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    • 2. 发明授权
    • Susceptor with backside area of constant emissivity
    • 受体具有不断发射率的背面积
    • US08226770B2
    • 2012-07-24
    • US11744760
    • 2007-05-04
    • Errol SanchezDavid K. CarlsonCraig Metzner
    • Errol SanchezDavid K. CarlsonCraig Metzner
    • C23C16/00C23F1/00H01L21/306
    • H01L21/68757C23C16/4581C23C16/481C23C16/52
    • Methods and apparatus for providing constant emissivity of the backside of susceptors are provided. Provided is a susceptor comprising: a susceptor plate having a surface for supporting a wafer and a backside surface opposite the wafer supporting surface; a layer comprising an oxide, a nitride, an oxynitride, or combinations thereof located on the backside surface of the susceptor plate, the layer being stable in the presence of a reactive process gas. The layer comprises, for example, silicon dioxide, silicon nitride, silicon oxynitride, or combinations thereof. Also provided is a method comprising: providing a susceptor in a deposition chamber, the susceptor comprising a susceptor plate and a layer comprising an oxide, a nitride, an oxynitride, or combinations thereof, the layer being stable in the presence of the reactive process gases; locating the wafer on a support surface of the susceptor plate. The method can further comprises selectively depositing an epitaxial layer or a non-epitaxial layer on a surface of the wafer. The method further comprises selectively etching to maintain the oxide, nitride, oxynitride, or combinations thereof layer.
    • 提供了用于提供感受器背面恒定发射率的方法和装置。 本发明提供一种基座,其特征在于,包括:具有用于支撑晶片的表面的基座板和与所述晶片支撑面相对的背面; 位于基座板的背面上的包含氧化物,氮化物,氧氮化物或其组合的层,该层在反应性工艺气体存在下是稳定的。 该层包括例如二氧化硅,氮化硅,氮氧化硅或其组合。 还提供了一种方法,其包括:在沉积室中提供感受器,所述基座包括基座板和包含氧化物,氮化物,氧氮化物或其组合的层,所述层在反应性工艺气体存在下是稳定的 ; 将晶片定位在基座板的支撑表面上。 该方法还可以包括在晶片的表面上选择性地沉积外延层或非外延层。 该方法还包括选择性蚀刻以维持氧化物,氮化物,氧氮化物或其组合层。
    • 3. 发明授权
    • Susceptor with backside area of constant emissivity
    • 受体具有不断发射率的背面积
    • US08524555B2
    • 2013-09-03
    • US13530238
    • 2012-06-22
    • Errol SanchezDavid K. CarlsonCraig Metzner
    • Errol SanchezDavid K. CarlsonCraig Metzner
    • H01L21/8238
    • H01L21/68757C23C16/4581C23C16/481C23C16/52
    • Methods and apparatus for providing constant emissivity of the backside of susceptors are described. Provided is a method comprising: providing a susceptor in a deposition chamber, the susceptor comprising a susceptor plate and a layer comprising an oxide, a nitride, an oxynitride, or combinations thereof, the layer being stable in the presence of the reactive process gases; and locating the wafer on a support surface of the susceptor plate. The method can further comprise selectively depositing an epitaxial layer or a non-epitaxial layer on a surface of the wafer. The method can also further comprise selectively etching to maintain the oxide, nitride, oxynitride, or combinations thereof layer.
    • 描述了用于提供感受器背面恒定发射率的方法和装置。 提供了一种方法,包括:在沉积室中提供感受器,所述基座包括基座板和包括氧化物,氮化物,氮氧化物或其组合的层,所述层在反应性工艺气体存在下是稳定的; 以及将所述晶片定位在所述基座板的支撑表面上。 该方法还可以包括在晶片的表面上选择性地沉积外延层或非外延层。 该方法还可以进一步包括选择性蚀刻以维持氧化物,氮化物,氧氮化物或其组合层。
    • 10. 发明授权
    • Methods for depositing germanium-containing layers
    • 沉积含锗层的方法
    • US08501600B2
    • 2013-08-06
    • US13189978
    • 2011-07-25
    • Errol SanchezYi-Chiau HuangDavid K. Carlson
    • Errol SanchezYi-Chiau HuangDavid K. Carlson
    • H01L21/00
    • H01L21/02381H01L21/0237H01L21/02529H01L21/02532H01L21/02535H01L21/02573H01L21/0262
    • Methods for depositing germanium-containing layers on silicon-containing layers are provided herein. In some embodiments, a method may include depositing a first layer atop an upper surface of the silicon-containing layer, wherein the first layer comprises predominantly germanium (Ge) and further comprises a lattice adjustment element having a concentration selected to enhance electrical activity of dopant elements, wherein the dopant elements are disposed in at least one of the first layer or in an optional second layer deposited atop of the first layer, wherein the optional second layer, if present, comprises predominantly germanium (Ge). In some embodiments, the second layer is deposited atop the first layer. In some embodiments, the second layer comprises germanium (Ge) and dopant elements.
    • 本文提供了在含硅层上沉积含锗层的方法。 在一些实施例中,一种方法可以包括沉积位于含硅层的上表面顶部的第一层,其中第一层主要包含锗(Ge),并且还包括具有选择以增强掺杂剂的电活性的浓度的晶格调节元件 元素,其中所述掺杂剂元素设置在所述第一层中的至少一个中或沉积在所述第一层顶部的任选的第二层中,其中所述任选的第二层(如果存在)主要包含锗(Ge)。 在一些实施例中,第二层沉积在第一层的顶部。 在一些实施例中,第二层包括锗(Ge)和掺杂元素。