , Chi-Ming Chen
IPC分类号： F21V23/00 , F21V29/75 , F21V3/00 , F21V29/81 , F21V23/04 , F21V29/71 , F21V29/76 , H05B37/02 , F21Y115/10 , H05B33/08 , F21Y105/10
摘要： An LED lamp and a component, a heat dissipating base and an LED wireless dimming system thereof are provided. The LED lamp component comprises a heat dissipating base, a light emitting module and a lens, the heat dissipating base has a bearing surface and a back surface opposite to the bearing surface, the bearing surface is provided with a first recessed section therein, the back surface is provided with heat dissipating structures; the heat dissipating base further comprises a first joint portion; the light emitting module is disposed in the first recessed section, and the lens covering the light emitting module.

3. 发明申请

US20190044036A1 LED PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME 审中-公开
公开(公告)号：US20190044036A1
公开(公告)日：2019-02-07
申请号：US16054987
申请日：2018-08-03
申请人： EVERLIGHT ELECTRONICS CO., LTD.
发明人： KE-HAO PAN , SHENG-WEI CHOU , YI-SHENG LAN , CHIA-FONG CHOU , CHUNG-CHUAN HSIEH , JEN-HAO PAN , HAO-YU YANG , CHIEH-YU KANG , TZU-LUN TSENG
IPC分类号： H01L33/50 , H01L33/52 , H01L33/36 , G02B5/02
摘要： The present disclosure provides an LED package structure and a method for manufacturing the LED package structure. The LED package structure includes: a chip scale package (CSP) light emitting element and a shading layer, where the CSP light emitting element includes a light emitting chip, and the light emitting chip includes an electrode group located on a bottom surface of the light emitting chip, the shading layer is disposed on a bottom surface and/or a side surface of the CSP light emitting element. An LED package structure according to the present disclosure solves a problem that the blue light leaking from the bottom surface of the LED chip interferes with the emission color of the CSP emitting device, and reduces the luminous efficiency of the emitting device.

4. 发明申请

US20180224105A1 LED LAMP AND COMPONENT, HEAT DISSIPATING BASE AND LED WIRELESS DIMMING SYSTEM THEREOF 审中-公开
公开(公告)号：US20180224105A1
公开(公告)日：2018-08-09
申请号：US15869022
申请日：2018-01-11
申请人： Everlight Electronics Co., Ltd.
发明人： MING-CHIEH TSAI , HUNG-YEN SU , CHI-MING CHEN
IPC分类号： F21V23/00 , F21V29/75 , F21V29/81 , F21V3/00
CPC分类号： F21V23/005 , F21V3/00 , F21V23/0435 , F21V29/713 , F21V29/75 , F21V29/763 , F21V29/81 , F21Y2105/10 , F21Y2115/10 , H05B33/0809 , H05B33/0845 , H05B37/0272
摘要： An LED lamp and a component, a heat dissipating base and an LED wireless dimming system thereof are provided. The LED lamp component comprises a heat dissipating base, a light emitting module and a lens, the heat dissipating base has a bearing surface and a back surface opposite to the bearing surface, the bearing surface is provided with a first recessed section therein, the back surface is provided with heat dissipating structures; the heat dissipating base further comprises a first joint portion; the light emitting module is disposed in the first recessed section, and the lens covering the light emitting module.

5. 发明申请

US20170207375A1 LED Packaging Structure Having Stacked Arrangement Of Protection Element And LED Chip 审中-公开
公开(公告)号：US20170207375A1
公开(公告)日：2017-07-20
申请号：US15475745
申请日：2017-03-31
申请人： Everlight Electronics Co., Ltd.
发明人： Tsung-Lin Lu , Jen-Hsiung Lai , Yu-Ching Fang , Chih-Min Lin , I-Chun Hung
IPC分类号： H01L33/56 , H01L25/16 , H01L33/62 , H01L33/38 , H01L33/50
CPC分类号： H01L33/56 , H01L23/60 , H01L25/167 , H01L33/38 , H01L33/502 , H01L33/507 , H01L33/62 , H01L2224/16245 , H01L2924/0002 , H01L2924/15151 , H01L2924/181 , H01L2933/005 , H01L2924/00012 , H01L2924/00
摘要： A light emitting diode (LED) packaging structure including a metal pad, an electric static discharge (ESD) protection element and an LED chip is provided. The metal pad has a first pad portion having a first top surface with a first concave configured thereon and a second pad portion having a second top surface with a second concave configured thereon. The ESD protection element has two first electrode portions respectively configured in the first concave and the second concave. The LED chip is located above the ESD protection element and has two second electrode portions respectively configured on the first top surface and the second top surface. A frame and a light emitting device having the frame that both include the above LED packaging structure are described herein. A light emitting device having an omni-directional light emitting effect is also described and includes the above LED packaging structure.

6. 发明授权

US09691960B1 Carrier, carrier leadframe, and light emitting device and method for manufacturing same 有权
公开(公告)号：US09691960B1
公开(公告)日：2017-06-27
申请号：US15441582
申请日：2017-02-24
申请人： EVERLIGHT ELECTRONICS CO., LTD.
发明人： Chung-Chuan Hsieh , Yung Chieh Chen
IPC分类号： H01L33/10 , H01L33/62 , H01L33/48 , H01L33/60 , H01L33/38
CPC分类号： H01L33/62 , H01L24/97 , H01L33/38 , H01L33/483 , H01L33/486 , H01L33/56 , H01L33/60 , H01L2933/0016 , H01L2933/0033 , H01L2933/005 , H01L2933/0058 , H01L2933/0066
摘要： A carrier leadframe, including a frame body and a carrier, is provided. The frame body includes at least one supporting portion, and the carrier includes a shell and at least one electrode portion and is mechanically engaged with the frame body via the supporting portion. A method for manufacturing the carrier leadframe as described above, as well as a light emitting device made from the carrier leadframe and a method for manufacturing the device, are also provided. The carrier leadframe has carriers that are separate in advance and mechanically engaged with the frame body, thereby facilitating the quick release of material after encapsulation. Besides, in the carrier leadframe as provided, each carrier is electrically isolated from another carrier, so the electric measurement can be performed before the release of material. Therefore, the speed and yield of production of the light emitting device made from the carrier leadframe is improved.

7. 发明申请

US20160380162A1 Light Emitting Device And Manufacturing Method Thereof 审中-公开
标题翻译：发光装置及其制造方法
公开(公告)号：US20160380162A1
公开(公告)日：2016-12-29
申请号：US15190214
申请日：2016-06-23
申请人： Everlight Electronics Co., Ltd.
发明人： Chih-Min Lin , Tsung-Lin Lu , Jen-Hsiung Lai , Robert Yeh , I-Chun Hung , Wei-Tyng Yu , Kuang-Mao Lu , Ru-Shi Liu
IPC分类号： H01L33/50 , H01L33/62 , H01L33/32 , H01L33/60
CPC分类号： H01L33/504 , H01L33/32 , H01L33/505 , H01L33/60 , H01L33/62 , H01L2224/16245 , H01L2224/48091 , H01L2224/8592 , H01L2924/181 , H01L2933/0033 , H01L2924/00014 , H01L2924/00012
摘要： A light emitting device includes a substrate; an LED chip, disposed on the substrate; and a fluorescent layer. The fluorescent layer is at least partially and conformally coated on the LED chip and the substrate.
摘要翻译：发光装置包括：基板; 设置在基板上的LED芯片; 和荧光层。荧光层至少部分地并保形地涂覆在LED芯片和基板上。

8. 发明授权

US09391251B2 Carrier structure and lighting device 有权
标题翻译：载体结构和照明装置
公开(公告)号：US09391251B2
公开(公告)日：2016-07-12
申请号：US14273933
申请日：2014-05-09
申请人： Everlight Electronics Co., Ltd.
发明人： Yung Chieh Chen , Jung Chiuan Lin
IPC分类号： H01L33/62 , H01L33/48
CPC分类号： H01L33/62 , H01L33/486 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： Various examples of a carrier structure and lighting device are described. A carrier structure configured to carry an LED includes a housing and a lead frame. The housing defines a concavity. The lead frame includes a main board portion having a main board through hole, at least two insertion portions extending from the main board portion into the main board through hole, and two electrode portions configured to be electrically coupled to the LED. The housing is disposed over the at least two insertion portions with the at least two insertion portions inserted into the housing. The concavity of the housing expose the electrode portions. Each of the electrode portions has a respective protrusion sub-portion that extends outside of the housing. Additionally, a lighting device utilizing the carrier structure is also provided.
摘要翻译：描述了载体结构和照明装置的各种示例。构造成携带LED的载体结构包括壳体和引线框架。外壳定义一个凹面。引线框架包括具有主板通孔的主板部分，从主板部分延伸到主板通孔中的至少两个插入部分和被配置为电耦合到LED的两个电极部分。壳体设置在至少两个插入部分上，其中至少两个插入部分插入到壳体中。壳体的凹面暴露电极部分。每个电极部分具有延伸到壳体外部的相应突起子部分。此外，还提供了利用载体结构的照明装置。

9. 发明申请

US20160197062A1 Light-Emitting Device With Multi-Color Temperature And Multi-Loop Configuration 审中-公开
标题翻译：具有多色温度和多回路配置的发光装置
公开(公告)号：US20160197062A1
公开(公告)日：2016-07-07
申请号：US15070329
申请日：2016-03-15
申请人： Everlight Electronics Co., Ltd.
发明人： Chung-kai Chang , Shih-Hua Pan
IPC分类号： H01L25/075 , H01L33/50 , H01L33/62
CPC分类号： H01L25/0753 , H01L33/502 , H01L33/504 , H01L33/505 , H01L33/62 , H01L2224/48137 , H01L2933/0091 , H05B33/14
摘要： A light-emitting device with multi-color temperature and multi-loop configuration is provided. The light-emitting device may include a substrate, multiple light sources disposed on the substrate, a light-emitting unit covering the light sources, a first circuit and a second circuit. Each light source may be configured to emit a respective primary radiation. The light-emitting unit may include multiple loops, each of which covering at least one of the light sources. Each loop may be adjacent to and in contact with at least another loop. A first number of the light sources covered by one or more odd-numbered loops of the loops may be electrically connected to the first circuit. A second number of the light sources covered by one or more even-numbered loops of the loops may be electrically connected to the second circuit.
摘要翻译：提供具有多色温度和多环配置的发光装置。发光装置可以包括基板，设置在基板上的多个光源，覆盖光源的发光单元，第一电路和第二电路。每个光源可以被配置为发射相应的一次辐射。发光单元可以包括多个环，每个环覆盖至少一个光源。每个环可以与至少另一个环相邻并且与其接触。由环路的一个或多个奇数环路覆盖的第一数量的光源可以电连接到第一电路。由环的一个或多个偶数圈环覆盖的第二数量的光源可以电连接到第二电路。

10. 发明授权

US09326350B2 Light-emitting device with multi-color temperature and multi-loop configuration 有权
标题翻译：具有多色温度和多回路配置的发光装置
公开(公告)号：US09326350B2
公开(公告)日：2016-04-26
申请号：US13761550
申请日：2013-02-07
申请人： Everlight Electronics Co., Ltd.
发明人： Chung-kai Chang , Shih-Hua Pan
IPC分类号： H01J1/62 , H01J63/04 , H05B33/14 , H01L25/075 , H01L33/50
CPC分类号： H01L25/0753 , H01L33/502 , H01L33/504 , H01L33/505 , H01L33/62 , H01L2224/48137 , H01L2933/0091 , H05B33/14
摘要： A light-emitting device with multi-color temperature and multi-loop configuration is provided. The light-emitting device comprises a substrate, multiple light sources disposed on the substrate, and a light-emitting unit covering the light sources and at least a portion of the substrate. Each of the light sources is configured to emit a respective primary radiation. The light-emitting unit comprises multiple wavelength conversion components, each of which may include a respective fluorescent material. Each wavelength conversion component emits a respective converted radiation, upon absorbing a portion of the primary radiation from one or more of the light sources, and mixes the respective converted radiation with a portion of the primary radiation from the one or more of the light sources that is not absorbed to form a respective mixed radiation. Each wavelength conversion component is adjacent to, and at least partially contacts, at least another one of the wavelength conversion components.
摘要翻译：提供具有多色温度和多环配置的发光装置。发光装置包括基板，设置在基板上的多个光源和覆盖光源和基板的至少一部分的发光单元。每个光源被配置为发射相应的一次辐射。发光单元包括多个波长转换组件，每个组件可以包括各自的荧光材料。每个波长转换组件在吸收来自一个或多个光源的主要辐射的一部分时发射相应的转换辐射，并且将相应的转换辐射与来自一个或多个光源的一次辐射的一部分混合，不被吸收以形成相应的混合辐射。每个波长转换组件与至少另一个波长转换组件相邻并且至少部分地接触。

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