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1. 发明授权

US5178549A Shielded connector block 失效
标题翻译：屏蔽连接器块
公开(公告)号：US5178549A
公开(公告)日：1993-01-12
申请号：US722110
申请日：1991-06-27
申请人： Eugene F. Neumann , Melvin C. August , Daniel C. Mansur , Richard J. Kelley
发明人： Eugene F. Neumann , Melvin C. August , Daniel C. Mansur , Richard J. Kelley
IPC分类号： H01R12/50 , H01R12/52
CPC分类号： H01R23/688 , H01R12/523
摘要： A completely shielded metallic connector block for use in multiple circuit modules of an electronic device. Electrical communication between the circuit boards is effected by an array of metallic pins which run through the blocks. The metal of the blocks can be held at ground or at a constant potential to increase the shielding between pins as well as maintaining voltage and ground planes at constant levels throughout the modules. The blocks are insulated from the pins and circuit boards by a non-conductive coating. In the preferred embodiment, the metal of the blocks is aluminum and the coating is a hardcoat anodizing.
摘要翻译：一种完全屏蔽的金属连接器块，用于电子设备的多个电路模块。电路板之间的电气连接通过穿过块的金属引脚阵列来实现。块的金属可以保持在地或恒定的电位，以增加引脚之间的屏蔽，以及将电压和接地层保持在整个模块中的恒定水平。这些块通过非导电涂层与引脚和电路板绝缘。在优选实施例中，块的金属是铝，并且涂层是硬涂层阳极氧化。

2. 发明授权

US5224918A Method of manufacturing metal connector blocks 失效
标题翻译：制造金属连接器块的方法
公开(公告)号：US5224918A
公开(公告)日：1993-07-06
申请号：US963813
申请日：1992-10-20
申请人： Eugene F. Neumann , Melvin C. August , Daniel C. Mansur , Richard J. Kelley
发明人： Eugene F. Neumann , Melvin C. August , Daniel C. Mansur , Richard J. Kelley
IPC分类号： H01R12/50 , H01R12/52
CPC分类号： H01R23/688 , H01R12/523 , Y10T29/49126 , Y10T29/49224
摘要： A completely shielded metallic connector block for use in multiple circuit modules of an electronic device. Electrical communication between the circuit boards is effected by an array of metallic pins which run through the blocks. The metal of the blocks can be held at ground or at a constant potential to increase the shielding between pins as well as maintaining voltage and ground planes at constant levels throughout the modules. The blocks are insulated from the pins and circuit boards by a non-conductive coating. In the preferred embodiment, the metal of the blocks is aluminum and the coating is a hardcoat anodizing.
摘要翻译：一种完全屏蔽的金属连接器块，用于电子设备的多个电路模块。电路板之间的电气连接通过穿过块的金属引脚阵列来实现。块的金属可以保持在地或恒定的电位，以增加引脚之间的屏蔽，以及将电压和接地层保持在整个模块中的恒定水平。这些块通过非导电涂层与引脚和电路板绝缘。在优选实施例中，块的金属是铝，并且涂层是硬涂层阳极氧化。

3. 发明授权

US5400504A Method of manufacturing metallized connector block 失效
标题翻译：金属化连接器块的制造方法
公开(公告)号：US5400504A
公开(公告)日：1995-03-28
申请号：US62995
申请日：1993-05-17
申请人： Eugene F. Neumann , Melvin C. August , Daniel C. Mansur , Albert H. Wilson
发明人： Eugene F. Neumann , Melvin C. August , Daniel C. Mansur , Albert H. Wilson
IPC分类号： H01R43/16
CPC分类号： H01R12/523 , Y10S439/908 , Y10T29/49165 , Y10T29/4922
摘要： A completely shielded metallized connector block for use in multiple circuit modules of an electronic device. Electrical communication between the circuit boards is effected by an array of metallic pins which run through the blocks. The metallization on the nonconductive blocks can be held at ground or at a constant potential to increase the shielding between pins as well as maintaining voltage and ground planes at constant levels throughout the modules. The metallization is insulated from the pins and circuit boards by nonconductive bushings inserted in holes in the blocks. In one embodiment, the metallization consists of copper and solder plating and the blocks are constructed of liquid crystal polymer.
摘要翻译：一种完全屏蔽的金属化连接器块，用于电子设备的多个电路模块。电路板之间的电气连接通过穿过块的金属引脚阵列来实现。非导电块上的金属化可以保持在接地或恒定电位，以增加引脚之间的屏蔽，以及将电压和接地层保持在整个模块中的恒定水平。金属化通过插入块中的孔中的非导电衬套与销和电路板绝缘。在一个实施例中，金属化由铜和焊料镀层组成，并且块由液晶聚合物构成。

4. 发明授权

US4949453A Method of making a chip carrier with terminating resistive elements 失效
标题翻译：制造具有端接电阻元件的芯片载体的方法
公开(公告)号：US4949453A
公开(公告)日：1990-08-21
申请号：US366604
申请日：1989-06-15
申请人： Eugene F. Neumann , Melvin C. August , James N. Kruchowski , Stephen Nelson , Richard R. Steitz
发明人： Eugene F. Neumann , Melvin C. August , James N. Kruchowski , Stephen Nelson , Richard R. Steitz
IPC分类号： H01L23/498 , H01L23/538 , H01L23/64
CPC分类号： H01L23/5382 , H01L23/49838 , H01L23/647 , H01L24/50 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15787 , H01L2924/16152 , H01L2924/3011 , Y10T29/49099 , Y10T29/49155 , Y10T29/49156
摘要： A generic chip carrier is described which includes, as integral parts, a voltage bus and a plurality of terminating resistors connected between the voltage bus and signal traces on the carrier. The voltage bus wraps around the chip carrier, thus providing a large area of metal. Through the selective use of the terminating resistors, the generic carrier can be customized for a particular type of integrated circuit, i.e., source or destination termination of signals. A signal trace may be customized by "opening" the terminating resistor with a current spike applied by a standard electrical probe. Spare bonding pads and terminating resistors are placed at intervals about the periphery of the carrier as insurance against defective or mistakenly removed terminating resistors.
摘要翻译：描述了通用芯片载体，其包括连接在载波上的电压总线和信号迹线之间的电压总线和多个终端电阻的组成部分。电压总线缠绕在芯片载体上，从而提供大面积的金属。通过选择性地使用终端电阻器，可以为特定类型的集成电路定制通用载波，即信号的源或目的地终止。可以通过用标准电探针施加的电流尖峰“终止”端接电阻来定制信号迹线。备用接合焊盘和终端电阻器以围绕载体周边的间隔放置，作为对有缺陷或错误去除的终端电阻器的保险。

5. 发明授权

US5258576A Integrated circuit chip carrier lid 失效
标题翻译：集成电路芯片载体盖
公开(公告)号：US5258576A
公开(公告)日：1993-11-02
申请号：US816967
申请日：1992-01-03
申请人： Eugene F. Neumann , Melvin C. August , James N. Kruchowski , Stephen Nelson , Richard R. Steitz
发明人： Eugene F. Neumann , Melvin C. August , James N. Kruchowski , Stephen Nelson , Richard R. Steitz
IPC分类号： H01L23/498 , H01L23/538 , H01L23/64 , H01L23/02
CPC分类号： H01L23/647 , H01L23/49838 , H01L23/5382 , H01L24/50 , H01L2224/32225 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15787 , H01L2924/16152 , H01L2924/3011
摘要： A generic chip carrier is described which includes, as integral parts, a voltage bus and a plurality of terminating resistors connected between the voltage bus and signal traces on the carrier. The voltage bus wraps around the chip carrier, thus providing a large area of metal. Through the selective use of the terminating resistors, the generic carrier can be customized for a particular type of integrated circuit, i.e., source or destination termination of signals. A signal trace may be customized by "opening" the terminating resistor with a current spike applied by a standard electrical probe. Spare bonding pads and terminating resistors are placed at intervals about the periphery of the carrier as insurance against defective or mistakenly removed terminating resistors.
摘要翻译：描述了通用芯片载体，其包括连接在载波上的电压总线和信号迹线之间的电压总线和多个终端电阻的组成部分。电压总线缠绕在芯片载体上，从而提供大面积的金属。通过选择性地使用终端电阻器，可以为特定类型的集成电路定制通用载波，即信号的源或目的地终止。可以通过用标准电探针施加的电流尖峰“终止”端接电阻来定制信号迹线。备用接合焊盘和终端电阻器以围绕载体周边的间隔放置，作为对有缺陷或错误去除的终端电阻器的保险。

6. 再颁专利

USRE34395E Method of making a chip carrier with terminating resistive elements 失效
标题翻译：制造具有端接电阻元件的芯片载体的方法
公开(公告)号：USRE34395E
公开(公告)日：1993-10-05
申请号：US804958
申请日：1991-12-11
申请人： Eugene F. Neumann , Melvin C. August , James N. Kruchowski , Stephen Nelson , Richard R. Steitz
发明人： Eugene F. Neumann , Melvin C. August , James N. Kruchowski , Stephen Nelson , Richard R. Steitz
IPC分类号： H01L23/498 , H01L23/538 , H01L23/64 , H01C17/06
CPC分类号： H01L23/49838 , H01L23/498 , H01L23/5382 , H01L23/647 , H01L2924/15153 , H01L2924/1517 , H01L2924/16152 , Y10T29/49099 , Y10T29/49155 , Y10T29/49156
摘要： A generic chip carrier is described which includes, as integral parts, a voltage bus and a plurality of terminating resistors connected between the voltage bus and signal traces on the carrier. The voltage bus wraps around the chip carrier, thus providing a large area of metal. Through the selective use of the terminating resistors, the generic carrier can be customized for a particular type of integrated circuit, i.e., source or destination termination of signals. A signal trace may be customized by "opening" the terminating resistor with a current spike applied by a standard electrical probe. Spare bonding pads and terminating resistors are placed at intervals about the periphery of the carrier as insurance against defective or mistakenly removed terminating resistors.

7. 发明授权

US5123848A Computer signal interconnect apparatus 失效
标题翻译：计算机信号互连装置
公开(公告)号：US5123848A
公开(公告)日：1992-06-23
申请号：US556024
申请日：1990-07-20
申请人： Melvin C. August , Daniel Massopust , Mary Nebel , Eugene F. Neumann , Gregory Pautsch
发明人： Melvin C. August , Daniel Massopust , Mary Nebel , Eugene F. Neumann , Gregory Pautsch
IPC分类号： G06F13/40 , H01R13/33
CPC分类号： G06F13/409 , H01R12/523 , H01R13/33
摘要： An electrical backplane makes high density electrical connections with logic boards in a computer system. The electrical backplane is comprised of an assembly pressure connector and a connector interconnect board that connects the logic boards to external wiring. The assembly pressure connector has electrical contact bumps on its surfaces for making electrical connections with contact points on the surface of the logic boards. The assembly pressure connector prevents the permanent deformation of its electrical contact bumps by using resilient bumps. The resilient bumps are formed from the end portions of interconnecting wires extending through the assembly pressure connector. The interconnecting wires are bent in the shape of a leaf spring. Thus, the wires are compressed within the elastic range of their composing material and are not permanently deformed by the force applied to the assembly pressure connector.
摘要翻译：电气背板与计算机系统中的逻辑板进行高密度电连接。电背板由组装压力连接器和将逻辑板连接到外部接线的连接器互连板组成。组装压力连接器在其表面上具有电接触凸块，用于与逻辑板表面上的接触点进行电连接。组装压力连接器通过使用弹性凸块防止其电接触凸块的永久变形。弹性凸起由延伸穿过组件压力连接器的互连线的端部形成。互连线弯曲成板簧的形状。因此，电线在其组成材料的弹性范围内被压缩，并且不会由施加到组件压力连接器的力而永久变形。

8. 依法登记的发明

USH1153H Non-metallized chip carrier 失效
公开(公告)号：USH1153H
公开(公告)日：1993-03-02
申请号：US646834
申请日：1991-01-28
申请人： Melvin C. August , Diane M. Christie , Arthur J. Hebert , Eugene F. Neumann , Richard R. Steitz
发明人： Melvin C. August , Diane M. Christie , Arthur J. Hebert , Eugene F. Neumann , Richard R. Steitz
IPC分类号： H01L23/057 , H01L23/10 , H01L23/498
CPC分类号： H01L23/10 , H01L23/057 , H01L23/4985 , H01L2924/09701 , H01L2924/15153 , H01L2924/15165 , H01L2924/15173 , H01L2924/16152
摘要： A hermetically sealed carrier for integrated circuits has an IC placed on a carrier substrate, and an electrical lead apparatus, comprised of a highly heat resistant substrate with a metallized interconnect pattern deposited thereon, connected to the IC and brought out across and over the edges of the carrier substrate to facilitate electrical connection to a circuit board. A lid is provided which is placed over the IC. A low-melting temperature adhesive means is then placed on the lid-to-carrier interface and is exposed to heat hermetically sealing the IC. A hermetically sealed carrier including a single silicon die which includes both an active region where an integrated circuit may be fabricated and an inactive region is also provided. Electrical leads are electrically interconnected to the IC of the active region and extend to the periphery of the inactive region of the silicon die. A lid and adhesive means is provided for hermetically sealing the IC of the active region.

9. 发明授权

US4984993A Two-piece edge ZIF connector with sliding block 失效
标题翻译：带滑块的两片边缘ZIF连接器
公开(公告)号：US4984993A
公开(公告)日：1991-01-15
申请号：US351871
申请日：1989-05-12
申请人： Eugene F. Neumann , Melvin C. August , Stephen A. Bowen
发明人： Eugene F. Neumann , Melvin C. August , Stephen A. Bowen
IPC分类号： H01R12/89 , H01R13/193
CPC分类号： H01R12/89 , H01R13/193
摘要： An electrical end connector (10) of the zero insertion force type includes a pair of opposing blocks (21, 40), one of which blocks is slideably mounted in a housing (22). Opposite corresponding pairs of female receptacles (34) and male pins (31) are cooperatively mounted on the opposing blocks (21, 40). The housig (22) has two sets of oppositely disposed windows formed through the longitudinal ends. One block (40) has a channel formed therethrough, such that the block (40) is urged transversely upon insertion of a cam-like slider device (70), thereby selectively engaging or disengaging the male pins (31) and female receptacles (43).
摘要翻译：零插入力型的电端连接器（10）包括一对相对的块（21,40），其中一个块可滑动地安装在壳体（22）中。相对的相对的阴插座（34）和阳销（31）相对地配合安装在相对的块（21,40）上。椅子（22）具有通过纵向端部形成的两组相对设置的窗口。一个块（40）具有穿过其形成的通道，使得块（40）在插入凸轮状滑块装置（70）时被横向推动，从而选择性地接合或分离阳销（31）和阴插座（43））。

10. 发明授权

US4939624A Interconnected multiple circuit module 失效
标题翻译：互连多电路模块
公开(公告)号：US4939624A
公开(公告)日：1990-07-03
申请号：US284912
申请日：1988-12-14
申请人： Melvin C. August , Eugene F. Neumann , Stephen A. Bowen , John T. Williams
发明人： Melvin C. August , Eugene F. Neumann , Stephen A. Bowen , John T. Williams
IPC分类号： H01R12/52 , H05K9/00
CPC分类号： H01R12/523
摘要： An improved multiple circuit module for use in an electronic device includes a number of cold plates sandwiched between pairs of circuit boards for taking away excess heat from the circuit boards. Each plate is provided with open spaces which permit communication between the circuit boards, and with circuit boards on other cold plates. Electrical communication between the circuit boards is effected by an array of metallic pins. The pins are received in a perforate pin header which extends along the depth of the cold plate, and pins communicating with other circuit boards extend into a connector block which is placed between a pair of pin headers. Shielding is provided in both the connector blocks and pin headers to prevent electronic cross-talk between pins disposed therein. In one embodiment, a novel type of pin which reduces installation and disconnection friction is utilized.
摘要翻译：用于电子设备的改进的多电路模块包括夹在电路板对之间的多个冷板，用于从电路板上取走多余的热量。每个板都设有开放空间，允许电路板与其他冷板之间的电路板通信。电路板之间的电气连接是通过一排金属针来实现的。销被容纳在沿着冷板的深度延伸的穿孔针头中，并且与其他电路板连通的销延伸到连接器块中，该连接器块被放置在一对针头之间。在两个连接器块和针头中设置屏蔽，以防止在其中设置的引脚之间的电子串扰。在一个实施例中，利用了减少安装和断开摩擦的新型销。

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