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1. 发明授权

US06610192B1 Copper electroplating 有权
标题翻译：铜电镀
公开(公告)号：US06610192B1
公开(公告)日：2003-08-26
申请号：US10002281
申请日：2001-11-02
申请人： Eugene N. Step , Robert A. Binstead , Denis Morrissey
发明人： Eugene N. Step , Robert A. Binstead , Denis Morrissey
IPC分类号： C25D338
CPC分类号： C25D3/38 , C25D7/123 , H05K3/423
摘要： Disclosed are compositions and methods for providing a planarized metal layer on a substrate having small apertures. The compositions and methods of the present invention provide complete fill of small apertures with reduced void formation.
摘要翻译：公开了用于在具有小孔的基板上提供平坦化金属层的组合物和方法。本发明的组合物和方法提供具有减小的空隙形成的小孔的完全填充。

2. 发明授权

US06508924B1 Control of breakdown products in electroplating baths 失效
标题翻译：电镀浴中分解产物的控制
公开(公告)号：US06508924B1
公开(公告)日：2003-01-21
申请号：US09584124
申请日：2000-05-31
申请人： Luis A. Gomez , Rozalia Beica , Denis Morrissey , Eugene N. Step
发明人： Luis A. Gomez , Rozalia Beica , Denis Morrissey , Eugene N. Step
IPC分类号： C25D2118
CPC分类号： H01L21/2885 , C25D7/12 , C25D21/12
摘要： Disclosed are methods for analyzing additive breakdown products in electroplating baths as well as methods of controlling the presence of such breakdown products in electroplating baths.
摘要翻译：公开了用于分析电镀浴中的添加剂分解产物的方法以及在电镀浴中控制这种分解产物的存在的方法。

3. 发明授权

US06531046B2 Seed layer repair method 有权
公开(公告)号：US06531046B2
公开(公告)日：2003-03-11
申请号：US09738551
申请日：2000-12-15
申请人： Denis Morrissey , David Merricks , Leon R. Barstad , Eugene N. Step , Jeffrey M. Calvert , Robert A. Schetty, III , James G. Shelnut , Mark Lefebvre , Martin W. Bayes , Donald E. Storjohann
发明人： Denis Morrissey , David Merricks , Leon R. Barstad , Eugene N. Step , Jeffrey M. Calvert , Robert A. Schetty, III , James G. Shelnut , Mark Lefebvre , Martin W. Bayes , Donald E. Storjohann
IPC分类号： C25D534
CPC分类号： C25D3/38 , C25D5/34 , C25D7/123 , H01L21/76861 , H01L21/76868 , H01L21/76873
摘要： Disclosed are methods of repairing metal seed layers prior to subsequent metallization. Such repair methods provide metal seed layers disposed on a substrate that are substantially free of metal oxide and substantially free of discontinuities.

4. 发明授权

US06660153B2 Seed layer repair bath 失效
公开(公告)号：US06660153B2
公开(公告)日：2003-12-09
申请号：US09982398
申请日：2001-10-17
申请人： David Merricks , Denis Morrissey , Martin W. Bayes , Mark Lefebvre , James G. Shelnut , Donald E. Storjohann
发明人： David Merricks , Denis Morrissey , Martin W. Bayes , Mark Lefebvre , James G. Shelnut , Donald E. Storjohann
IPC分类号： C25D502
CPC分类号： H01L21/76868 , C25D3/38 , C25D5/48 , C25D7/123 , H01L21/2885 , H01L21/76874 , H01L2221/1089 , H05K3/244
摘要： Disclosed are methods for repairing seed layers prior to subsequent metallization during the manufacture of electronic devices.

5. 发明授权

US06660154B2 Seed layer 失效
公开(公告)号：US06660154B2
公开(公告)日：2003-12-09
申请号：US09981851
申请日：2001-10-17
申请人： David Merricks , Denis Morrissey , Martin W. Bayes , Mark Lefebvre , James G. Shelnut , Donald E. Storjohann
发明人： David Merricks , Denis Morrissey , Martin W. Bayes , Mark Lefebvre , James G. Shelnut , Donald E. Storjohann
IPC分类号： C23C2800
CPC分类号： H01L21/76843 , C23C18/28 , C25D3/38 , C25D5/54 , C25D7/123 , H01L21/288 , H01L21/2885 , H01L21/76868 , H01L21/76873 , H01L21/76877 , H01L2221/1089
摘要： Disclosed are methods for repairing or enhancing discontinuous metal seed layers prior to subsequent metallization during the manufacture of electronic devices. Such repair methods do not require the use of a second electroplating bath.

6. 发明授权

US06679983B2 Method of electrodepositing copper 有权
标题翻译：电沉积铜的方法
公开(公告)号：US06679983B2
公开(公告)日：2004-01-20
申请号：US09976421
申请日：2001-10-12
申请人： Denis Morrissey , Robert D. Mikkola , Jeffrey M. Calvert
发明人： Denis Morrissey , Robert D. Mikkola , Jeffrey M. Calvert
IPC分类号： C25D712
CPC分类号： C25D3/38 , C25D3/02 , C25D5/48 , C25D7/12
摘要： Disclosed are electrolytes for copper electroplating that provide enhanced fill of small features with less overplate. Also disclosed are methods of plating substrates, such as electronic devices, using such electrolytes.
摘要翻译：公开了用于铜电镀的电解质，其提供具有较少的超板的小特征的增强的填充。还公开了使用这种电解质电镀衬底（例如电子器件）的方法。

7. 发明授权

US09202946B2 Methods for metallizing an aluminum paste 有权
标题翻译：铝膏金属化方法
公开(公告)号：US09202946B2
公开(公告)日：2015-12-01
申请号：US13763117
申请日：2013-02-08
申请人： Richard Bellemare , Denis Morrissey , Anthony Piano
发明人： Richard Bellemare , Denis Morrissey , Anthony Piano
IPC分类号： H01L21/00 , H01L31/0224
CPC分类号： H01L31/022425 , H01L21/4867 , Y02E10/50
摘要： The present technology generally relates to methods for metallizing an aluminum paste comprising contacting the aluminum paste with a cleaner, contacting the aluminum paste with an oxidation inhibiting deposit solution to deposit a layer of an oxidation inhibiting composition onto the aluminum paste and contacting the aluminum paste with conductive metal deposit solution to deposit a layer of a conductive metal onto the aluminum paste. Specifically, the present technology includes methods metallizing an aluminum paste comprising contacting the aluminum paste with an acidic cleaner, contacting the aluminum paste with an acid zincate solution to deposit zinc onto the aluminum paste and contacting the aluminum paste with an electroless nickel deposit solution to coat the aluminum paste with a nickel-phosphorus layer.
摘要翻译：本技术通常涉及用于金属化铝浆的方法，包括使铝浆与清洁剂接触，使铝糊与氧化抑制沉积溶液接触，将一层氧化抑制组合物沉积在铝糊上并使铝糊与导电金属沉积溶液以将一层导电金属沉积到铝浆上。具体地说，本技术包括金属化铝浆的方法，包括使铝浆与酸性清洁剂接触，使铝浆与酸性锌酸盐溶液接触，将锌沉积在铝糊上，并将铝糊与无电镍沉积溶液接触铝浆与镍磷层。

8. 发明申请

US20140227827A1 METHODS FOR METALLIZING AN ALUMINUM PASTE 有权
标题翻译：用于金属化铝的方法
公开(公告)号：US20140227827A1
公开(公告)日：2014-08-14
申请号：US13763117
申请日：2013-02-08
申请人： Richard Bellemare , Denis Morrissey , Anthony Piano
发明人： Richard Bellemare , Denis Morrissey , Anthony Piano
IPC分类号： H01L31/0224
CPC分类号： H01L31/022425 , H01L21/4867 , Y02E10/50
摘要： The present technology generally relates to methods for metallizing an aluminum paste comprising contacting the aluminum paste with a cleaner, contacting the aluminum paste with an oxidation inhibiting deposit solution to deposit a layer of an oxidation inhibiting composition onto the aluminum paste and contacting the aluminum paste with conductive metal deposit solution to deposit a layer of a conductive metal onto the aluminum paste. Specifically, the present technology includes methods metallizing an aluminum paste comprising contacting the aluminum paste with an acidic cleaner, contacting the aluminum paste with an acid zincate solution to deposit zinc onto the aluminum paste and contacting the aluminum paste with an electroless nickel deposit solution to coat the aluminum paste with a nickel-phosphorus layer.
摘要翻译：本技术通常涉及用于金属化铝浆的方法，包括使铝浆与清洁剂接触，使铝糊与氧化抑制沉积溶液接触，将一层氧化抑制组合物沉积在铝糊上并使铝糊与导电金属沉积溶液以将一层导电金属沉积到铝浆上。具体地说，本技术包括金属化铝浆的方法，包括使铝浆与酸性清洁剂接触，使铝浆与酸性锌酸盐溶液接触，将锌沉积在铝糊上，并将铝糊与无电镍沉积溶液接触铝浆与镍磷层。

9. 发明授权

US06797146B2 Seed layer repair 失效
标题翻译：种子层修复
公开(公告)号：US06797146B2
公开(公告)日：2004-09-28
申请号：US10003151
申请日：2001-11-02
申请人： Denis Morrissey , Jeffrey M. Calvert , Robert D. Mikkola
发明人： Denis Morrissey , Jeffrey M. Calvert , Robert D. Mikkola
IPC分类号： C25D338
CPC分类号： H01L21/76868 , C25D3/38 , C25D5/52 , H01L21/288 , H01L21/76843 , H01L21/76873 , H01L2221/1089 , H05K3/24 , Y10T428/12493
摘要： Disclosed are methods for repairing seed layers prior to subsequent metallization during the manufacture of electronic devices. Also disclosed are electronic devices containing substantially continuous seed layers.
摘要翻译：公开了在电子设备的制造期间在随后的金属化之前修复种子层的方法。还公开了包含基本上连续的种子层的电子装置。

10. 发明授权

US06649038B2 Electroplating method 失效
公开(公告)号：US06649038B2
公开(公告)日：2003-11-18
申请号：US09977588
申请日：2001-10-13
申请人： Robert D. Mikkola , Jeffrey M. Calvert , Denis Morrissey
发明人： Robert D. Mikkola , Jeffrey M. Calvert , Denis Morrissey
IPC分类号： C25D1716
CPC分类号： H01L21/2885 , C25D3/38 , C25D7/12 , H05K3/241
摘要： Disclosed is a method of electroplating substrate such that small recessed features are completely filled with minimum thickness of the deposited metal over fields.

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